CN109434568A - A kind of optical device polishing method of the high high roughness of face type - Google Patents
A kind of optical device polishing method of the high high roughness of face type Download PDFInfo
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- CN109434568A CN109434568A CN201811237800.XA CN201811237800A CN109434568A CN 109434568 A CN109434568 A CN 109434568A CN 201811237800 A CN201811237800 A CN 201811237800A CN 109434568 A CN109434568 A CN 109434568A
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- Prior art keywords
- polishing
- substrate
- face type
- workpiece
- optical device
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The present invention relates to optical base-substrate processing technique field, in particular to a kind of optical device polishing method of the high high roughness of face type.Include the following steps: that (one) makes polishing disk, (two) spray polytetrafluoroethylene (PTFE)；(3) polishing disk is modified；(4) water-bath polishes.The optical device polishing method of the high high roughness of face type of one of present invention, pass through the improvement to polishing disk making material and method, and to polishing disk spraying, finishing and the improvement of subsequent polishing process, compared with existing polishing process, the roughness and face type of workpiece is greatly improved in the present invention, the face type of conventional product is increased to 1/20 λ from 1/10 λ, roughness fromIt is increased to
Description
Technical field
The present invention relates to optical base-substrate processing technique field, in particular to it is a kind of improve simultaneously optical base-substrate surface face type and
The polishing method of the optics cold working of roughness.
Background technique
Requirement with industrial lasers, medical laser instrument, military laser to Output optical power and optical quality is continuous
It mentions and HD video optics is to the imaging requirements of high-resolution high quality, to the face type of application surface optical device therein
It is also higher and higher with the requirement of roughness.But it is existing it is low throw, it is high throw, two-sided throwing it is unstable there is processing, roughness and
The shortcomings that high face type cannot be taken into account.Therefore, a kind of optics that there can either be high face type that there is high roughness again how is prepared
Substrate has become the hot spot of domestic and international optical manufacturing person research, and still, there are no one kind can either have height currently on the market
Face type has the polishing method of the optical device of high roughness again.
Summary of the invention
To solve the shortcomings of the prior art, the present invention provides a kind of process stabilization, and high yield rate can either have
There is high face type that there is the polishing method of optical device of high roughness again.
The technical solution of the present invention is as follows:
A kind of optical device polishing method of the high high roughness of face type, includes the following steps:
(1) polishing disk is made
The base material for selecting polishing disk, after choosing material, will slot in substrate, carries out substrate surface after fluting
Sanding processing；
(2) polytetrafluoroethylene (PTFE) is sprayed
(1) substrate after step (1) sanding is cleaned up and is dried up；
(2) it then places the substrate above and is preheated in oven, the temperature setting of heating is 270-280 degrees Celsius, is added
It is 20-30 minutes hot, make substrate sufficiently heated；
(3) even application polytetrafluoroethylene (PTFE) after the completion of substrate is heated, coating thickness 2-3mm；
(3) polishing disk is modified
(1) suitable conditioner discs are selected, diamond pellet is uniformly placed on conditioner discs, is bonded together with AB glue,
It is placed in oven and toasts 0.5-2 hours, temperature setting is at 70-90 degrees Celsius；
(2) Buddha's warrior attendant sand fine grinding conditioner discs are used, the flatness for being trimmed to conditioner discs controls within 1 micron；
(3) polishing disk is modified with the conditioner discs trimmed, it is ensured that the whole disk control of polishing disk type that conditioner discs repair
System is within 1 λ；
(4) water-bath polishes
(1) workpiece to be processed is uniformly well placed carry out fine grinding；
(2) it is cleaned after workpiece fine grinding, high throwing is carried out after having cleaned, high rubbing down pin size is not less than 2.5, controls work
The face type of part integral face type and polishing disk is within 1 λ；
(3) height is cleaned after having thrown, and workpiece is placed on polishing disk after having cleaned, and carries out smart throwing, the size that essence is thrown
Not less than 0.5, kept for 22-27 degrees Celsius of room temperature, the control of the temperature of polishing fluid at 23-25 degrees Celsius, polishing fluid it is dense
Degree is 5-8%, is diluted during polishing according to per hour 1% ratio.
Further, the material of the substrate is quartz substrate or aluminium substrate.
Further, when the material of substrate is quartz substrate, fluting selects hilted broadsword machine, and substrate is split into several
The square of 7.5mm*7.5mm, depth are less than 0.5mm in 7mm, chipping, then use the chipping at milling and grinding machine mill off edge, deep-controlled
In 6-6.5mm, integral thickness is controlled in parallel at 2；When the material of substrate is aluminium substrate, slotted using carving machine,
It is split into the square of several 7.5mm*7.5mm, midfeather 2.5mm, depth 6.5mm.
Further, during sanding, using No. 180 Buddha's warrior attendant sand substrate surface sanding, integral thickness is controlled in parallel
System is within 1.
Further, spray polytetrafluoroethylene (PTFE) the specific steps are the first substrate surface even applications 1 after heated
Substrate is put back to oven cooking cycle after having sprayed by strata tetrafluoroethene, 20-40min is toasted, so that substrate is in conjunction with polytetrafluoroethylene (PTFE)
Together, the thickness of polytetrafluoroethylene (PTFE) is at 10-30；Spraying 13-15 times is repeated, so that the thickness of polytetrafluoroethylene (PTFE) reaches 2-
2.5mm cools down in oven after thickness reaches requirement.
Further, during polishing disk is modified, the diameter proportion of conditioner discs and polishing disk is 7:10.
Further, it during conditioner discs are modified, is first modified with No. W40 Buddha's warrior attendant sand, flatness control is micro- 10
Within rice, fine grinding then is carried out with W28, W14 Buddha's warrior attendant sand, so that the control of conditioner discs flatness is within 1 micron.
Further, the reserved size of workpiece to be processed is at 25 or more.
Further, workpiece fine grinding the specific steps are workpiece fine grinding can be divided into 3 procedures and be processed, and the 1st makes
It is carried out with W28 Buddha's warrior attendant sand, grinding is carried out having a size of 15, the 2nd using W14 Buddha's warrior attendant sand, is ground size 8, and the 3rd uses
W10 Buddha's warrior attendant sand carries out, and having a size of 2, fine grinding completion will guarantee that workpiece has bevelling for grinding.
Further, during essence is thrown, workpiece is placed on polishing disk and is polished, polishing disk is mounted on polishing
In basin, place polishing fluid in polishing basin, polishing fluid will be totally submerged polishing disk and workpiece, arrange suitable position, guarantee workpiece and
There can be no the variations of face type in grinding process for polishing disk too greatly.
The beneficial effects obtained by the present invention are as follows are as follows:
The optical device polishing method of the high high roughness of face type of one of present invention, by polishing disk making material with
And the improvement of method, and to polishing disk spraying, finishing and the improvement of subsequent polishing process, with existing polishing process phase
Than the roughness and face type of workpiece is greatly improved in the present invention, and the face type of conventional product is increased to 1/20 λ from 1/10 λ, coarse
Degree fromIt is increased toAnd dependence to operator is also greatly reduced, operating method is reliable, and product index is stablized, at
Product rate is high.
Specific embodiment
For convenient for it will be understood by those skilled in the art that the present invention, specific embodiment party of the invention is illustrated below with reference to embodiment
Formula.
(1) polishing disk is made
The base material for selecting polishing disk, after choosing material, will slot in substrate, carries out substrate surface after fluting
Sanding processing.
Specifically, the material of the substrate is quartz substrate or aluminium substrate, aluminium substrate winter face type variation meeting greatly one
A bit, quartz substrate can be smaller.During selection, the diameter proportion of substrate and workpiece plate is 10:7, and thickness is greater than 25mm, this
26mm is selected in embodiment.When the material of substrate is quartz substrate, fluting selects hilted broadsword machine, and substrate is split into several
The square of 7.5mm*7.5mm, depth are less than 0.5mm in 7mm, chipping, then use the chipping at milling and grinding machine mill off edge, deep-controlled
In 6mm, integral thickness is controlled in parallel at 2.When the material of substrate is aluminium substrate, is slotted, be split into using carving machine
The square of several 7.5mm*7.5mm, midfeather 2.5mm, depth 6.5mm.Substrate in the present embodiment selects quartz substrate.
After having slotted, using No. 180 Buddha's warrior attendant sand substrate surface sanding, whole surface is needed uniformly to be ground to, integral thickness controls in parallel
Within 1.Using the surface that No. 180 Buddha's warrior attendant sand sanding surfaces are to obtain relative coarseness, can be combined more in spraying
Securely.
(2) polytetrafluoroethylene (PTFE) is sprayed
(1) substrate after step (1) sanding is cleaned up and is dried up, can specifically be cleaned by ultrasonic wave, clearly
Wash rear air gun drying.
(2) it then places the substrate above and is preheated in oven, oven is also required to clean up before use.Heating
In the process, the temperature setting of oven heats 20 minutes at 280 degrees Celsius, makes substrate sufficiently heated.
(3) even application polytetrafluoroethylene (PTFE) after the completion of substrate is heated, coating thickness 2.3mm.Specifically, polytetrafluoroethylene (PTFE)
Material selection be granulated bulk cargo, first the 1 strata tetrafluoroethene of substrate surface even application after heated, has sprayed
Substrate is put back into oven cooking cycle afterwards, toasts 30min, so that substrate is combined together with polytetrafluoroethylene (PTFE), polytetrafluoroethyl-ne after baking
The thickness of alkene is at 20.20 thickness is just suitable, cannot be too thick or too thin, too thick to be easy to produce bubble, too thin, needs
Increase spraying number, reduces working efficiency.In normal spraying process, it be easy to cause center thick rim thin, so in this spray
It deliberately to spray and thicken at edge in painting process.It repeats to spray, after spraying number reaches 6 times, at this moment coating thickness reaches 1
After a millimeter, it should be noted that not allow the gap between square to be coupled together when spraying every time, connect together and be unfavorable for
Later period modifies polishing disk.In the above way, spraying 14 times is repeated, so that the thickness of polytetrafluoroethylene (PTFE) reaches 2.3mm, when thickness reaches
The problems such as to after requirement, cooling down in oven, prevent temperature change too big, substrate is caused to crack or come unglued.
(3) polishing disk is modified
(1) suitable conditioner discs are selected, specifically, the diameter proportion of conditioner discs and polishing disk is 7:10.Select Dia15*
The diamond pellet of 5mm, material resin diamond.Diamond pellet is uniformly placed on conditioner discs, is bonded in one with AB glue
It rises, is placed in oven and toasts 1 hour, temperature setting is at 80 degrees Celsius.
(2) Buddha's warrior attendant sand fine grinding conditioner discs are used, the flatness for being trimmed to conditioner discs controls within 1 micron.Specifically, first using
No. W40 Buddha's warrior attendant sand is trimmed to flatness control within 10 microns, then carries out fine grinding with W28, W14 Buddha's warrior attendant sand, so that
Conditioner discs flatness controls within 1 micron.
(3) polishing disk is modified with the conditioner discs trimmed, it is ensured that the whole disk control of polishing disk type that conditioner discs repair
System is within 1 λ.Specifically, according to polishing disk after finishing dish out come face type to conditioner discs carry out refine, it is ensured that conditioner discs repair
The whole disk of face type control within 1 λ.Specifically, before being modified to polishing disk, it first will be poly- on polishing disk with monolithic knife
Tetrafluoroethene layer is modified, and part extra polytetrafluoroethylene (PTFE) in gap is removed.Then polishing disk is fixed in water bed, is used
Conditioner discs are modified, just started polish disk type be uneven, pressure be not easy it is excessive, when polishing disk modifies out a chain-wales
Afterwards, it can pressurize and be modified, whole dressing efficiency can be accelerated.When the entire burnishing surface of polishing disk all repair then, finishing
The face type of disk can change, and need to redress conditioner discs at this time.When polishing disk, which is trimmed to, does not have big face type variation,
Refine is carried out with conditioner discs.In the process, a disk workpiece can be prepared, polished after polishing disk finishing, according to burnishing surface
Type is not in that the variation of height aperture is too fast in polishing process to be further adjusted to machine to ensure.When workpiece is thrown
Finishing dignity type controls always within 1 λ, illustrates that finishing is completed in polishing disk, water bed and polishing disk are cleaned up can
To carry out product polishing.
(4) water-bath polishes
(1) workpiece to be processed is uniformly well placed carry out fine grinding.Before fine grinding, work pieces process, which reserves size, to be guaranteed
At 25 or more, 26 are selected in the present embodiment, can remove the destruction layer generated in corase grinding production process completely in this way.It chooses
After good workpiece, workpiece is uniformly well placed, best disposing way is that edge is relatively closeer than center, in such polishing process
Be conducive to the variation of face type to keep and control.After being well placed, fine grinding the specific steps are, workpiece fine grinding can be divided into 3 procedures into
Row processing, the 1st is carried out using W28 Buddha's warrior attendant sand, and grinding is carried out having a size of 15, the 2nd using W14 Buddha's warrior attendant sand, is ground size 8
Silk, the 3rd is carried out using W10 Buddha's warrior attendant sand, is ground having a size of 2, and pressure can be cut during mill pin, and Buddha's warrior attendant sand is few using more water
Sand carries out fine grinding, can reduce and destroy thickness degree, and fine grinding completion will guarantee that workpiece has bevelling.
(2) it is cleaned after workpiece fine grinding with soap, it is ensured that each position has Buddha's warrior attendant sand to retain.Also ultrasonic wave can be used
It is cleaned.High throwing is carried out after having cleaned, high rubbing down pin size is not less than 2.5, controls workpiece integral face type and polishing disk
Face type is within 1 λ.Face type has to control within 1 λ, is easier to be bonded when carrying out essence and throwing in this way, is conducive to control
Finish.
(3) height is cleaned after having thrown, and places the high mixing thrown with polishing powder in smart throw.Workpiece is placed on after having cleaned
On polishing disk, smart throwing is carried out.Specifically, polishing disk is mounted in polishing basin, polishing fluid is placed in polishing basin, polishing fluid is complete
Polishing disk and workpiece are submerged, suitable position is arranged, it is ensured that workpiece and polishing disk become in grinding process when mesoprosopy keeps slight
Change, there can be no the variations of face type too greatly, be easy to cause surface roughness difference and face profile bar line part slight irregular in this way.Essence is thrown
Size be not less than 0.5, kept for 22-27 degrees Celsius of room temperature, the present embodiment is 25 degrees Celsius, and the temperature of polishing fluid controls
At 23-25 degrees Celsius, the present embodiment is 25 degrees Celsius.Polishing process will guarantee that machine shaft rotation will with one heart, and rocker is steady,
In this way workpiece be bonded in polishing process could it is good, to control the concentration of polishing fluid, be not easy overrich, the concentration ratio of polishing fluid
5-8%, the present embodiment 5%.The concentration of polishing fluid will follow polishing time constantly thin out in polishing process, by per small
When 1% ratio be diluted.In the process, polishing disk slows down the speed of main shaft and the amplitude of oscillation in right amount, and polishing process is forbidden repairing
Disk and interruption.
The workpiece that the roughness and face type and existing method for the workpiece that middle method polishes out through the invention polish out
Roughness is compared with face type, and face type is increased to 1/20 λ from 1/10 λ, roughness fromIt is increased toAnd it also greatly reduces
To the dependence of operator, operating method is reliable, product index is stable.
The embodiments of the present invention described above are not intended to limit the scope of the present invention.It is any in the present invention
Spirit and principle within made modifications, equivalent substitutions and improvements etc., should be included in claim protection model of the invention
Within enclosing.
Claims (10)
1. a kind of optical device polishing method of the high high roughness of face type, which comprises the steps of:
(1) polishing disk is made
The base material for selecting polishing disk, after choosing material, will slot in substrate, substrate surface is carried out sanding after fluting
Processing；
(2) polytetrafluoroethylene (PTFE) is sprayed
(1) substrate after step (1) sanding is cleaned up and is dried up；
(2) it then places the substrate above and is preheated in oven, the temperature setting of heating is 270-280 degrees Celsius, heats 20-
30 minutes, make substrate sufficiently heated；
(3) even application polytetrafluoroethylene (PTFE) after the completion of substrate is heated, coating thickness 2-3mm；
(3) polishing disk is modified
(1) suitable conditioner discs are selected, diamond pellet is uniformly placed on conditioner discs, is bonded together with AB glue, is placed on
It is toasted 0.5-2 hours in oven, temperature setting is at 70-90 degrees Celsius；
(2) Buddha's warrior attendant sand fine grinding conditioner discs are used, the flatness for being trimmed to conditioner discs controls within 1 micron；
(3) polishing disk is modified with the conditioner discs trimmed, it is ensured that the whole disk control of the polishing disk type that conditioner discs repair is 1
Within λ；
(4) water-bath polishes
(1) workpiece to be processed is uniformly well placed carry out fine grinding；
(2) it is cleaned after workpiece fine grinding, high throwing is carried out after having cleaned, high rubbing down pin size is not less than 2.5, and control workpiece is whole
The face type of honorable type and polishing disk is within 1 λ；
(3) height is cleaned after having thrown, and workpiece is placed on polishing disk after having cleaned, and carries out smart throwing, and the size that essence is thrown is not small
In 0.5, kept for 22-27 degrees Celsius of room temperature, the control of the temperature of polishing fluid is in 23-25 degrees Celsius, the concentration of polishing fluid
5-8% is diluted during polishing according to per hour 1% ratio.
2. a kind of optical device polishing method of high high roughness of face type according to claim 1, it is characterised in that: described
The material of substrate is quartz substrate or aluminium substrate.
3. a kind of optical device polishing method of high high roughness of face type according to claim 2, it is characterised in that: work as base
When the material at bottom is quartz substrate, fluting selects hilted broadsword machine, substrate is split into the square of several 7.5mm*7.5mm, depth exists
7mm, chipping are less than 0.5mm, then use the chipping at milling and grinding machine mill off edge, deep-controlled in 6-6.5mm, integral thickness is controlled in parallel
System is at 2；When the material of substrate is aluminium substrate, is slotted using carving machine, be split into the side of several 7.5mm*7.5mm
Block, midfeather 2.5mm, depth 6.5mm.
4. a kind of optical device polishing method of high high roughness of face type according to claim 1, it is characterised in that: grinding
During hair, using No. 180 Buddha's warrior attendant sand substrate surface sanding, integral thickness is controlled in parallel within 1.
5. a kind of optical device polishing method of high high roughness of face type according to claim 1, it is characterised in that: spraying
Polytetrafluoroethylene (PTFE) the specific steps are the first 1 strata tetrafluoroethene of substrate surface even application after heated, after having sprayed
Substrate is put back into oven cooking cycle, toasts 20-40min, so that substrate is combined together with polytetrafluoroethylene (PTFE), the thickness of polytetrafluoroethylene (PTFE)
Degree is at 10-30；Spraying 13-15 times is repeated, so that the thickness of polytetrafluoroethylene (PTFE) reaches 2-2.5mm, after thickness reaches requirement,
Cool down in oven.
6. a kind of optical device polishing method of high high roughness of face type according to claim 1, it is characterised in that: throwing
During CD is modified, the diameter proportion of conditioner discs and polishing disk is 7:10.
7. a kind of optical device polishing method of high high roughness of face type according to claim 1, it is characterised in that: repairing
It during whole disk finishing, is first modified with No. W40 Buddha's warrior attendant sand, flatness controls within 10 microns, then uses W28, No. W14
Buddha's warrior attendant sand carries out fine grinding, so that the control of conditioner discs flatness is within 1 micron.
8. a kind of optical device polishing method of high high roughness of face type according to claim 1, it is characterised in that: to be added
The reserved size of the workpiece of work is at 25 or more.
9. a kind of optical device polishing method of high high roughness of face type according to claim 1, it is characterised in that: workpiece
Fine grinding the specific steps are, workpiece fine grinding can be divided into 3 procedures and be processed, the 1st using W28 Buddha's warrior attendant sand carry out, grinding
Having a size of 15, the 2nd is carried out using W14 Buddha's warrior attendant sand, is ground size 8, and the 3rd is carried out using W10 Buddha's warrior attendant sand, is ground size
It is 2, fine grinding completion will guarantee that workpiece has bevelling.
10. a kind of optical device polishing method of high high roughness of face type according to claim 1, it is characterised in that:
During essence is thrown, workpiece is placed on polishing disk and is polished, polishing disk is mounted in polishing basin, is placed and is thrown in polishing basin
Light liquid, polishing fluid will be totally submerged polishing disk and workpiece, arrange suitable position, guarantee workpiece and polishing disk in grinding process
There can be no the variations of face type too greatly.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811237800.XA CN109434568A (en) | 2018-10-23 | 2018-10-23 | A kind of optical device polishing method of the high high roughness of face type |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811237800.XA CN109434568A (en) | 2018-10-23 | 2018-10-23 | A kind of optical device polishing method of the high high roughness of face type |
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| CN109434568A true CN109434568A (en) | 2019-03-08 |
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| CN201811237800.XA Pending CN109434568A (en) | 2018-10-23 | 2018-10-23 | A kind of optical device polishing method of the high high roughness of face type |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114196327A (en) * | 2022-01-28 | 2022-03-18 | 淄博海泰新光光学技术有限公司 | Composite material for polishing optical parts and preparation method thereof |
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Application publication date: 20190308 |