SG10201508090WA - Polishing pad with foundation layer and polishing surface layer - Google Patents
Polishing pad with foundation layer and polishing surface layerInfo
- Publication number
- SG10201508090WA SG10201508090WA SG10201508090WA SG10201508090WA SG10201508090WA SG 10201508090W A SG10201508090W A SG 10201508090WA SG 10201508090W A SG10201508090W A SG 10201508090WA SG 10201508090W A SG10201508090W A SG 10201508090WA SG 10201508090W A SG10201508090W A SG 10201508090WA
- Authority
- SG
- Singapore
- Prior art keywords
- layer
- polishing
- surface layer
- foundation
- polishing pad
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 239000010410 layer Substances 0.000 title 1
- 239000002344 surface layer Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/306,849 US9067298B2 (en) | 2011-11-29 | 2011-11-29 | Polishing pad with grooved foundation layer and polishing surface layer |
US13/306,845 US9067297B2 (en) | 2011-11-29 | 2011-11-29 | Polishing pad with foundation layer and polishing surface layer |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201508090WA true SG10201508090WA (en) | 2015-10-29 |
Family
ID=46147791
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201508090WA SG10201508090WA (en) | 2011-11-29 | 2012-05-16 | Polishing pad with foundation layer and polishing surface layer |
SG11201402224WA SG11201402224WA (en) | 2011-11-29 | 2012-05-16 | Polishing pad with foundation layer and polishing surface layer |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201402224WA SG11201402224WA (en) | 2011-11-29 | 2012-05-16 | Polishing pad with foundation layer and polishing surface layer |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2785496B1 (en) |
JP (3) | JP6309453B2 (en) |
KR (3) | KR101819539B1 (en) |
CN (2) | CN105773400B (en) |
SG (2) | SG10201508090WA (en) |
TW (2) | TWI513545B (en) |
WO (1) | WO2013081665A2 (en) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
KR102350350B1 (en) | 2014-04-03 | 2022-01-14 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Polishing pads and systems and methods of making and using the same |
JP6295807B2 (en) * | 2014-04-28 | 2018-03-20 | 株式会社リコー | Polishing tool and polishing apparatus |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
CN113579992A (en) * | 2014-10-17 | 2021-11-02 | 应用材料公司 | CMP pad construction with composite material properties using additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
CN104827386B (en) * | 2015-05-25 | 2018-10-12 | 蓝思科技股份有限公司 | One kind being used for sapphire mirror finish bistrique |
US10092998B2 (en) * | 2015-06-26 | 2018-10-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making composite polishing layer for chemical mechanical polishing pad |
US10144115B2 (en) * | 2015-06-26 | 2018-12-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making polishing layer for chemical mechanical polishing pad |
CN205703794U (en) * | 2015-06-29 | 2016-11-23 | 智胜科技股份有限公司 | Polishing layer of polishing pad |
EP3328584A4 (en) * | 2015-07-30 | 2019-03-27 | JH Rhodes Company, Inc. | Polymeric lapping materials, media and systems including polymeric lapping material, and methods of forming and using same |
JP6584895B2 (en) * | 2015-09-30 | 2019-10-02 | 富士紡ホールディングス株式会社 | Polishing pad |
TWI695752B (en) * | 2015-10-16 | 2020-06-11 | 美商應用材料股份有限公司 | Formulations used to form advanced polishing pads using an additive manufacturing process |
US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
CN105500183B (en) * | 2015-11-26 | 2018-08-10 | 上海集成电路研发中心有限公司 | A kind of grinding pad and its service life detection method |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
KR20180113974A (en) * | 2016-02-26 | 2018-10-17 | 가부시키가이샤 후지미인코퍼레이티드 | Polishing method, polishing pad |
JP2017177265A (en) * | 2016-03-29 | 2017-10-05 | 株式会社フジミインコーポレーテッド | Abrasive pad |
TWI629297B (en) * | 2016-07-05 | 2018-07-11 | 智勝科技股份有限公司 | Polishing layer and method of forming the same and polishing method |
SG11201906131WA (en) * | 2017-01-20 | 2019-08-27 | Applied Materials Inc | A thin plastic polishing article for cmp applications |
KR101884238B1 (en) * | 2017-01-20 | 2018-08-02 | 에스케이하이닉스 주식회사 | Polishing System And Method of Planarization Using the Same |
KR101916119B1 (en) * | 2017-02-06 | 2019-01-30 | 주식회사 리온에스엠아이 | Polishing pad for chemical mechanical polishing |
WO2018181347A1 (en) * | 2017-03-31 | 2018-10-04 | 古河電気工業株式会社 | Polishing pad |
CN111032285B (en) * | 2017-08-25 | 2022-07-19 | 3M创新有限公司 | Polishing pad with surface protrusions |
US11685013B2 (en) | 2018-01-24 | 2023-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad for chemical mechanical planarization |
JP6564106B2 (en) * | 2018-04-23 | 2019-08-21 | 株式会社三共 | Game machine |
JP7026942B2 (en) * | 2018-04-26 | 2022-03-01 | 丸石産業株式会社 | Underlay for polishing pad and polishing method using the underlay |
CN108972381A (en) * | 2018-07-26 | 2018-12-11 | 成都时代立夫科技有限公司 | A kind of CMP pad edge sealing process |
CN109015435A (en) * | 2018-09-10 | 2018-12-18 | 台山市远鹏研磨科技有限公司 | A kind of diamond tower sand paper |
CN109434568A (en) * | 2018-10-23 | 2019-03-08 | 青岛韬谱光学科技有限公司 | A kind of optical device polishing method of the high high roughness of face type |
CN109571302B (en) * | 2018-11-21 | 2021-08-03 | 华侨大学 | Characterization method of semi-fixed abrasive polishing tool interface bonding strength based on tensile strength |
WO2020242172A1 (en) * | 2019-05-29 | 2020-12-03 | 한국생산기술연구원 | Chemical mechanical polishing pad having pattern structure |
US20210299816A1 (en) * | 2020-03-25 | 2021-09-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp polishing pad with protruding structures having engineered open void space |
CN114701105B (en) * | 2021-04-27 | 2024-04-19 | 宁波赢伟泰科新材料有限公司 | Chemical mechanical polishing pad and preparation method thereof |
CN113334243B (en) * | 2021-06-03 | 2023-03-31 | 万华化学集团电子材料有限公司 | Chemical mechanical polishing pad, preparation method and application thereof |
KR102508565B1 (en) * | 2021-07-01 | 2023-03-10 | 에스씨엠티 주식회사 | Double-layered Polishing Pad for Planarization Process and Manufacturing Method Thereof |
JP7441916B2 (en) * | 2021-10-12 | 2024-03-01 | エスケー エンパルス カンパニー リミテッド | Polishing pad and method for manufacturing semiconductor devices using the same |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5373067A (en) * | 1976-12-13 | 1978-06-29 | Nippon Telegr & Teleph Corp <Ntt> | Polisher |
JPS61187657U (en) * | 1985-05-17 | 1986-11-22 | ||
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5247765A (en) * | 1991-07-23 | 1993-09-28 | Abrasive Technology Europe, S.A. | Abrasive product comprising a plurality of discrete composite abrasive pellets in a resilient resin matrix |
US6099394A (en) * | 1998-02-10 | 2000-08-08 | Rodel Holdings, Inc. | Polishing system having a multi-phase polishing substrate and methods relating thereto |
US5609517A (en) * | 1995-11-20 | 1997-03-11 | International Business Machines Corporation | Composite polishing pad |
US5624303A (en) * | 1996-01-22 | 1997-04-29 | Micron Technology, Inc. | Polishing pad and a method for making a polishing pad with covalently bonded particles |
US6183346B1 (en) * | 1998-08-05 | 2001-02-06 | 3M Innovative Properties Company | Abrasive article with embossed isolation layer and methods of making and using |
JP2000061817A (en) * | 1998-08-24 | 2000-02-29 | Nikon Corp | Polishing pad |
JP2000173957A (en) * | 1998-12-04 | 2000-06-23 | Tadahiro Omi | Semiconductor wafer polishing pad, its reclaiming method, and polishing method using the same |
CN1137013C (en) * | 1999-01-21 | 2004-02-04 | 罗德尔控股公司 | Improved polishing pads and methods relating thereto |
WO2001043920A1 (en) * | 1999-12-14 | 2001-06-21 | Rodel Holdings, Inc. | Method of manufacturing a polymer or polymer composite polishing pad |
US6736709B1 (en) * | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
US6454634B1 (en) * | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
US7097549B2 (en) * | 2001-12-20 | 2006-08-29 | Ppg Industries Ohio, Inc. | Polishing pad |
JP2005066749A (en) * | 2003-08-25 | 2005-03-17 | Sumitomo Bakelite Co Ltd | Laminated element for polishing, and polishing method |
AU2003284655A1 (en) * | 2002-11-25 | 2004-07-09 | Sumitomo Bakelite Company Limited | Method for producing closed cell cellular material for use in polishing, cellular sheet for polishing, laminate for polishing and polishing method, method for producing laminate for polishing, and grooved polishing pad |
JP2004243428A (en) * | 2003-02-12 | 2004-09-02 | Rodel Nitta Co | Polishing pad |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
TWI385050B (en) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
JP4884726B2 (en) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | Manufacturing method of laminated polishing pad |
KR100646488B1 (en) * | 2005-12-07 | 2006-11-15 | 동부일렉트로닉스 주식회사 | Polishing pad manufacturing method for chemicalmechanical polish |
US20070212979A1 (en) * | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Composite polishing pad |
US7235114B1 (en) * | 2006-03-16 | 2007-06-26 | 3M Innovative Properties Company | Flexible abrasive article |
JP2007268658A (en) * | 2006-03-31 | 2007-10-18 | Tmp Co Ltd | Polishing sheet and polishing method |
US20070243798A1 (en) | 2006-04-18 | 2007-10-18 | 3M Innovative Properties Company | Embossed structured abrasive article and method of making and using the same |
JP5013447B2 (en) * | 2006-06-22 | 2012-08-29 | 東洋ゴム工業株式会社 | Polishing pad and manufacturing method thereof |
JP5234916B2 (en) * | 2007-01-30 | 2013-07-10 | 東レ株式会社 | Laminated polishing pad |
JP5371251B2 (en) * | 2007-01-30 | 2013-12-18 | 東レ株式会社 | Polishing pad |
JP5078527B2 (en) * | 2007-09-28 | 2012-11-21 | 富士紡ホールディングス株式会社 | Polishing cloth |
JP5274123B2 (en) * | 2008-06-27 | 2013-08-28 | 富士紡ホールディングス株式会社 | Polishing pad and manufacturing method thereof |
EP2444433A4 (en) * | 2009-06-18 | 2014-06-11 | Jsr Corp | Polyurethane, composition for formation of polishing layers that contains same, pad for chemical mechanical polishing, and chemical mechanical polishing method using same |
JP3158224U (en) * | 2009-10-20 | 2010-03-25 | 勝男 松澤 | Polishing cloth |
US20130012108A1 (en) * | 2009-12-22 | 2013-01-10 | Naichao Li | Polishing pad and method of making the same |
CN101905448B (en) * | 2010-06-23 | 2013-05-22 | 清华大学 | Polishing pad for chemical mechanical planarization and manufacturing method thereof |
US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
-
2012
- 2012-05-16 JP JP2014543467A patent/JP6309453B2/en active Active
- 2012-05-16 SG SG10201508090WA patent/SG10201508090WA/en unknown
- 2012-05-16 CN CN201610217648.3A patent/CN105773400B/en active Active
- 2012-05-16 EP EP12723064.7A patent/EP2785496B1/en active Active
- 2012-05-16 WO PCT/US2012/038211 patent/WO2013081665A2/en unknown
- 2012-05-16 KR KR1020157023009A patent/KR101819539B1/en active IP Right Grant
- 2012-05-16 CN CN201280058372.9A patent/CN104105575B/en active Active
- 2012-05-16 KR KR1020147017782A patent/KR101685678B1/en active IP Right Grant
- 2012-05-16 KR KR1020167021338A patent/KR101825734B1/en active IP Right Grant
- 2012-05-16 SG SG11201402224WA patent/SG11201402224WA/en unknown
- 2012-05-22 TW TW101118246A patent/TWI513545B/en active
- 2012-05-22 TW TW104119891A patent/TWI608898B/en active
-
2016
- 2016-02-01 JP JP2016017082A patent/JP6200530B2/en active Active
-
2018
- 2018-01-31 JP JP2018014875A patent/JP6805191B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20140097486A (en) | 2014-08-06 |
SG11201402224WA (en) | 2014-09-26 |
CN105773400A (en) | 2016-07-20 |
KR20150103327A (en) | 2015-09-09 |
TWI608898B (en) | 2017-12-21 |
EP2785496B1 (en) | 2021-11-24 |
KR101825734B1 (en) | 2018-02-05 |
EP2785496A2 (en) | 2014-10-08 |
KR101819539B1 (en) | 2018-01-17 |
TWI513545B (en) | 2015-12-21 |
JP2015503232A (en) | 2015-01-29 |
KR20160098520A (en) | 2016-08-18 |
CN104105575A (en) | 2014-10-15 |
JP6200530B2 (en) | 2017-09-20 |
JP6309453B2 (en) | 2018-04-11 |
WO2013081665A2 (en) | 2013-06-06 |
KR101685678B1 (en) | 2016-12-12 |
CN104105575B (en) | 2017-11-14 |
JP2018082213A (en) | 2018-05-24 |
CN105773400B (en) | 2019-10-25 |
TW201534429A (en) | 2015-09-16 |
TW201321131A (en) | 2013-06-01 |
JP2016104511A (en) | 2016-06-09 |
JP6805191B2 (en) | 2020-12-23 |
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