USD954567S1 - Measurement jig - Google Patents

Measurement jig Download PDF

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Publication number
USD954567S1
USD954567S1 US29/718,063 US201929718063F USD954567S US D954567 S1 USD954567 S1 US D954567S1 US 201929718063 F US201929718063 F US 201929718063F US D954567 S USD954567 S US D954567S
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US
United States
Prior art keywords
measurement jig
view
measurement
jig
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/718,063
Inventor
Hiroyuki Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2019-13967F external-priority patent/JP1652444S/ja
Priority claimed from JPD2019-13966F external-priority patent/JP1652405S/ja
Priority claimed from JPD2019-13968F external-priority patent/JP1652445S/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHINOZUKA, HIROYUKI
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Publication of USD954567S1 publication Critical patent/USD954567S1/en
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Description

FIG. 1 is a first perspective view observed from top of a measurement jig showing our new design;
FIG. 2 is a first perspective view observed from bottom thereof;
FIG. 3 is a first top view thereof;
FIG. 4 is a first bottom view thereof;
FIG. 5 is a first front view thereof;
FIG. 6 is a first right side view thereof; and,
FIG. 7 is a first cross-section view taken along the line 7-7 of FIG. 3.

Claims (1)

    CLAIM
  1. I claim the ornamental design for a measurement jig, as shown and described.
US29/718,063 2019-06-25 2019-12-20 Measurement jig Active USD954567S1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2019-013967 2019-01-30
JPD2019-13967F JP1652444S (en) 2019-06-25 2019-06-25
JP2019-013966 2019-06-25
JPD2019-13966F JP1652405S (en) 2019-06-25 2019-06-25
JP2019-013968 2019-06-25
JPD2019-13968F JP1652445S (en) 2019-06-25 2019-06-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/836,924 Division USD1034248S1 (en) 2019-06-25 2022-04-29 Measurement jig

Publications (1)

Publication Number Publication Date
USD954567S1 true USD954567S1 (en) 2022-06-14

Family

ID=81926907

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/718,063 Active USD954567S1 (en) 2019-06-25 2019-12-20 Measurement jig

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US (1) USD954567S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD980177S1 (en) * 2020-09-24 2023-03-07 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1012873S1 (en) * 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
USD1034248S1 (en) * 2019-06-25 2024-07-09 Ebara Corporation Measurement jig

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080190902A1 (en) * 2007-02-13 2008-08-14 Disco Corporation Wafer dividing method and laser beam processing machine
US7655118B2 (en) * 2002-01-31 2010-02-02 Ebara Corporation Electrolytic processing apparatus and method
USD670469S1 (en) * 2011-06-22 2012-11-06 Robert Polk Pump spray sponge applicator
USD748508S1 (en) * 2015-01-29 2016-02-02 Golfzon Co., Ltd. Golf swing analyzer
USD753736S1 (en) * 2014-05-15 2016-04-12 Ebara Corporation Dresser disk
US20160148366A1 (en) * 2014-11-26 2016-05-26 Tokyo Electron Limited Measurement processing device, substrate processing system, measurement jig, measurement processing method, and storage medium
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD795315S1 (en) * 2014-12-12 2017-08-22 Ebara Corporation Dresser disk
US20170323774A1 (en) * 2016-05-09 2017-11-09 Disco Corporation Wafer processing apparatus
US9833875B2 (en) * 2014-05-14 2017-12-05 Ebara Corporation Polishing apparatus and retainer ring configuration
USD804923S1 (en) * 2016-03-25 2017-12-12 Buff And Shine Manufacturing, Inc. Buffing pad
USD822926S1 (en) * 2015-10-28 2018-07-10 Ebara Corporation Sponge for substrate cleaning
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US20190148132A1 (en) * 2017-11-14 2019-05-16 Disco Corporation Method of manufacturing small-diameter wafer
US20190273364A1 (en) * 2018-03-02 2019-09-05 Cisco Technology, Inc. Quantum dot lasers integrated on silicon submount with mechanical features and through-silicon vias
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US20200343095A1 (en) * 2019-04-25 2020-10-29 Disco Corporation Stacked wafer processing method
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
US11059137B2 (en) * 2018-02-06 2021-07-13 Ebara Corporation Tool set for use in position adjustment of positioning pins

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7655118B2 (en) * 2002-01-31 2010-02-02 Ebara Corporation Electrolytic processing apparatus and method
US20080190902A1 (en) * 2007-02-13 2008-08-14 Disco Corporation Wafer dividing method and laser beam processing machine
USD670469S1 (en) * 2011-06-22 2012-11-06 Robert Polk Pump spray sponge applicator
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9833875B2 (en) * 2014-05-14 2017-12-05 Ebara Corporation Polishing apparatus and retainer ring configuration
USD753736S1 (en) * 2014-05-15 2016-04-12 Ebara Corporation Dresser disk
US20160148366A1 (en) * 2014-11-26 2016-05-26 Tokyo Electron Limited Measurement processing device, substrate processing system, measurement jig, measurement processing method, and storage medium
USD795315S1 (en) * 2014-12-12 2017-08-22 Ebara Corporation Dresser disk
USD748508S1 (en) * 2015-01-29 2016-02-02 Golfzon Co., Ltd. Golf swing analyzer
USD822926S1 (en) * 2015-10-28 2018-07-10 Ebara Corporation Sponge for substrate cleaning
USD804923S1 (en) * 2016-03-25 2017-12-12 Buff And Shine Manufacturing, Inc. Buffing pad
US20170323774A1 (en) * 2016-05-09 2017-11-09 Disco Corporation Wafer processing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US20190148132A1 (en) * 2017-11-14 2019-05-16 Disco Corporation Method of manufacturing small-diameter wafer
US11059137B2 (en) * 2018-02-06 2021-07-13 Ebara Corporation Tool set for use in position adjustment of positioning pins
US20190273364A1 (en) * 2018-03-02 2019-09-05 Cisco Technology, Inc. Quantum dot lasers integrated on silicon submount with mechanical features and through-silicon vias
US20200343095A1 (en) * 2019-04-25 2020-10-29 Disco Corporation Stacked wafer processing method
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1034248S1 (en) * 2019-06-25 2024-07-09 Ebara Corporation Measurement jig
USD980177S1 (en) * 2020-09-24 2023-03-07 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD1012873S1 (en) * 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus

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