SG10201502285YA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201502285YA
SG10201502285YA SG10201502285YA SG10201502285YA SG10201502285YA SG 10201502285Y A SG10201502285Y A SG 10201502285YA SG 10201502285Y A SG10201502285Y A SG 10201502285YA SG 10201502285Y A SG10201502285Y A SG 10201502285YA SG 10201502285Y A SG10201502285Y A SG 10201502285YA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG10201502285YA
Inventor
Ryuichi Kosuge
Hiroshi Sotozaki
Takahiro Kawano
Akihiro Mochida
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201502285YA publication Critical patent/SG10201502285YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10201502285YA 2014-03-27 2015-03-24 Polishing apparatus SG10201502285YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014066729A JP2015188955A (en) 2014-03-27 2014-03-27 Polishing device

Publications (1)

Publication Number Publication Date
SG10201502285YA true SG10201502285YA (en) 2015-10-29

Family

ID=54189044

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201502285YA SG10201502285YA (en) 2014-03-27 2015-03-24 Polishing apparatus

Country Status (3)

Country Link
US (1) US9434044B2 (en)
JP (1) JP2015188955A (en)
SG (1) SG10201502285YA (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10565701B2 (en) 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP7157521B2 (en) * 2016-03-15 2022-10-20 株式会社荏原製作所 Substrate polishing method, top ring and substrate polishing apparatus
JP6879747B2 (en) * 2017-01-16 2021-06-02 株式会社ディスコ Chuck table clogging detection method and processing equipment
US10541641B2 (en) 2017-10-30 2020-01-21 Solar Slate Solutions Solar panel mount systems and methods
US10601361B2 (en) 2017-10-30 2020-03-24 Solar Slate Solutions Solar panel mount with compression spacer systems and methods
JP6986930B2 (en) * 2017-11-07 2021-12-22 株式会社荏原製作所 Substrate polishing equipment and polishing method
SG11202008881QA (en) 2018-03-13 2020-10-29 Applied Materials Inc Consumable part monitoring in chemical mechanical polisher
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
DE112019006999T5 (en) * 2019-03-08 2021-12-09 Mitsubishi Electric Corporation INSPECTION PROCEDURE FOR ROTATING ELECTRIC MACHINE, ROTATING ELECTRIC MACHINE, AND INSPECTION SYSTEM FOR ROTATING ELECTRIC MACHINE
CN115151376B (en) * 2020-07-08 2024-05-24 应用材料公司 Multi-tooth magnetic control retaining ring
US20230390883A1 (en) * 2022-06-03 2023-12-07 Applied Materials, Inc. Acoustic monitoring of cmp retaining ring

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
KR0151102B1 (en) * 1996-02-28 1998-10-15 김광호 Chemical-mechanical grinding device and method thereof
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6077147A (en) * 1999-06-19 2000-06-20 United Microelectronics Corporation Chemical-mechanical polishing station with end-point monitoring device
US7314402B2 (en) * 2001-11-15 2008-01-01 Speedfam-Ipec Corporation Method and apparatus for controlling slurry distribution
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
JP2006231471A (en) * 2005-02-25 2006-09-07 Speedfam Co Ltd Double-sided polishing machine and its sizing controlling method
US7406394B2 (en) * 2005-08-22 2008-07-29 Applied Materials, Inc. Spectra based endpointing for chemical mechanical polishing
US7407433B2 (en) * 2005-11-03 2008-08-05 Applied Materials, Inc. Pad characterization tool
JP5006883B2 (en) * 2006-10-06 2012-08-22 株式会社荏原製作所 Processing end point detection method and processing apparatus
JP2009260142A (en) 2008-04-18 2009-11-05 Panasonic Corp Wafer-polishing apparatus and wafer-polishing method
JP5744382B2 (en) 2008-07-24 2015-07-08 株式会社荏原製作所 Substrate processing apparatus and substrate processing method
US20120021671A1 (en) 2010-07-26 2012-01-26 Applied Materials, Inc. Real-time monitoring of retaining ring thickness and lifetime
US20130102152A1 (en) * 2011-10-20 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
TWI639485B (en) * 2012-01-31 2018-11-01 日商荏原製作所股份有限公司 Substrate holding device, polishing device, and polishing method
JP6399873B2 (en) * 2014-09-17 2018-10-03 株式会社荏原製作所 Film thickness signal processing apparatus, polishing apparatus, film thickness signal processing method, and polishing method

Also Published As

Publication number Publication date
US9434044B2 (en) 2016-09-06
JP2015188955A (en) 2015-11-02
US20150273649A1 (en) 2015-10-01

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