SG11201503355WA - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- SG11201503355WA SG11201503355WA SG11201503355WA SG11201503355WA SG11201503355WA SG 11201503355W A SG11201503355W A SG 11201503355WA SG 11201503355W A SG11201503355W A SG 11201503355WA SG 11201503355W A SG11201503355W A SG 11201503355WA SG 11201503355W A SG11201503355W A SG 11201503355WA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012262549 | 2012-11-30 | ||
PCT/JP2013/081164 WO2014084091A1 (ja) | 2012-11-30 | 2013-11-19 | 研磨組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201503355WA true SG11201503355WA (en) | 2015-06-29 |
Family
ID=50827734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201503355WA SG11201503355WA (en) | 2012-11-30 | 2013-11-19 | Polishing composition |
Country Status (9)
Country | Link |
---|---|
US (1) | US9593259B2 (ko) |
JP (1) | JP5732601B2 (ko) |
KR (1) | KR101594531B1 (ko) |
CN (1) | CN104798181B (ko) |
DE (1) | DE112013005718B4 (ko) |
MY (1) | MY154603A (ko) |
SG (1) | SG11201503355WA (ko) |
TW (1) | TWI561618B (ko) |
WO (1) | WO2014084091A1 (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY177867A (en) * | 2013-05-15 | 2020-09-23 | Basf Se | Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of n-vinyl-homopolymers and n-vinyl copolymers |
JP5857310B2 (ja) * | 2013-09-30 | 2016-02-10 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびその製造方法 |
JP6506913B2 (ja) * | 2014-03-31 | 2019-04-24 | ニッタ・ハース株式会社 | 研磨用組成物及び研磨方法 |
JP2016140828A (ja) * | 2015-02-02 | 2016-08-08 | 株式会社マキノ | 湿式粉砕システム及び湿式粉砕方法 |
SG10201602672UA (en) * | 2015-04-06 | 2016-11-29 | Cabot Microelectronics Corp | Cmp composition and method for polishing rigid disks |
WO2017057155A1 (ja) * | 2015-09-30 | 2017-04-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP6960336B2 (ja) * | 2015-10-23 | 2021-11-05 | ニッタ・デュポン株式会社 | 研磨用組成物 |
SG11201803362VA (en) * | 2015-10-23 | 2018-05-30 | Nitta Haas Inc | Polishing composition |
JP7061862B2 (ja) | 2016-10-28 | 2022-05-02 | 花王株式会社 | シリコンウェーハ用リンス剤組成物 |
WO2018079675A1 (ja) | 2016-10-28 | 2018-05-03 | 花王株式会社 | シリコンウェーハ用リンス剤組成物 |
JP6495230B2 (ja) | 2016-12-22 | 2019-04-03 | 花王株式会社 | シリコンウェーハ用リンス剤組成物 |
CN110997856B (zh) * | 2017-08-09 | 2021-10-29 | 昭和电工材料株式会社 | 研磨液和研磨方法 |
JP7133401B2 (ja) * | 2017-09-26 | 2022-09-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物の製造方法、研磨方法および半導体基板の製造方法 |
JP6978933B2 (ja) * | 2017-12-27 | 2021-12-08 | ニッタ・デュポン株式会社 | 研磨用組成物 |
JP7002354B2 (ja) * | 2018-01-29 | 2022-02-04 | ニッタ・デュポン株式会社 | 研磨用組成物 |
EP3792295A4 (en) * | 2018-05-11 | 2022-05-11 | Kuraray Co., Ltd. | POLYURETHANE MODIFICATION METHOD, POLYURETHANE, POLISHING PAD AND POLISHING PAD MODIFICATION METHOD |
JP7104174B2 (ja) * | 2018-11-09 | 2022-07-20 | 株式会社クラレ | 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法 |
JP7361467B2 (ja) * | 2018-12-25 | 2023-10-16 | ニッタ・デュポン株式会社 | 研磨用組成物 |
JP7414437B2 (ja) * | 2019-09-13 | 2024-01-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物の製造方法、研磨方法および半導体基板の製造方法 |
JP2021105145A (ja) * | 2019-12-27 | 2021-07-26 | ニッタ・デュポン株式会社 | 研磨用組成物及びシリコンウェーハの研磨方法 |
CN111662642B (zh) * | 2020-07-13 | 2021-07-23 | 万华化学集团电子材料有限公司 | 一种蓝宝石抛光组合物及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3303544B2 (ja) * | 1994-07-27 | 2002-07-22 | ソニー株式会社 | 半導体装置の製造方法および配線層表面研磨用のスラリーおよび配線層表面研磨用のスラリーの製造方法 |
JP4115562B2 (ja) | 1997-10-14 | 2008-07-09 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2008155368A (ja) * | 1999-06-23 | 2008-07-10 | Jsr Corp | 研磨用組成物、および研磨方法 |
ATE463838T1 (de) * | 2003-09-30 | 2010-04-15 | Fujimi Inc | Polierzusammensetzung und polierverfahren |
EP1780227B1 (en) * | 2004-08-18 | 2010-10-13 | The Nippon Synthetic Chemical Industry Co., Ltd. | Polyvinyl alcohol having 1,2-glycol bond in side chain and process for producing the same |
US20060135045A1 (en) | 2004-12-17 | 2006-06-22 | Jinru Bian | Polishing compositions for reducing erosion in semiconductor wafers |
US7560384B2 (en) * | 2005-02-23 | 2009-07-14 | Jsr Corporation | Chemical mechanical polishing method |
EP1813641B1 (en) * | 2006-01-30 | 2016-12-14 | Imec | A method for improving mechanical properties of polymer particles and its applications |
DE102007021002A1 (de) | 2007-05-04 | 2008-11-06 | Wacker Chemie Ag | Dispergierbare Nanopartikel |
EP2166028B1 (en) | 2007-07-10 | 2012-08-08 | The Nippon Synthetic Chemical Industry Co., Ltd. | Aqueous synthetic-resin emulsion for cement mortar admixture, re-emulsifiable powder for cement mortar admixture from aqueous synthetic-resin emulsion, and cement mortar admixture comprising the same |
JP2009088010A (ja) | 2007-09-27 | 2009-04-23 | Fujifilm Corp | 金属研磨用組成物、及び化学的機械的研磨方法 |
JP5585220B2 (ja) * | 2010-02-05 | 2014-09-10 | 日立化成株式会社 | Cmp研磨液及びこのcmp研磨液を用いた研磨方法 |
JP2012079717A (ja) * | 2010-09-30 | 2012-04-19 | Fujimi Inc | 研磨用組成物及びそれを用いた研磨方法 |
JP5721505B2 (ja) | 2011-04-01 | 2015-05-20 | ニッタ・ハース株式会社 | 研磨用組成物 |
-
2013
- 2013-11-19 CN CN201380061035.XA patent/CN104798181B/zh active Active
- 2013-11-19 DE DE112013005718.2T patent/DE112013005718B4/de active Active
- 2013-11-19 MY MYPI2015701431A patent/MY154603A/en unknown
- 2013-11-19 KR KR1020157013309A patent/KR101594531B1/ko active IP Right Grant
- 2013-11-19 WO PCT/JP2013/081164 patent/WO2014084091A1/ja active Application Filing
- 2013-11-19 US US14/440,688 patent/US9593259B2/en active Active
- 2013-11-19 SG SG11201503355WA patent/SG11201503355WA/en unknown
- 2013-11-19 JP JP2014550138A patent/JP5732601B2/ja active Active
- 2013-11-27 TW TW102143322A patent/TWI561618B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI561618B (en) | 2016-12-11 |
KR20150063600A (ko) | 2015-06-09 |
JPWO2014084091A1 (ja) | 2017-01-05 |
KR101594531B1 (ko) | 2016-02-16 |
DE112013005718T5 (de) | 2015-09-03 |
CN104798181B (zh) | 2016-08-24 |
DE112013005718B4 (de) | 2016-05-25 |
MY154603A (en) | 2015-07-01 |
WO2014084091A1 (ja) | 2014-06-05 |
TW201425559A (zh) | 2014-07-01 |
US9593259B2 (en) | 2017-03-14 |
JP5732601B2 (ja) | 2015-06-10 |
CN104798181A (zh) | 2015-07-22 |
US20150299517A1 (en) | 2015-10-22 |
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