SG11201906131WA - A thin plastic polishing article for cmp applications - Google Patents
A thin plastic polishing article for cmp applicationsInfo
- Publication number
- SG11201906131WA SG11201906131WA SG11201906131WA SG11201906131WA SG11201906131WA SG 11201906131W A SG11201906131W A SG 11201906131WA SG 11201906131W A SG11201906131W A SG 11201906131WA SG 11201906131W A SG11201906131W A SG 11201906131WA SG 11201906131W A SG11201906131W A SG 11201906131WA
- Authority
- SG
- Singapore
- Prior art keywords
- california
- polishing
- international
- polishing article
- features
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 12
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 230000003750 conditioning effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000008520 organization Effects 0.000 abstract 1
- 239000002023 wood Substances 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/008—Finishing manufactured abrasive sheets, e.g. cutting, deforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/005—Making abrasive webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/22—Rubbers synthetic or natural
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
456 Z 466 r Z 476 / A 414 462 464 FIG. 4A 410 452 450 454 420 460 472 470 474 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT IiiimmoimiolollmonolomoilimoilimommovoimIE (10) International Publication Number WO 2018/136694 Al (51) International Patent Classification: B24B 21/06 (2006.01) B24B 37/26 (2012.01) B24B 21/12 (2006.01) B24D 11/00 (2006.01) B24B 37/12 (2012.01) (21) International Application Number: PCT/US2018/014344 (22) International Filing Date: 19 January 2018 (19.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/448,747 20 January 2017 (20.01.2017) US 62/555,605 07 September 2017 (07.09.2017) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: TOLLES, Robert D.; 536 Losse Ct., San Jose, California 95110 (US). MENK, Gregory E.; 1833 Green- wood Road, Pleasanton, California 94566 (US). DAVEY, Eric; 248 Pamela Dr., Apt #35, Mountain View, Califor- nia 94040 (US). WANG, You; 22653 Queens Oak Court, Cupertino, California 95014 (US). TRAN, Huyen Karen; 73 S. 17th St., San Jose, California 95112 (US). RE- DEKER, Fred C.; 1801 Sioux Drive, Fremont, California 94536 (US). KAKIREDDY, Veera Raghava Reddy; 1620 Hope Dr., Apt.# 526, Santa Clara, California 95054 (US). MIKHAYLICHENKO, Ekaterina; 1818 Fumia Place, San Jose, California 95131 (US). GURUSAMY, Jay; 4058 Rivermark Parkway, Santa Clara, California 95054 (US). (54) Title: A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS 400 FIG 4E 449 j 447 448 I 412 (57) : A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or \"micro-features\" and/or a plurality of grooves or \"macro-features\" formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing. [Continued on next page] WO 2018/136694 Al MIDEDIMOMOIDEIREEMOMMIMEDIEHOHMEHOIS (74) Agent: PATTERSON, B. Todd et al.; Patterson & Sheri- dan, L.L.P., 24 Greenway Plaza, Suite 1600, Houston, Texas 77046 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762448747P | 2017-01-20 | 2017-01-20 | |
US201762555605P | 2017-09-07 | 2017-09-07 | |
PCT/US2018/014344 WO2018136694A1 (en) | 2017-01-20 | 2018-01-19 | A thin plastic polishing article for cmp applications |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201906131WA true SG11201906131WA (en) | 2019-08-27 |
Family
ID=62905886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201906131WA SG11201906131WA (en) | 2017-01-20 | 2018-01-19 | A thin plastic polishing article for cmp applications |
Country Status (8)
Country | Link |
---|---|
US (1) | US10786885B2 (en) |
EP (1) | EP3571009A4 (en) |
JP (1) | JP7227137B2 (en) |
KR (1) | KR102329099B1 (en) |
CN (2) | CN108326730B (en) |
SG (1) | SG11201906131WA (en) |
TW (2) | TWI757410B (en) |
WO (1) | WO2018136694A1 (en) |
Families Citing this family (16)
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TWI757410B (en) * | 2017-01-20 | 2022-03-11 | 美商應用材料股份有限公司 | A thin plastic polishing article for cmp applications |
US10792783B2 (en) * | 2017-11-27 | 2020-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | System, control method and apparatus for chemical mechanical polishing |
US10464188B1 (en) * | 2018-11-06 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad and polishing method |
WO2020176460A1 (en) * | 2019-02-28 | 2020-09-03 | Applied Materials, Inc. | Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer |
CN110524412B (en) * | 2019-09-30 | 2024-07-12 | 清华大学 | Chemical mechanical polishing retaining ring and chemical mechanical polishing bearing head |
KR102270392B1 (en) * | 2019-10-01 | 2021-06-30 | 에스케이실트론 주식회사 | Wafer polishing head, method of manufacturing waper polishing head and wafer polishing Apparatus having the same |
KR102237326B1 (en) * | 2020-06-19 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | Polishing pad, preparation method thereof and preparation method of semiconductor device using same |
KR102237321B1 (en) * | 2020-06-19 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | Polishing pad, preparation method thereof and preparation method of semiconductor device using same |
US11759909B2 (en) | 2020-06-19 | 2023-09-19 | Sk Enpulse Co., Ltd. | Polishing pad, preparation method thereof and method for preparing semiconductor device using same |
KR102237311B1 (en) * | 2020-06-19 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | Polishing pad, preparation method thereof and preparation method of semiconductor device using same |
KR102237316B1 (en) * | 2020-06-19 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | Polishing pad, preparation method thereof and preparation method of semiconductor device using same |
KR102489678B1 (en) * | 2020-12-07 | 2023-01-17 | 에스케이엔펄스 주식회사 | Sheet for polishing pad, poishing pad and manufacturing method for semiconductor device |
KR102512675B1 (en) * | 2020-12-30 | 2023-03-21 | 에스케이엔펄스 주식회사 | Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same |
US11813713B2 (en) * | 2021-01-21 | 2023-11-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad and polishing method |
US11806830B2 (en) * | 2021-01-21 | 2023-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Formulations for chemical mechanical polishing pads and CMP pads made therewith |
CN112548845B (en) * | 2021-02-19 | 2021-09-14 | 清华大学 | Substrate processing method |
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-
2018
- 2018-01-19 TW TW107101978A patent/TWI757410B/en active
- 2018-01-19 US US15/875,867 patent/US10786885B2/en active Active
- 2018-01-19 WO PCT/US2018/014344 patent/WO2018136694A1/en unknown
- 2018-01-19 KR KR1020197024322A patent/KR102329099B1/en active IP Right Grant
- 2018-01-19 SG SG11201906131WA patent/SG11201906131WA/en unknown
- 2018-01-19 EP EP18741588.0A patent/EP3571009A4/en active Pending
- 2018-01-19 TW TW107200931U patent/TWM573509U/en unknown
- 2018-01-19 JP JP2019539201A patent/JP7227137B2/en active Active
- 2018-01-22 CN CN201810059565.5A patent/CN108326730B/en active Active
- 2018-01-22 CN CN201820105135.8U patent/CN208945894U/en not_active Withdrawn - After Issue
Also Published As
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EP3571009A1 (en) | 2019-11-27 |
TWM573509U (en) | 2019-01-21 |
TW201829124A (en) | 2018-08-16 |
CN108326730B (en) | 2022-04-26 |
TWI757410B (en) | 2022-03-11 |
CN208945894U (en) | 2019-06-07 |
CN108326730A (en) | 2018-07-27 |
KR102329099B1 (en) | 2021-11-19 |
WO2018136694A1 (en) | 2018-07-26 |
US10786885B2 (en) | 2020-09-29 |
KR20190100446A (en) | 2019-08-28 |
US20180207770A1 (en) | 2018-07-26 |
EP3571009A4 (en) | 2021-01-20 |
JP2020505241A (en) | 2020-02-20 |
JP7227137B2 (en) | 2023-02-21 |
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