SG11201901050SA - Method and device for aligning substrates - Google Patents

Method and device for aligning substrates

Info

Publication number
SG11201901050SA
SG11201901050SA SG11201901050SA SG11201901050SA SG11201901050SA SG 11201901050S A SG11201901050S A SG 11201901050SA SG 11201901050S A SG11201901050S A SG 11201901050SA SG 11201901050S A SG11201901050S A SG 11201901050SA SG 11201901050S A SG11201901050S A SG 11201901050SA
Authority
SG
Singapore
Prior art keywords
aligning substrates
aligning
substrates
substrate
regard
Prior art date
Application number
SG11201901050SA
Inventor
Thomas Wagenleitner
Dominik Zinner
Jürgen Markus Süss
Christian Sinn
Jürgen Mallinger
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201901050SA publication Critical patent/SG11201901050SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Method and device for aligning substrates The invention relates to a method for aligning and contacting a first substrate (16) with a second substrate (17) using a plurality of detection units and a corresponding device. In this regard, figure 1.
SG11201901050SA 2016-08-29 2016-08-29 Method and device for aligning substrates SG11201901050SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/070289 WO2018041326A1 (en) 2016-08-29 2016-08-29 Method and device for bonding substrates

Publications (1)

Publication Number Publication Date
SG11201901050SA true SG11201901050SA (en) 2019-03-28

Family

ID=57044904

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201901050SA SG11201901050SA (en) 2016-08-29 2016-08-29 Method and device for aligning substrates

Country Status (8)

Country Link
US (3) US10692747B2 (en)
EP (2) EP3504733B1 (en)
JP (1) JP6801085B2 (en)
KR (2) KR102221965B1 (en)
CN (2) CN109643674B (en)
SG (1) SG11201901050SA (en)
TW (2) TWI778973B (en)
WO (1) WO2018041326A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10692747B2 (en) * 2016-08-29 2020-06-23 Ev Group E. Thallner Gmbh Method and device for alignment of substrates
KR20190097065A (en) 2016-12-20 2019-08-20 에베 그룹 에. 탈너 게엠베하 Device and method for exposing a light-sensitive layer
US10852528B2 (en) 2016-12-20 2020-12-01 Ev Group E. Thallner Gmbh Method and device for exposure of photosensitive layer
US10073239B1 (en) * 2017-05-15 2018-09-11 Omnivision Technologies, Inc. Dual photodiode for phase detection autofocus
TWI661518B (en) * 2018-06-29 2019-06-01 欣興電子股份有限公司 Method for bonding electric element
CN113795906A (en) * 2019-05-08 2021-12-14 东京毅力科创株式会社 Joining device, joining system, and joining method
CN113826165A (en) * 2019-05-22 2021-12-21 维耶尔公司 Alignment procedure for transfer settings
CN114144868A (en) * 2019-08-23 2022-03-04 Ev 集团 E·索尔纳有限责任公司 Method and apparatus for aligning substrates
US11136202B2 (en) * 2020-01-06 2021-10-05 Asm Technology Singapore Pte Ltd Direct transfer apparatus for electronic components
EP4354495A2 (en) 2020-06-29 2024-04-17 EV Group E. Thallner GmbH Method and device for bonding substrates
KR102472252B1 (en) * 2020-12-28 2022-11-30 주식회사 테스 Pre-align device and pre-align method of Substrate bonding apparatus
TWI792785B (en) * 2020-12-31 2023-02-11 南韓商Ｔｅｓ股份有限公司 Substrate bonding apparatus and substrate bonding method
US11756921B2 (en) 2021-03-18 2023-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for bonding semiconductor devices
CN113594076B (en) * 2021-07-22 2023-06-20 上海精测半导体技术有限公司 Alignment method of patterned wafer and semiconductor device
WO2023110113A1 (en) * 2021-12-17 2023-06-22 Ev Group E. Thallner Gmbh Method and device for aligning a substrate
WO2023110114A1 (en) * 2021-12-17 2023-06-22 Ev Group E. Thallner Gmbh Device and method for adjusting a detection means
JP2023183276A (en) * 2022-06-15 2023-12-27 キオクシア株式会社 Bonding apparatus, bonding method, and manufacturing method of semiconductor device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT405775B (en) 1998-01-13 1999-11-25 Thallner Erich Method and apparatus for bringing together wafer-type (slice-type, disk-shaped) semiconductor substrates in an aligned manner
JP4626160B2 (en) * 2004-03-04 2011-02-02 株式会社ニコン Wafer overlay method and wafer overlay apparatus
JP4867373B2 (en) * 2006-02-02 2012-02-01 株式会社ニコン Wafer holder and semiconductor device manufacturing method
US7433038B2 (en) * 2006-04-27 2008-10-07 Asml Netherlands B.V. Alignment of substrates for bonding
CN101779270B (en) * 2007-08-10 2013-06-12 株式会社尼康 Substrate bonding apparatus and substrate bonding method
WO2010023935A1 (en) * 2008-08-29 2010-03-04 株式会社ニコン Substrate aligning apparatus, substrate aligning method and method for manufacturing multilayer semiconductor
WO2010038454A1 (en) 2008-10-01 2010-04-08 株式会社ニコン Alignment apparatus and alignment method
EP2299472B1 (en) * 2009-09-22 2020-07-08 EV Group E. Thallner GmbH Device for aligning two substrates
JP5672715B2 (en) 2010-02-19 2015-02-18 株式会社ニコン Superposition method
JP5454310B2 (en) * 2010-04-01 2014-03-26 株式会社ニコン Substrate bonding apparatus and substrate bonding method
KR101583894B1 (en) 2010-09-03 2016-01-08 에베 그룹 에. 탈너 게엠베하 Device and method for reducing a wedge error
EP2656378B1 (en) 2010-12-20 2015-03-18 Ev Group E. Thallner GmbH Accommodating device for retaining wafers
WO2014064944A1 (en) * 2012-10-26 2014-05-01 株式会社ニコン Substrate bonding apparatus, aligning apparatus, substrate bonding method, aligning method, and laminated semiconductor device manufacturing method
US10279575B2 (en) 2013-05-29 2019-05-07 Ev Group E. Thallner Gmbh Device and method for bonding substrates
JP6258479B2 (en) * 2013-06-17 2018-01-10 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Apparatus and method for aligning multiple substrates
JP6111943B2 (en) * 2013-09-11 2017-04-12 富士通セミコンダクター株式会社 Semiconductor device inspection apparatus and semiconductor device manufacturing method
KR101741384B1 (en) * 2013-12-06 2017-05-29 에베 그룹 에. 탈너 게엠베하 Device and method for aligning substrates
JP6353373B2 (en) * 2015-01-16 2018-07-04 東京エレクトロン株式会社 Joining apparatus, joining system, and joining method
US10692747B2 (en) * 2016-08-29 2020-06-23 Ev Group E. Thallner Gmbh Method and device for alignment of substrates

Also Published As

Publication number Publication date
EP3504733A1 (en) 2019-07-03
CN109643674A (en) 2019-04-16
EP3734650B1 (en) 2023-09-27
CN115719721A (en) 2023-02-28
US10943807B2 (en) 2021-03-09
TW201812975A (en) 2018-04-01
EP3734650A1 (en) 2020-11-04
TWI825958B (en) 2023-12-11
KR20210024662A (en) 2021-03-05
WO2018041326A1 (en) 2018-03-08
CN109643674B (en) 2023-01-10
US11488851B2 (en) 2022-11-01
KR102386005B1 (en) 2022-04-12
TWI778973B (en) 2022-10-01
KR20190042561A (en) 2019-04-24
JP6801085B2 (en) 2020-12-16
KR102221965B1 (en) 2021-03-03
EP3504733B1 (en) 2020-09-23
US20190198371A1 (en) 2019-06-27
US20200227299A1 (en) 2020-07-16
TW202310146A (en) 2023-03-01
JP2019530206A (en) 2019-10-17
US10692747B2 (en) 2020-06-23
US20210151339A1 (en) 2021-05-20

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