PL2803711T3 - Zestaw klejów przylepcowych zawierający materiał wypełniacza - Google Patents

Zestaw klejów przylepcowych zawierający materiał wypełniacza

Info

Publication number
PL2803711T3
PL2803711T3 PL13168253T PL13168253T PL2803711T3 PL 2803711 T3 PL2803711 T3 PL 2803711T3 PL 13168253 T PL13168253 T PL 13168253T PL 13168253 T PL13168253 T PL 13168253T PL 2803711 T3 PL2803711 T3 PL 2803711T3
Authority
PL
Poland
Prior art keywords
sensitive adhesive
pressure sensitive
filler material
adhesive assembly
assembly
Prior art date
Application number
PL13168253T
Other languages
English (en)
Inventor
Jan Heimink
Kerstin Unverhau
Jan Forster
Jan Ulrich Wieneke
Frank Kuester
Siegfried Goeb
Doreen Eckhardt
Regina Sikora
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of PL2803711T3 publication Critical patent/PL2803711T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/12—Treatment with organosilicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C01P2004/34—Spheres hollow
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/28—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
PL13168253T 2013-05-17 2013-05-17 Zestaw klejów przylepcowych zawierający materiał wypełniacza PL2803711T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP13168253.6A EP2803711B1 (en) 2013-05-17 2013-05-17 Pressure sensitive adhesive assembly comprising filler material

Publications (1)

Publication Number Publication Date
PL2803711T3 true PL2803711T3 (pl) 2018-11-30

Family

ID=48482926

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13168253T PL2803711T3 (pl) 2013-05-17 2013-05-17 Zestaw klejów przylepcowych zawierający materiał wypełniacza

Country Status (7)

Country Link
US (1) US11518914B2 (pl)
EP (1) EP2803711B1 (pl)
JP (2) JP2016522284A (pl)
KR (1) KR20160009053A (pl)
CN (2) CN114591698A (pl)
PL (1) PL2803711T3 (pl)
WO (1) WO2014186316A1 (pl)

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EP2735595A1 (en) 2012-11-23 2014-05-28 3M Innovative Properties Company Multilayer pressure-sensitive adhesive assembly
EP2803712A1 (en) 2013-05-17 2014-11-19 3M Innovative Properties Company Multilayer Pressure Sensitive Adhesive Assembly
EP2975097B1 (en) 2014-07-17 2022-03-09 3M Innovative Properties Company Pressure sensitive adhesive assembly comprising thermoplastic filler material
EP2975096B1 (en) 2014-07-17 2021-11-17 3M Innovative Properties Company Pressure sensitive adhesive assembly suitable for bonding to uneven substrates
WO2017040748A1 (en) * 2015-09-02 2017-03-09 3M Innovative Properties Company Adhesive article
US20170113436A1 (en) * 2015-10-21 2017-04-27 Intertape Polymer Corp. Duct tape having a multi-layer adhesive system
KR20180100572A (ko) 2016-01-13 2018-09-11 헨켈 아게 운트 코. 카게아아 충전제를 함유하는 반응성 폴리우레탄 핫-멜트 접착제
US20190023948A1 (en) * 2016-01-18 2019-01-24 3M Innovative Properties Company Pressure-sensitive adhesive with filler
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EP3613820A1 (en) * 2018-08-24 2020-02-26 3M Innovative Properties Company Multilayer pressure-sensitive adhesive assembly
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JP2020158763A (ja) * 2019-03-25 2020-10-01 東ソー株式会社 樹脂組成物および蓋材用フィルム
JP7461239B2 (ja) 2020-07-14 2024-04-03 ダイセル・オルネクス株式会社 ウレタン（メタ）アクリレート組成物、活性エネルギー線硬化性組成物、及びその硬化物
CN112409840A (zh) * 2020-10-12 2021-02-26 南昌航空大学 一种碳化硅/氮化碳复合增强导热防水薄膜及其制备方法
KR102651809B1 (ko) * 2021-04-27 2024-03-27 (주)메디클러스 다공성 유리 나노 입자 및 이를 포함하는 상아질 접착제 조성물
CN113980621B (zh) * 2021-11-05 2022-12-23 江苏恒达包装股份有限公司 一种基于有机硅基材料改性的高透光耐酸碱热熔胶
WO2024121781A1 (en) * 2022-12-06 2024-06-13 3M Innovative Properties Company Composition including particles and two liquid phases and related process

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EP2573150A1 (en) 2011-09-26 2013-03-27 3M Innovative Properties Company Multilayer pressure-sensitive adhesive films with pressure-sensitive adhesives comprising (meth)acrylate esters of 2-alkyl alkanols
EP2735595A1 (en) 2012-11-23 2014-05-28 3M Innovative Properties Company Multilayer pressure-sensitive adhesive assembly
KR20150016880A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법

Also Published As

Publication number Publication date
JP2019065293A (ja) 2019-04-25
US20160083628A1 (en) 2016-03-24
EP2803711B1 (en) 2018-06-27
JP2016522284A (ja) 2016-07-28
EP2803711A1 (en) 2014-11-19
WO2014186316A1 (en) 2014-11-20
US11518914B2 (en) 2022-12-06
KR20160009053A (ko) 2016-01-25
CN105229101A (zh) 2016-01-06
CN114591698A (zh) 2022-06-07

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