SG10201502914YA - Method For Drying Wafer Substrates And Wafer Holder For Conduction Of The Method - Google Patents

Method For Drying Wafer Substrates And Wafer Holder For Conduction Of The Method

Info

Publication number
SG10201502914YA
SG10201502914YA SG10201502914YA SG10201502914YA SG10201502914YA SG 10201502914Y A SG10201502914Y A SG 10201502914YA SG 10201502914Y A SG10201502914Y A SG 10201502914YA SG 10201502914Y A SG10201502914Y A SG 10201502914YA SG 10201502914Y A SG10201502914Y A SG 10201502914YA
Authority
SG
Singapore
Prior art keywords
wafer
conduction
drying
substrates
holder
Prior art date
Application number
SG10201502914YA
Inventor
Albert Kühnstetter
Walter Edmaier
Georg-Friedrich Hohl
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG10201502914YA publication Critical patent/SG10201502914YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG10201502914YA 2014-04-15 2015-04-14 Method For Drying Wafer Substrates And Wafer Holder For Conduction Of The Method SG10201502914YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014207266.2A DE102014207266A1 (en) 2014-04-15 2014-04-15 Method for drying disc-shaped substrates and disc holders for carrying out the method

Publications (1)

Publication Number Publication Date
SG10201502914YA true SG10201502914YA (en) 2015-11-27

Family

ID=54193281

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201502914YA SG10201502914YA (en) 2014-04-15 2015-04-14 Method For Drying Wafer Substrates And Wafer Holder For Conduction Of The Method

Country Status (7)

Country Link
US (1) US20150294883A1 (en)
JP (1) JP2015204463A (en)
KR (1) KR20150118898A (en)
CN (1) CN105006422A (en)
DE (1) DE102014207266A1 (en)
SG (1) SG10201502914YA (en)
TW (1) TWI547982B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3840021B1 (en) * 2019-12-18 2022-10-19 Siltronic AG Improved device for drying semiconductor substrates
EP3840023B1 (en) 2019-12-18 2022-10-19 Siltronic AG Improved device for drying semiconductor substrates
EP3840022B1 (en) 2019-12-18 2022-10-05 Siltronic AG Improved device for drying semiconductor substrates

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8900480A (en) 1989-02-27 1990-09-17 Philips Nv METHOD AND APPARATUS FOR DRYING SUBSTRATES AFTER TREATMENT IN A LIQUID
JP2888409B2 (en) * 1993-12-14 1999-05-10 信越半導体株式会社 Wafer cleaning tank
JPH07263390A (en) * 1994-03-22 1995-10-13 Dainippon Screen Mfg Co Ltd Method and device for cleaning and drying substrate
DE4413077C2 (en) 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Method and device for chemical treatment of substrates
US5694701A (en) * 1996-09-04 1997-12-09 Minnesota Mining And Manufacturing Company Coated substrate drying system
US5704493A (en) * 1995-12-27 1998-01-06 Dainippon Screen Mfg. Co., Ltd. Substrate holder
US5813133A (en) * 1996-09-04 1998-09-29 Minnesota Mining And Manufacturing Company Coated substrate drying system with magnetic particle orientation
JP3448613B2 (en) * 1999-06-29 2003-09-22 オメガセミコン電子株式会社 Drying equipment
US6318389B1 (en) * 1999-10-29 2001-11-20 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
US20040031167A1 (en) * 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
KR100447285B1 (en) * 2002-09-05 2004-09-07 삼성전자주식회사 Apparatus for drying a substrate
US6928748B2 (en) * 2003-10-16 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Method to improve post wafer etch cleaning process
US7181863B2 (en) * 2004-03-09 2007-02-27 Sez America, Inc. Wafer dryer and method for drying a wafer
JP2007180064A (en) * 2005-12-26 2007-07-12 Kyocera Corp Cassette
JP4762835B2 (en) * 2006-09-07 2011-08-31 東京エレクトロン株式会社 Substrate processing method, substrate processing apparatus, program, and program recording medium
WO2008032910A1 (en) * 2006-09-16 2008-03-20 Piezonics Co. Ltd. Apparatus of chemical vapor deposition with a showerhead regulating injection velocity of reactive gases positively and method thereof
KR100849929B1 (en) * 2006-09-16 2008-08-26 주식회사 피에조닉스 Apparatus of chemical vapor deposition with a showerhead regulating the injection velocity of reactive gases positively and a method thereof
JP4884180B2 (en) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP5358908B2 (en) * 2007-08-02 2013-12-04 大日本印刷株式会社 Color filter manufacturing apparatus, color filter manufacturing method, drying apparatus, drying method, display apparatus manufacturing apparatus, display apparatus manufacturing method
KR101231182B1 (en) * 2007-09-12 2013-02-07 삼성전자주식회사 Waferguide for preventing wafer broken of semiconductor cleaning equipment
JP4999808B2 (en) * 2008-09-29 2012-08-15 東京エレクトロン株式会社 Substrate processing equipment
JP4974996B2 (en) * 2008-10-15 2012-07-11 東京エレクトロン株式会社 Substrate processing equipment
DE102009003393A1 (en) * 2009-01-27 2010-07-29 Schott Solar Ag Process for the temperature treatment of semiconductor devices
JP5966250B2 (en) * 2011-03-16 2016-08-10 富士電機株式会社 Substrate support jig
US8756825B2 (en) * 2012-10-11 2014-06-24 Eastman Kodak Company Removing moistening liquid using heating-liquid barrier

Also Published As

Publication number Publication date
CN105006422A (en) 2015-10-28
TW201539563A (en) 2015-10-16
JP2015204463A (en) 2015-11-16
KR20150118898A (en) 2015-10-23
US20150294883A1 (en) 2015-10-15
TWI547982B (en) 2016-09-01
DE102014207266A1 (en) 2015-10-15

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