SG10201510608PA - Conveying apparatus - Google Patents
Conveying apparatusInfo
- Publication number
- SG10201510608PA SG10201510608PA SG10201510608PA SG10201510608PA SG10201510608PA SG 10201510608P A SG10201510608P A SG 10201510608PA SG 10201510608P A SG10201510608P A SG 10201510608PA SG 10201510608P A SG10201510608P A SG 10201510608PA SG 10201510608P A SG10201510608P A SG 10201510608PA
- Authority
- SG
- Singapore
- Prior art keywords
- conveying apparatus
- conveying
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Workpieces (AREA)
- Dicing (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015004275A JP6468848B2 (ja) | 2015-01-13 | 2015-01-13 | 搬送装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201510608PA true SG10201510608PA (en) | 2016-08-30 |
Family
ID=56233416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201510608PA SG10201510608PA (en) | 2015-01-13 | 2015-12-23 | Conveying apparatus |
Country Status (8)
Country | Link |
---|---|
US (1) | US9455175B2 (ja) |
JP (1) | JP6468848B2 (ja) |
KR (1) | KR102279560B1 (ja) |
CN (1) | CN105789102B (ja) |
DE (1) | DE102016200272A1 (ja) |
MY (1) | MY181954A (ja) |
SG (1) | SG10201510608PA (ja) |
TW (1) | TWI676233B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6726591B2 (ja) * | 2016-09-30 | 2020-07-22 | 株式会社ディスコ | 加工装置 |
JP6853646B2 (ja) * | 2016-10-04 | 2021-03-31 | 株式会社ディスコ | ロボットハンド及び搬送ロボット |
TWI616973B (zh) * | 2017-01-23 | 2018-03-01 | 錫宬國際有限公司 | 伯努利末端執行器 |
CN110323171A (zh) * | 2018-03-30 | 2019-10-11 | 北京北方华创微电子装备有限公司 | 基片吸取装置及半导体加工设备 |
JP7134267B2 (ja) * | 2018-08-01 | 2022-09-09 | 北京北方華創微電子装備有限公司 | 基板を操作するための機器 |
WO2020024984A1 (zh) * | 2018-08-01 | 2020-02-06 | 北京北方华创微电子装备有限公司 | 非接触式衬底操作设备和外延反应器 |
JP7216613B2 (ja) * | 2019-05-16 | 2023-02-01 | 株式会社ディスコ | 加工装置 |
JP7353711B2 (ja) * | 2019-08-14 | 2023-10-02 | 株式会社ディスコ | ウェーハ搬送装置 |
CN114420623B (zh) * | 2022-03-31 | 2022-06-07 | 三河建华高科有限责任公司 | 一种适用于翘曲晶圆取放的机械手结构 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04282850A (ja) * | 1991-03-11 | 1992-10-07 | Sumitomo Metal Ind Ltd | 試料保持装置 |
JPH04341438A (ja) * | 1991-05-16 | 1992-11-27 | Toshiba Corp | 非接触ハンドリング装置 |
JPH07211766A (ja) | 1994-01-14 | 1995-08-11 | Disco Abrasive Syst Ltd | 中心合わせ装置 |
US6752584B2 (en) * | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
JP2004140058A (ja) * | 2002-10-16 | 2004-05-13 | Hitachi Electronics Eng Co Ltd | ウエハ搬送装置およびウエハ処理装置 |
JP4303041B2 (ja) | 2003-06-18 | 2009-07-29 | 株式会社ディスコ | 半導体ウエーハの加工装置 |
US7100954B2 (en) * | 2003-07-11 | 2006-09-05 | Nexx Systems, Inc. | Ultra-thin wafer handling system |
JP3999723B2 (ja) * | 2003-10-08 | 2007-10-31 | 川崎重工業株式会社 | 基板保持装置 |
JP2005191464A (ja) * | 2003-12-26 | 2005-07-14 | Harmotec Corp | アライメント機構およびウェハ搬送ハンド |
JP2005311306A (ja) * | 2004-03-25 | 2005-11-04 | Tokyo Electron Ltd | 縦型熱処理装置及び被処理体移載方法 |
JP5291281B2 (ja) * | 2004-06-28 | 2013-09-18 | 株式会社渡辺商行 | 浮上搬送装置及び浮上搬送方法 |
KR101037087B1 (ko) * | 2004-06-29 | 2011-05-26 | 엘지디스플레이 주식회사 | 엠엠지용 기판 생산장비 |
JP2006156692A (ja) * | 2004-11-29 | 2006-06-15 | Smc Corp | 非接触搬送装置 |
JP4440178B2 (ja) * | 2005-07-25 | 2010-03-24 | 東京エレクトロン株式会社 | 基板の搬送装置 |
JP4607910B2 (ja) * | 2007-01-16 | 2011-01-05 | 東京エレクトロン株式会社 | 基板搬送装置及び縦型熱処理装置 |
US8231157B2 (en) * | 2008-08-28 | 2012-07-31 | Corning Incorporated | Non-contact manipulating devices and methods |
KR20110136807A (ko) * | 2009-03-11 | 2011-12-21 | 파나소닉 주식회사 | 기판 반송 처리 시스템 및 기판 반송 처리 방법, 및 부품 실장 장치 및 방법 |
JP2010258129A (ja) * | 2009-04-23 | 2010-11-11 | Seiko Epson Corp | 吸引保持装置、吸引保持方法、搬送装置、及び搬送方法 |
JP2010278408A (ja) * | 2009-04-30 | 2010-12-09 | Fluoro Mechanic Kk | ベルヌーイチャック |
JP5603314B2 (ja) * | 2011-12-01 | 2014-10-08 | 東京エレクトロン株式会社 | 搬送装置及び基板処理システム |
CN103904010B (zh) * | 2014-03-20 | 2017-01-04 | 上海华力微电子有限公司 | 一种晶圆传送装置 |
-
2015
- 2015-01-13 JP JP2015004275A patent/JP6468848B2/ja active Active
- 2015-12-02 TW TW104140324A patent/TWI676233B/zh active
- 2015-12-21 MY MYPI2015704692A patent/MY181954A/en unknown
- 2015-12-23 SG SG10201510608PA patent/SG10201510608PA/en unknown
- 2015-12-24 CN CN201510982872.7A patent/CN105789102B/zh active Active
-
2016
- 2016-01-12 KR KR1020160003662A patent/KR102279560B1/ko active IP Right Grant
- 2016-01-12 US US14/993,359 patent/US9455175B2/en active Active
- 2016-01-13 DE DE102016200272.4A patent/DE102016200272A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
JP6468848B2 (ja) | 2019-02-13 |
JP2016131188A (ja) | 2016-07-21 |
US20160204018A1 (en) | 2016-07-14 |
CN105789102A (zh) | 2016-07-20 |
MY181954A (en) | 2021-01-15 |
KR102279560B1 (ko) | 2021-07-19 |
KR20160087350A (ko) | 2016-07-21 |
CN105789102B (zh) | 2020-11-24 |
TWI676233B (zh) | 2019-11-01 |
DE102016200272A1 (de) | 2016-07-14 |
TW201633440A (zh) | 2016-09-16 |
US9455175B2 (en) | 2016-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1244063A1 (zh) | 自拍設備 | |
GB201515274D0 (en) | Apparatus | |
PL3072835T3 (pl) | Sposób transportu | |
GB201611931D0 (en) | Fit-checking apparatus | |
PL3169615T3 (pl) | Pneumatyczne przenoszące urządzenie | |
PL3418223T3 (pl) | Aparat przenośnikowy | |
HUE057676T2 (hu) | Szállítóberendezés | |
SG10201510608PA (en) | Conveying apparatus | |
ZA201705560B (en) | Apparatus | |
SG10201504537YA (en) | Processing apparatus | |
SG10201505187TA (en) | Processing apparatus | |
GB201522732D0 (en) | Apparatus | |
SG10201603207YA (en) | Processing apparatus | |
ZA201808429B (en) | Conveyor apparatus | |
GB201609190D0 (en) | Apparatus | |
GB201708511D0 (en) | Conveyor apparatus | |
GB201610528D0 (en) | Apparatus | |
GB201610010D0 (en) | Refridgeration apparatus | |
GB201418054D0 (en) | Conveying apparatus | |
GB201517176D0 (en) | An apparatus | |
GB201505900D0 (en) | Apparatus | |
GB201502321D0 (en) | Apparatus | |
GB201501570D0 (en) | Apparatus | |
GB2541397B (en) | Feeding apparatus | |
SG10201510777TA (en) | Mask-cleaning apparatus |