SG10201802846XA - Polishing apparatus - Google Patents
Polishing apparatusInfo
- Publication number
- SG10201802846XA SG10201802846XA SG10201802846XA SG10201802846XA SG10201802846XA SG 10201802846X A SG10201802846X A SG 10201802846XA SG 10201802846X A SG10201802846X A SG 10201802846XA SG 10201802846X A SG10201802846X A SG 10201802846XA SG 10201802846X A SG10201802846X A SG 10201802846XA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing apparatus
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014100382A JP2015217445A (en) | 2014-05-14 | 2014-05-14 | Polishing device |
JP2014100381 | 2014-05-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201802846XA true SG10201802846XA (en) | 2018-05-30 |
Family
ID=54537740
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201503514TA SG10201503514TA (en) | 2014-05-14 | 2015-05-05 | Polishing apparatus |
SG10201802846XA SG10201802846XA (en) | 2014-05-14 | 2015-05-05 | Polishing apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201503514TA SG10201503514TA (en) | 2014-05-14 | 2015-05-05 | Polishing apparatus |
Country Status (5)
Country | Link |
---|---|
US (2) | US9833875B2 (en) |
KR (2) | KR102260613B1 (en) |
CN (1) | CN105081961B (en) |
SG (2) | SG10201503514TA (en) |
TW (1) | TWI656944B (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6216686B2 (en) * | 2014-05-30 | 2017-10-18 | 株式会社荏原製作所 | Polishing equipment |
KR102173323B1 (en) * | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | Carrier head, chemical mechanical polishing apparatus and wafer polishing method |
JP7108450B2 (en) * | 2018-04-13 | 2022-07-28 | 株式会社ディスコ | Polishing equipment |
JP7049984B2 (en) * | 2018-12-27 | 2022-04-07 | 株式会社荏原製作所 | How to control the tilt of the grinder and the stationary ring |
JP7178259B2 (en) * | 2018-12-27 | 2022-11-25 | 株式会社荏原製作所 | Polishing device and polishing method |
JP2020189366A (en) * | 2019-05-22 | 2020-11-26 | 株式会社荏原製作所 | Polishing device and polishing method |
USD954567S1 (en) * | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
KR20210006550A (en) | 2019-07-08 | 2021-01-19 | 삼성전자주식회사 | rotation body module and chemical mechanical polishing apparatus having the same |
JP7339811B2 (en) * | 2019-08-27 | 2023-09-06 | 株式会社荏原製作所 | Abnormality detection method and polishing device for roller that transmits local load to retainer ring |
CN111113201A (en) * | 2020-02-17 | 2020-05-08 | 中国工程物理研究院激光聚变研究中心 | Floating pressure clamping device and method for optical element quick polishing |
CN111975500B (en) * | 2020-08-19 | 2022-04-12 | 无锡起舟五金弹簧有限公司 | Spring end face grinding device |
US11623321B2 (en) * | 2020-10-14 | 2023-04-11 | Applied Materials, Inc. | Polishing head retaining ring tilting moment control |
US20230356355A1 (en) * | 2022-05-03 | 2023-11-09 | Applied Materials, Inc. | Polishing head with local inner ring downforce control |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2873314B2 (en) | 1989-03-30 | 1999-03-24 | 住友シチックス株式会社 | Method and apparatus for polishing semiconductor substrate |
JPH0569310A (en) | 1991-04-23 | 1993-03-23 | Mitsubishi Materials Corp | Device for grinding mirror surface of wafer |
DE69333322T2 (en) * | 1992-09-24 | 2004-09-30 | Ebara Corp. | polisher |
JPH06262514A (en) | 1993-03-17 | 1994-09-20 | Speedfam Co Ltd | Surface polishing device with vibration preventing device |
US5584746A (en) * | 1993-10-18 | 1996-12-17 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafers and apparatus therefor |
EP0878268B1 (en) * | 1994-05-23 | 2002-03-27 | Sumitomo Electric Industries, Ltd. | Polishing apparatus and method for hard material-coated wafer |
JP2982635B2 (en) * | 1994-12-20 | 1999-11-29 | 株式会社東京精密 | Wafer polishing method and apparatus |
JP3807807B2 (en) * | 1997-02-27 | 2006-08-09 | 株式会社荏原製作所 | Polishing device |
US6110025A (en) * | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
JP2000005988A (en) * | 1998-04-24 | 2000-01-11 | Ebara Corp | Polishing device |
US6354907B1 (en) * | 1999-03-11 | 2002-03-12 | Ebara Corporation | Polishing apparatus including attitude controller for turntable and/or wafer carrier |
US6705930B2 (en) | 2000-01-28 | 2004-03-16 | Lam Research Corporation | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
WO2001087541A2 (en) | 2000-05-12 | 2001-11-22 | Multi-Planar Technologies, Inc. | Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
US6540592B1 (en) * | 2000-06-29 | 2003-04-01 | Speedfam-Ipec Corporation | Carrier head with reduced moment wear ring |
JP3627143B2 (en) | 2000-10-23 | 2005-03-09 | 株式会社東京精密 | Wafer polishing equipment |
JP4814677B2 (en) * | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | Substrate holding device and polishing device |
JP5547472B2 (en) * | 2009-12-28 | 2014-07-16 | 株式会社荏原製作所 | Substrate polishing apparatus, substrate polishing method, and polishing pad surface temperature control apparatus for substrate polishing apparatus |
JP5831974B2 (en) * | 2011-11-08 | 2015-12-16 | Mipox株式会社 | Sheet glass having edge polished by polishing tape, and method and apparatus for polishing sheet glass edge |
US10702972B2 (en) * | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
JP5976522B2 (en) * | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
-
2015
- 2015-05-04 TW TW104114107A patent/TWI656944B/en active
- 2015-05-05 SG SG10201503514TA patent/SG10201503514TA/en unknown
- 2015-05-05 SG SG10201802846XA patent/SG10201802846XA/en unknown
- 2015-05-11 KR KR1020150065211A patent/KR102260613B1/en active IP Right Grant
- 2015-05-12 US US14/710,535 patent/US9833875B2/en active Active
- 2015-05-13 CN CN201510242162.0A patent/CN105081961B/en active Active
-
2017
- 2017-10-31 US US15/799,582 patent/US11059144B2/en active Active
-
2021
- 2021-05-28 KR KR1020210068780A patent/KR20210066775A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SG10201503514TA (en) | 2015-12-30 |
KR102260613B1 (en) | 2021-06-07 |
TW201600234A (en) | 2016-01-01 |
CN105081961B (en) | 2018-12-14 |
US9833875B2 (en) | 2017-12-05 |
US20150328743A1 (en) | 2015-11-19 |
US11059144B2 (en) | 2021-07-13 |
KR20210066775A (en) | 2021-06-07 |
TWI656944B (en) | 2019-04-21 |
KR20150130923A (en) | 2015-11-24 |
US20180065228A1 (en) | 2018-03-08 |
CN105081961A (en) | 2015-11-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB201406873D0 (en) | Cleaning apparatus | |
HK1225227A1 (en) | Apparatus | |
SG10201503514TA (en) | Polishing apparatus | |
SG10201502285YA (en) | Polishing apparatus | |
GB201416729D0 (en) | Apparatus | |
SG10201502030UA (en) | Substrate polishing apparatus | |
SG10201501193YA (en) | Polishing apparatus | |
SG10201604365YA (en) | Polishing apparatus | |
SG10201608734WA (en) | Polishing apparatus | |
SG10201701239TA (en) | Polishing apparatus | |
SG11201702302QA (en) | Polishing apparatus | |
SG10201504316QA (en) | Polishing Apparatus | |
SG10201503374QA (en) | Substrate Polishing Apparatus | |
SG11201700400UA (en) | Polishing apparatus | |
SG10201505284QA (en) | Polishing apparatus | |
GB201417753D0 (en) | Apparatus | |
GB2534660B8 (en) | Apparatus | |
GB2531031B (en) | Apparatus | |
SG10201607697VA (en) | Polishing apparatus | |
GB201602164D0 (en) | Polishing apparatus | |
SG11201800897PA (en) | Polishing apparatus | |
SG10201504229UA (en) | Polishing Apparatus | |
GB2532807B (en) | Apparatus | |
GB201402233D0 (en) | Apparatus | |
GB2519222B (en) | Apparatus |