SG10201504316QA - Polishing Apparatus - Google Patents

Polishing Apparatus

Info

Publication number
SG10201504316QA
SG10201504316QA SG10201504316QA SG10201504316QA SG10201504316QA SG 10201504316Q A SG10201504316Q A SG 10201504316QA SG 10201504316Q A SG10201504316Q A SG 10201504316QA SG 10201504316Q A SG10201504316Q A SG 10201504316QA SG 10201504316Q A SG10201504316Q A SG 10201504316QA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG10201504316QA
Inventor
Shinozaki Hiroyuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201504316QA publication Critical patent/SG10201504316QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/02—Measuring coefficient of friction between materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10201504316QA 2014-06-03 2015-06-03 Polishing Apparatus SG10201504316QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014114672A JP6327958B2 (en) 2014-06-03 2014-06-03 Polishing equipment

Publications (1)

Publication Number Publication Date
SG10201504316QA true SG10201504316QA (en) 2016-01-28

Family

ID=54700713

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201504316QA SG10201504316QA (en) 2014-06-03 2015-06-03 Polishing Apparatus

Country Status (3)

Country Link
US (1) US9757838B2 (en)
JP (1) JP6327958B2 (en)
SG (1) SG10201504316QA (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201803908SA (en) * 2014-09-02 2018-06-28 Ebara Corp End point detection method, polishing apparatus, and polishing method
JP6775354B2 (en) 2015-10-16 2020-10-28 株式会社荏原製作所 Polishing equipment and polishing method
US10744617B2 (en) 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method
CN109842326B (en) * 2017-11-24 2020-12-01 南京德朔实业有限公司 Angle grinder and electric tool
JP7104512B2 (en) * 2017-12-18 2022-07-21 株式会社ディスコ Polishing device with holding table and holding table
CN109623541B (en) * 2018-10-16 2020-07-17 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） Solder ball removing equipment and method for BGA packaging device
CN109470635B (en) * 2018-12-17 2020-10-09 北京理工大学 Measuring system and method for friction ignition work doing of energetic material

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3115034A (en) * 1960-01-20 1963-12-24 Gen Motors Corp High speed dynamometer
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5445996A (en) * 1992-05-26 1995-08-29 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor device having a amorphous layer
JPH0970753A (en) * 1995-06-28 1997-03-18 Toshiba Corp Polishing method and polishing device
JPH10202523A (en) 1997-01-22 1998-08-04 Ebara Corp Polishing end point detecting method
JP2005244258A (en) * 1998-11-09 2005-09-08 Tokyo Seimitsu Co Ltd Wafer-polishing apparatus
US6213846B1 (en) * 1999-07-12 2001-04-10 International Business Machines Corporation Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2002126998A (en) * 2000-10-26 2002-05-08 Hitachi Ltd Polishing method and polishing device
US20020090889A1 (en) * 2001-01-10 2002-07-11 Crevasse Annette M. Apparatus and method of determining an endpoint during a chemical-mechanical polishing process
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
US6585562B2 (en) * 2001-05-17 2003-07-01 Nevmet Corporation Method and apparatus for polishing control with signal peak analysis
US6709314B2 (en) * 2001-11-07 2004-03-23 Applied Materials Inc. Chemical mechanical polishing endpoinat detection
US6741913B2 (en) * 2001-12-11 2004-05-25 International Business Machines Corporation Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
WO2005043132A1 (en) * 2003-10-31 2005-05-12 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
US7727049B2 (en) * 2003-10-31 2010-06-01 Applied Materials, Inc. Friction sensor for polishing system
US8065031B2 (en) * 2006-09-14 2011-11-22 Tokyo Seimitsu Co., Ltd Polishing end point detection method utilizing torque change and device thereof
US8152594B2 (en) * 2007-01-30 2012-04-10 Ebara Corporation Polishing apparatus
JP5336799B2 (en) * 2008-09-24 2013-11-06 東京エレクトロン株式会社 Chemical mechanical polishing apparatus, chemical mechanical polishing method and control program
JP5306065B2 (en) * 2009-06-04 2013-10-02 株式会社荏原製作所 Dressing apparatus and dressing method
US9862070B2 (en) * 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement

Also Published As

Publication number Publication date
US9757838B2 (en) 2017-09-12
JP6327958B2 (en) 2018-05-23
JP2015229196A (en) 2015-12-21
US20150343594A1 (en) 2015-12-03

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