RU2488195C2 - Комплект светодиодной выводной рамки, светодиодная группа, использующая данную рамку, и способ изготовления светодиодной группы - Google Patents

Комплект светодиодной выводной рамки, светодиодная группа, использующая данную рамку, и способ изготовления светодиодной группы Download PDF

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Publication number
RU2488195C2
RU2488195C2 RU2011134604/28A RU2011134604A RU2488195C2 RU 2488195 C2 RU2488195 C2 RU 2488195C2 RU 2011134604/28 A RU2011134604/28 A RU 2011134604/28A RU 2011134604 A RU2011134604 A RU 2011134604A RU 2488195 C2 RU2488195 C2 RU 2488195C2
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Russia
Prior art keywords
layer
led
sealing layer
phosphor
led group
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RU2011134604/28A
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English (en)
Russian (ru)
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RU2011134604A (ru
Inventor
Тхе Тран НГУЙЕН
Original Assignee
Непес Лед Корпорейшн
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Publication date
Priority claimed from US12/381,409 external-priority patent/US8039862B2/en
Priority claimed from US12/381,408 external-priority patent/US8058667B2/en
Application filed by Непес Лед Корпорейшн filed Critical Непес Лед Корпорейшн
Publication of RU2011134604A publication Critical patent/RU2011134604A/ru
Application granted granted Critical
Publication of RU2488195C2 publication Critical patent/RU2488195C2/ru

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
RU2011134604/28A 2009-03-10 2010-02-24 Комплект светодиодной выводной рамки, светодиодная группа, использующая данную рамку, и способ изготовления светодиодной группы RU2488195C2 (ru)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/381,409 US8039862B2 (en) 2009-03-10 2009-03-10 White light emitting diode package having enhanced white lighting efficiency and method of making the same
US12/381,408 US8058667B2 (en) 2009-03-10 2009-03-10 Leadframe package for light emitting diode device
US12/381,409 2009-03-10
US12/381,408 2009-03-10
PCT/KR2010/001134 WO2010104276A2 (en) 2009-03-10 2010-02-24 Led leadframe package, led package using the same, and method of manufacturing the led package

Publications (2)

Publication Number Publication Date
RU2011134604A RU2011134604A (ru) 2013-04-20
RU2488195C2 true RU2488195C2 (ru) 2013-07-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
RU2011134604/28A RU2488195C2 (ru) 2009-03-10 2010-02-24 Комплект светодиодной выводной рамки, светодиодная группа, использующая данную рамку, и способ изготовления светодиодной группы

Country Status (9)

Country Link
EP (1) EP2406835A4 (ko)
JP (1) JP2012520565A (ko)
KR (1) KR101111256B1 (ko)
CN (1) CN102318091A (ko)
AU (1) AU2010221920A1 (ko)
RU (1) RU2488195C2 (ko)
SG (1) SG173518A1 (ko)
TW (1) TW201044646A (ko)
WO (1) WO2010104276A2 (ko)

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US9159886B2 (en) 2011-04-19 2015-10-13 Intellectual Discovery Co., Ltd. Lighting apparatus with a carrier layer
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TWI418742B (zh) * 2011-06-30 2013-12-11 Lextar Electronics Corp 發光元件的封裝結構
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KR101287484B1 (ko) * 2012-03-07 2013-07-19 삼성전자주식회사 발광 소자 패키지
KR20130103080A (ko) * 2012-03-09 2013-09-23 서울반도체 주식회사 Ｌｅｄ 조명장치
KR20130110997A (ko) * 2012-03-30 2013-10-10 서울반도체 주식회사 Ｌｅｄ용 렌즈 및 그 제조방법
TWI489657B (zh) * 2012-04-12 2015-06-21 Lextar Electronics Corp 發光二極體封裝件
TWI474517B (zh) * 2012-05-28 2015-02-21 Lextar Electronics Corp 發光裝置及其製造方法
KR101321101B1 (ko) * 2012-06-01 2013-10-23 주식회사 코스텍시스 기판 및 이를 이용한 소자 패키지
CN103515517B (zh) * 2012-06-20 2016-03-23 展晶科技(深圳)有限公司 发光二极管模组
CN103515502A (zh) * 2012-06-29 2014-01-15 展晶科技(深圳)有限公司 发光二极管装置
US9608177B2 (en) 2013-08-27 2017-03-28 Lumens Co., Ltd. Light emitting device package and backlight unit having the same
KR101504309B1 (ko) * 2013-08-27 2015-03-20 주식회사 루멘스 발광 소자 패키지 및 이를 갖는 백라이트 유닛
KR102188500B1 (ko) 2014-07-28 2020-12-09 삼성전자주식회사 발광다이오드 패키지 및 이를 이용한 조명장치
JP6730017B2 (ja) 2014-11-10 2020-07-29 エルジー イノテック カンパニー リミテッド 発光素子パッケージ、及びこれを含む照明システム
KR20160149363A (ko) 2015-06-17 2016-12-28 삼성전자주식회사 반도체 발광소자
CN106784260A (zh) * 2016-11-30 2017-05-31 深圳市聚飞光电股份有限公司 一种直下式led背光源的制作方法
KR102261288B1 (ko) * 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
CN109585632B (zh) * 2019-02-14 2019-07-30 旭宇光电（深圳）股份有限公司 大功率远程荧光粉型白光led散热封装
JP7445120B2 (ja) 2020-02-21 2024-03-07 日亜化学工業株式会社 発光装置
CN112467010B (zh) * 2020-11-13 2022-03-22 中山市聚明星电子有限公司 二极管封装工艺及封装二极管
KR102338707B1 (ko) * 2021-06-14 2021-12-13 주식회사 소룩스 광원 및 조명장치
KR102634521B1 (ko) 2023-10-31 2024-02-07 장연식 통증 완화 약물 주입시스템

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RU2231951C2 (ru) * 2001-10-31 2004-07-10 Салдаев Александр Макарович Система капельного орошения
US7187010B2 (en) * 2003-03-27 2007-03-06 Sanken Electric Co., Ltd. Semiconductor light emitting device
US20070063321A1 (en) * 2003-05-28 2007-03-22 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
RU2267188C2 (ru) * 2003-06-23 2005-12-27 Федорова Галина Владимировна Светодиодное полупроводниковое устройство в корпусе для поверхностного монтажа
US7361940B2 (en) * 2004-12-16 2008-04-22 Seoul Semiconductor Co., Ltd. Leadframe and packaged light emitting diode
RU2007126821A (ru) * 2004-12-16 2009-01-27 Сеул Семикондактор Ко., Лтд. (Kr) Рамка с выводами, имеющая поддерживающее теплоотвод кольцо, способ изготовления корпуса светоизлучающего диода с ее использованием и корпус светоизлучающего диода, изготовленный этим способом
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Also Published As

Publication number Publication date
WO2010104276A2 (en) 2010-09-16
KR20100106297A (ko) 2010-10-01
JP2012520565A (ja) 2012-09-06
TW201044646A (en) 2010-12-16
EP2406835A2 (en) 2012-01-18
RU2011134604A (ru) 2013-04-20
KR101111256B1 (ko) 2012-02-22
SG173518A1 (en) 2011-09-29
WO2010104276A3 (en) 2010-11-25
AU2010221920A1 (en) 2011-09-29
EP2406835A4 (en) 2013-09-18
CN102318091A (zh) 2012-01-11

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