CN109312201B - 填充纳米粒子的阻隔性粘合剂组合物 - Google Patents
填充纳米粒子的阻隔性粘合剂组合物 Download PDFInfo
- Publication number
- CN109312201B CN109312201B CN201780037374.2A CN201780037374A CN109312201B CN 109312201 B CN109312201 B CN 109312201B CN 201780037374 A CN201780037374 A CN 201780037374A CN 109312201 B CN109312201 B CN 109312201B
- Authority
- CN
- China
- Prior art keywords
- barrier
- adhesive composition
- nanoparticles
- barrier adhesive
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000004888 barrier function Effects 0.000 title claims abstract description 175
- 239000000853 adhesive Substances 0.000 title claims abstract description 142
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 141
- 239000002105 nanoparticle Substances 0.000 title claims abstract description 115
- 239000000203 mixture Substances 0.000 title claims abstract description 112
- 239000010408 film Substances 0.000 claims abstract description 82
- 229920005989 resin Polymers 0.000 claims abstract description 79
- 239000011347 resin Substances 0.000 claims abstract description 79
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 57
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 26
- 230000003287 optical effect Effects 0.000 claims abstract description 23
- 239000003463 adsorbent Substances 0.000 claims abstract description 18
- 239000007789 gas Substances 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 16
- 239000001301 oxygen Substances 0.000 claims abstract description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000010409 thin film Substances 0.000 claims abstract description 4
- -1 polyethylene terephthalate Polymers 0.000 claims description 43
- 229920000642 polymer Polymers 0.000 claims description 38
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 20
- 239000000292 calcium oxide Substances 0.000 claims description 16
- 230000005661 hydrophobic surface Effects 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 229910044991 metal oxide Inorganic materials 0.000 claims description 11
- 150000004706 metal oxides Chemical class 0.000 claims description 11
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 10
- 150000001282 organosilanes Chemical class 0.000 claims description 7
- 239000002594 sorbent Substances 0.000 claims description 7
- 229920005549 butyl rubber Polymers 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 55
- 239000000463 material Substances 0.000 abstract description 24
- 239000007787 solid Substances 0.000 abstract description 10
- 239000002274 desiccant Substances 0.000 abstract description 4
- 239000002096 quantum dot Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 80
- 238000012360 testing method Methods 0.000 description 40
- 230000000052 comparative effect Effects 0.000 description 29
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 24
- 239000011575 calcium Substances 0.000 description 21
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 20
- 239000013032 Hydrocarbon resin Substances 0.000 description 20
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 20
- 229920006270 hydrocarbon resin Polymers 0.000 description 20
- 239000000243 solution Substances 0.000 description 20
- 229910052791 calcium Inorganic materials 0.000 description 18
- 238000000576 coating method Methods 0.000 description 18
- 239000000377 silicon dioxide Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 15
- 238000004381 surface treatment Methods 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 230000032683 aging Effects 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 229920005987 OPPANOL® Polymers 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000010276 construction Methods 0.000 description 10
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- 239000012756 surface treatment agent Substances 0.000 description 8
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 7
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000003208 petroleum Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 150000004756 silanes Chemical class 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 229920002461 Oppanol® B 50 SF Polymers 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- 239000003607 modifier Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 229920000962 poly(amidoamine) Polymers 0.000 description 4
- 238000002203 pretreatment Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 238000001246 colloidal dispersion Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 239000004005 microsphere Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229920003051 synthetic elastomer Polymers 0.000 description 3
- 239000005061 synthetic rubber Substances 0.000 description 3
- UWSYCPWEBZRZNJ-UHFFFAOYSA-N trimethoxy(2,4,4-trimethylpentyl)silane Chemical compound CO[Si](OC)(OC)CC(C)CC(C)(C)C UWSYCPWEBZRZNJ-UHFFFAOYSA-N 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 241001012508 Carpiodes cyprinus Species 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- IAXXETNIOYFMLW-GYSYKLTISA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C(=C)C)C[C@@H]1C2(C)C IAXXETNIOYFMLW-GYSYKLTISA-N 0.000 description 2
- PSGCQDPCAWOCSH-BREBYQMCSA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] prop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C=C)C[C@@H]1C2(C)C PSGCQDPCAWOCSH-BREBYQMCSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000006184 cosolvent Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000005660 hydrophilic surface Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000013047 polymeric layer Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005995 polystyrene-polyisobutylene Polymers 0.000 description 2
- 150000003097 polyterpenes Chemical class 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- MXFQRSUWYYSPOC-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(C)(C)COC(=O)C=C MXFQRSUWYYSPOC-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- IDXCKOANSQIPGX-UHFFFAOYSA-N (acetyloxy-ethenyl-methylsilyl) acetate Chemical compound CC(=O)O[Si](C)(C=C)OC(C)=O IDXCKOANSQIPGX-UHFFFAOYSA-N 0.000 description 1
- ROZDMUUELHCVQC-ARJAWSKDSA-N (z)-4-oxo-4-(2-prop-2-enoyloxyethoxy)but-2-enoic acid Chemical compound OC(=O)\C=C/C(=O)OCCOC(=O)C=C ROZDMUUELHCVQC-ARJAWSKDSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- ZVDJGAZWLUJOJW-UHFFFAOYSA-N 1-(4-ethenylphenyl)ethyl-trimethoxysilane Chemical compound CO[Si](OC)(OC)C(C)C1=CC=C(C=C)C=C1 ZVDJGAZWLUJOJW-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- VJGCZWVJDRIHNC-UHFFFAOYSA-N 1-fluoroprop-1-ene Chemical compound CC=CF VJGCZWVJDRIHNC-UHFFFAOYSA-N 0.000 description 1
- WKWMHWFRQPMDKB-UHFFFAOYSA-N 2-(2-ethyl-3-oxopent-4-enoxy)carbonylbenzoic acid Chemical compound C=CC(=O)C(CC)COC(=O)C1=CC=CC=C1C(O)=O WKWMHWFRQPMDKB-UHFFFAOYSA-N 0.000 description 1
- DDCZDOQDCVFONM-UHFFFAOYSA-N 2-(2-phenoxyethoxycarbonyl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCCOC1=CC=CC=C1 DDCZDOQDCVFONM-UHFFFAOYSA-N 0.000 description 1
- XQTQTURAYCRAJY-UHFFFAOYSA-N 2-(2-phenylsulfanylethoxycarbonyl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCCSC1=CC=CC=C1 XQTQTURAYCRAJY-UHFFFAOYSA-N 0.000 description 1
- RKYJPYDJNQXILT-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxycarbonyl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCCOC(=O)C=C RKYJPYDJNQXILT-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- ARIYNWGPLSXJMC-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxycarbonyl]benzoic acid Chemical compound COCCOCCOC(=O)C1=CC=CC=C1C(O)=O ARIYNWGPLSXJMC-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- UHKPXKGJFOKCGG-UHFFFAOYSA-N 2-methylprop-1-ene;styrene Chemical compound CC(C)=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 UHKPXKGJFOKCGG-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- JSOZORWBKQSQCJ-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(C)CCCOC(=O)C(C)=C JSOZORWBKQSQCJ-UHFFFAOYSA-N 0.000 description 1
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- UZDMJPAQQFSMMV-UHFFFAOYSA-N 4-oxo-4-(2-prop-2-enoyloxyethoxy)butanoic acid Chemical compound OC(=O)CCC(=O)OCCOC(=O)C=C UZDMJPAQQFSMMV-UHFFFAOYSA-N 0.000 description 1
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
- FPDQDSFHCDCRFC-UHFFFAOYSA-N 5-oxo-5-(2-prop-2-enoyloxyethoxy)pentanoic acid Chemical compound OC(=O)CCCC(=O)OCCOC(=O)C=C FPDQDSFHCDCRFC-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 239000004821 Contact adhesive Substances 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004819 Drying adhesive Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 241001304235 Phedina borbonica Species 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 241000723104 Progne subis Species 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- QROGIFZRVHSFLM-QHHAFSJGSA-N [(e)-prop-1-enyl]benzene Chemical compound C\C=C\C1=CC=CC=C1 QROGIFZRVHSFLM-QHHAFSJGSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910001622 calcium bromide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 1
- 238000009837 dry grinding Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- FEHYCIQPPPQNMI-UHFFFAOYSA-N ethenyl(triphenoxy)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(C=C)OC1=CC=CC=C1 FEHYCIQPPPQNMI-UHFFFAOYSA-N 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- JEWCZPTVOYXPGG-UHFFFAOYSA-N ethenyl-ethoxy-dimethylsilane Chemical compound CCO[Si](C)(C)C=C JEWCZPTVOYXPGG-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- DYFMAHYLCRSUHA-UHFFFAOYSA-N ethenyl-tris(2-methylpropoxy)silane Chemical compound CC(C)CO[Si](OCC(C)C)(OCC(C)C)C=C DYFMAHYLCRSUHA-UHFFFAOYSA-N 0.000 description 1
- GBFVZTUQONJGSL-UHFFFAOYSA-N ethenyl-tris(prop-1-en-2-yloxy)silane Chemical compound CC(=C)O[Si](OC(C)=C)(OC(C)=C)C=C GBFVZTUQONJGSL-UHFFFAOYSA-N 0.000 description 1
- BQRPSOKLSZSNAR-UHFFFAOYSA-N ethenyl-tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C=C BQRPSOKLSZSNAR-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006379 extruded polypropylene Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- WOLATMHLPFJRGC-UHFFFAOYSA-N furan-2,5-dione;styrene Chemical compound O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 WOLATMHLPFJRGC-UHFFFAOYSA-N 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 229920006262 high density polyethylene film Polymers 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 229910052588 hydroxylapatite Inorganic materials 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910001872 inorganic gas Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910001463 metal phosphate Inorganic materials 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002077 nanosphere Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 239000000825 pharmaceutical preparation Substances 0.000 description 1
- 229940127557 pharmaceutical product Drugs 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 238000004375 physisorption Methods 0.000 description 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006260 polyaryletherketone Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- MSFGZHUJTJBYFA-UHFFFAOYSA-M sodium dichloroisocyanurate Chemical compound [Na+].ClN1C(=O)[N-]C(=O)N(Cl)C1=O MSFGZHUJTJBYFA-UHFFFAOYSA-M 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- PADYPAQRESYCQZ-UHFFFAOYSA-N triethoxy-(4-methylphenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=C(C)C=C1 PADYPAQRESYCQZ-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/383—Natural or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
- B01J20/04—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of alkali metals, alkaline earth metals or magnesium
- B01J20/041—Oxides or hydroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28002—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their physical properties
- B01J20/28004—Sorbent size or size distribution, e.g. particle size
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
- B01J20/28016—Particle form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/221—Presence of unspecified polymer in the barrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
本发明提出了一种阻隔性粘合剂组合物,所述阻隔性粘合剂组合物包含聚异丁烯树脂、疏水性纳米粒子(例如硅烷改性的二氧化硅纳米粒子)和吸附剂纳米粒子(例如用作干燥剂和/或吸气材料的CaO)。在一个优选的实施方案中,所述阻隔性粘合剂组合物设置在阻气膜上以形成粘合性阻挡膜。所述粘合性阻挡膜然后可用于保护OLED显示器和固态照明、太阳能电池、电泳和电致变色显示器、薄膜电池、量子点器件、传感器(例如,触摸传感器)和其它有机电子器件免受氧气和水分的损害。所述粘合性阻挡膜尤其非常适合需要保护免受氧气和水分损害以及柔韧性和良好光学透射性的应用。
Description
技术领域
本发明涉及阻隔性粘合剂组合物和粘合性阻挡膜。
背景技术
有机电子器件需要受保护以免受水分和氧气的危害,以便为商业应用提供足够长的寿命。因此,使用封装剂来保护器件不接触水分和氧气。玻璃是一种常用的封装剂,但玻璃大大损害了器件的柔韧性。因此,期望用柔韧性阻挡膜替代玻璃。柔韧性阻挡膜可实现柔韧性器件以及更轻、更薄、更坚固的刚性器件。
柔韧性阻挡膜已经在商业上常用于有机电子器件中。柔韧性阻挡膜通常被层合至将使用粘合剂保护的器件。因此,重要的是粘合剂还具有良好的阻挡性能以使水分和氧气结合线边缘入口最小。一些阻隔性粘合剂(诸如例如在美国专利申请公布No.US 2014/0377554(Cho等人)中所描述的那些)包括作为“水分阻滞剂”的纳米粘土。其它阻隔性粘合剂(诸如例如在美国专利No.6,936,131(McCormick等人)中所描述的那些)包括干燥剂和/或吸气材料以吸收和/或吸附氧气和/或水分。
发明内容
根据上述情况,我们认识到,特别苛刻的有机电子器件应用(诸如例如长寿命有机发光二极管(OLED)显示器)需要改善的阻隔性粘合剂。
简言之,在一个方面,本发明提供了包含聚异丁烯树脂、疏水性纳米粒子和吸附剂纳米粒子的阻隔性粘合剂组合物。
如本文所用,术语“纳米粒子”是指具有小于约1000nm尺寸的任何形状(例如,纳米球、纳米管等)的粒子;并且术语“吸附剂”是指用于吸收或吸附液体或气体(诸如氧气或水分)的材料。
在另一个方面,本发明提供了包含下列物质的阻隔性粘合剂组合物:约50重量%至约75重量%的粘均分子量为约300,000g/mol至约900,000g/mol的聚异丁烯树脂、约1重量%至约10重量%的疏水性表面改性纳米二氧化硅、约1重量%至约5重量%的氧化钙纳米粒子和约10重量%至约25重量%的增粘剂,上述量都是相对于组合物的总重量计的。
在又一个方面,本发明提供了粘合性阻挡膜以及阻隔性粘合剂制品,该粘合性阻挡膜包括设置在阻气膜上的本发明阻隔性粘合剂组合物层,该阻隔性粘合剂制品包括设置在隔离层之间的本发明阻隔性粘合剂组合物层。
已发现,与未填充聚异丁烯粘合剂或填充有疏水性纳米粒子或吸附剂纳米粒子中任一者的聚异丁烯粘合剂相比,填充有疏水性纳米粒子和吸附剂纳米粒子的本发明聚异丁烯粘合剂组合物提供阻挡性能方面显著的改善。令人惊讶的是,即使与具有较高疏水性纳米粒子或吸附剂纳米粒子中任一者负载的聚异丁烯粘合剂相比,也观察到这种改善。
附图说明
图1为阻挡膜构造的示意图。
图2为封装有机器件的示意图。
图3为用于实施例中的阻挡膜构造的示意图。
图4为用于实施例中的钙测试的层合构造的示意图。
图5为用于实施例中的钙测试的层合构造的平面视图。
图6a至图6c示出了来自实施例的钙测试样本的照片。
图7为在加速老化条件下随时间推移光密度损失百分比的曲线。
图8为在加速老化条件下随时间推移光密度损失百分比的曲线。
图9a至图9f示出了钙测试样本的照片。
具体实施方式
本发明的阻隔性粘合剂组合物包含聚异丁烯树脂。聚异丁烯树脂通常具有约40,000g/mol至约2,600,000g/mol的粘均分子量。在一些实施方案中,聚异丁烯树脂具有约300,000g/mol至约900,000g/mol的粘均分子量。在一些实施方案中,树脂体系包括粘均分子量为约300,000g/mol至约500,000g/mol、约350,000g/mol至约450,000g/mol或约400,000g/mol的第一聚异丁烯树脂与(b)粘均分子量为约700,000g/mol至约900,000g/mol、约650,000g/mol至约850,000g/mol或约800,000g/mol的第二聚异丁烯树脂的共混物。
粘均分子量(Mv)通常基于Staudinger指数。Staudinger指数Jo(cm3/g)由20℃下通过Ubbelohde粘度计的毛细管I的流动时间计算。
Jo=ηsp/c(1+0.31×ηsp)cm3/g(Schulz-Blaschke等式)
ηsp=t/to–1(比粘度)
t=溶液的流动时间,用Hagenbach Couette校正
to=溶剂的流动时间,用Hagenbach Couette校正
c=以g/cm3表示的溶液浓度
粘均分子量根据公式Jo=3.06*10-2*Mv 0.65来计算
在一些实施方案中,树脂体系包含相对于树脂体系的总重量计约65重量%至约85重量%的聚异丁烯树脂。在一些实施方案中,树脂体系包含相对于树脂体系的总重量计约15重量%至约35重量%、约20重量%至约30重量%或约25重量%的第一聚异丁烯树脂。在一些实施方案中,树脂体系包含相对于树脂体系的总重量计约40重量%至约60重量%、约45重量%至约55重量%或约50重量%的第二聚异丁烯树脂。
聚异丁烯树脂通常为在主链或侧链中具有聚异丁烯树脂骨架的树脂。在一些实施方案中,聚异丁烯树脂基本上为异丁烯的均聚物,诸如例如,可以商品名OPPANOL(巴斯夫公司(BASF AG))和GLISSO-PAL(巴斯夫公司(BASF AG))购得的聚异丁烯树脂。合适的可商购获得的聚异丁烯树脂的示例包括OPPANOL B15(Mv=85,000)、OPPANOL B50(Mv=400,000)、含稳定剂的OPPANOL B50SF(Mv=400,000)、OPPANOL N50(Mv=425,000)、含稳定剂的OPPANOL N50SF(Mv=425,000)、OPPANOL B80(Mv=800,000)和OPPANOL N80(Mv=800,000)。在一些实施方案中,聚异丁烯树脂包含异丁烯的共聚物,诸如例如,其中异丁烯与另一种单体共聚的合成橡胶。合成橡胶包括丁基橡胶,该丁基橡胶是大部分异丁烯与少量异戊二烯的共聚物,诸如例如,可以商品名VISTANEX(埃克森化学公司(Exxon ChemicalCo.))和JSR BUTYL(日本丁基聚合物有限公司(Japan Butyl Co.,Ltd.))购得的丁基橡胶。合成橡胶还包括大部分异丁烯与苯乙烯、正丁烯或丁二烯的共聚物。在一些实施方案中,可使用异丁烯均聚物和丁基橡胶的混合物。其它可用的共聚物包括以商品名SIBSTAR(Kaneka公司(Kaneka Corporation))购得的苯乙烯-异丁烯二嵌段共聚物(SIB)和苯乙烯-异丁烯-苯乙烯三嵌段共聚物(SIBS)。
例如,第一聚异丁烯树脂可包括异丁烯的均聚物,并且第二聚异丁烯可包括丁基橡胶,或者第一聚异丁烯可包括丁基橡胶,并且第二聚异丁烯可包括异丁烯的均聚物。第一和第二聚异丁烯树脂各包括不止一种树脂。
聚异丁烯树脂通常具有与氢化脂环族烃类树脂类似的溶解度参数(SP值,该参数为表征化合物极性的指数),并与氢化脂环族烃类树脂(如果使用的话)具有良好的相容性(即可混和性),所以可形成透明膜。此外,聚异丁烯树脂具有低表面能,因此可使粘合剂能铺展在粘合物上,并最大程度减少界面处的空隙生成。另外,聚异丁烯树脂的玻璃化转变温度和水分渗透性均较低,因此其适宜用作粘合剂封装组合物的基础树脂。
聚异丁烯树脂可具有理想的粘弹性,该粘弹性通常可用于赋予粘合剂封装组合物所需的流动性。可使用应变流变仪来确定各种温度下的弹性(储能)模量G’和粘性(损耗)模量G”。然后可使用G’和G”来确定比率tan(δ)=G”/G’。一般来讲,tan(δ)值越高,材料就越类似粘滞材料;tan(δ)值越低,材料就越类似弹性固体。在一些实施方案中,可选择聚异丁烯树脂,使得当粘合剂封装组合物在约70℃至约110℃的温度下时,组合物于较低频率下具有至少约0.5的tan(δ)值。以此方式,组合物能够在不平的表面上充分流动,并只含有很少量的内部气泡或完全不含内部气泡。
本发明的阻隔性粘合剂组合物可任选地还包含增粘剂。一般来讲,增粘剂可为增强粘合剂封装组合物粘着性的任何化合物或化合物的混合物。理想的是增粘剂不会增强水分渗透性。增粘剂可包括氢化的烃类树脂、部分氢化的烃类树脂、非氢化的烃类树脂或它们的组合。优选的是,增粘剂包括氢化石油树脂。在一些实施方案中,粘合剂组合物包含相对于组合物的总重量计约15重量%至约35重量%、约20重量%至约30重量%或约25重量%的增粘剂。
增粘剂的例子包括但不限于氢化萜烯基树脂(例如,以商品名CLEARON P、M和K(Yasuhara Chemical)市售的树脂);氢化的树脂或氢化酯基树脂(例如,以商品名FORAL AX(Hercules Inc.)、FORAL 105(Hercules Inc.)、PENCEL A(Arakawa ChemicalIndustries.Co.,Ltd.);ESTERGUM H(Arakawa Chemical Industries Co.,Ltd.)和SUPERESTER A(Arakawa Chemical Industries.Co.,Ltd.);不成比例的树脂或不成比例的酯基树脂(例如,以商品名PINECRYSTAL(Arakawa Chemical Industries Co.,Ltd.)市售的树脂);氢化的二环戊二烯基树脂,其为C5型石油树脂的氢化树脂,其中C5型石油树脂是由石脑油热分解产生的C5级分(例如戊烯、异戊二烯、胡椒碱和1,3-戊二烯)共聚获得(例如,以商品名ESCOREZ5300和5400系列(Exxon Chemical Co.)、EASTOTAC H(Eastman ChemicalCo.)市售的树脂);部分氢化的芳族改性二环戊二烯基树脂(例如,以商品名ESCOREZ 5600(Exxon Chemical Co.)市售的树脂);对C9型石油树脂进行氢化得到的树脂,其中C9型石油树脂是由石脑油热分解产生的C9级分(例如茚、乙烯基甲苯以及α-或β-甲基苯乙烯)共聚获得的(例如,以商品名ARCON P或ARCON M(荒川化学工业株式会社(Arakawa ChemicalIndustries Co.,Ltd.)市售的树脂);以及对上述C5级分和C9级分的共聚合石油树脂进行氢化得到的树脂(例如,以商品名IMARV(Idemitsu Petrochemical Co.)市售的树脂)。
非氢化的烃类树脂包括C5、C9、C5/C9烃类树脂、聚萜烯树脂、芳族改性的聚萜烯树脂或松香衍生物。如果使用非氢化的烃类树脂,则通常将其与另一种氢化的或部分氢化的增粘剂联合使用。
在一些实施例中,增粘剂包含氢化的烃类树脂,特别是氢化的脂环族烃类树脂。氢化的脂环族烃类树脂的具体例子包括ESCOREZ5340(Exxon Chemical)。在一些实施例中,氢化的脂环族烃类树脂为氢化的二环戊二烯基树脂,这是因为该树脂具有较低的水分渗透性和透射率。可用于粘合剂封装组合物的氢化脂环族烃类树脂的重均分子量通常为约200g/mol至5,000g/mol。在另一个实施方案中,氢化的脂环族烃类树脂的重均分子量为约500g/mol至3,000g/mol。如果重均分子量超过5,000g/mol,则会导致增粘作用变差,或者与聚异丁烯树脂的相容性会降低。
增粘剂具有软化温度或软化点(环球法软化温度),该软化温度可至少部分地根据组合物的粘合力、使用的温度、生产的容易性等而变化。环球法软化温度通常可为约50至200℃。在一些实施方案中,环球法软化温度为约80至150℃。如果环球法软化温度小于80℃,则增粘剂会在因电子器件发光时产生的热而发生分离并液化。当有机电致发光器件直接用粘合剂封装组合物进行封装时,这会导致有机层(例如发光层)劣化。另一方面,如果环球法软化点超过150℃,则添加的增粘剂的量是如此之低,以至于不会获得令人满意的相关特性的改善。
在一些实施例中,增粘剂包含氢化的烃类树脂,特别是氢化的脂环族烃类树脂。氢化的脂环族烃类树脂的具体示例包括ESCOREZ 5300和ESCOREZ 5340(埃克森化学(ExxonChemical))。在一些实施例中,氢化的脂环族烃类树脂为氢化的二环戊二烯基树脂,这是因为该树脂具有较低的水分渗透性和透射率。可用于粘合剂封装组合物的氢化脂环族烃类树脂的重均分子量通常为约200g/mol至5,000g/mol。在另一个实施方案中,氢化的脂环族烃类树脂的重均分子量为约500g/mol至3,000g/mol。如果重均分子量超过5,000g/mol,则会导致增粘作用变差,或者与聚异丁烯树脂的相容性会降低。
本发明的阻隔性粘合剂组合物包括疏水性纳米粒子。在一些实施方案中,疏水性纳米粒子为具有疏水性表面处理的无机或有机纳米粒子,诸如美国专利No.8,834,618(Baran,Jr.等人)中所描述的那些。
通常,纳米粒子的平均原生或团聚粒径为小于100纳米。“团聚”是指原生粒子之间的弱缔合作用,它们可以通过电荷或极性保持在一起,并且可分解成较小个体。“原生粒度”是指单个(非聚集、非团聚)粒子的平均直径。在一些实施方案中,纳米粒子的平均粒度为不大于100纳米、75纳米或50纳米。纳米粒子的平均原生或团聚粒径通常为至少1纳米或至少3纳米。在一些优选的实施方案中,平均原生或团聚粒度为小于20nm、15nm或10nm。可基于透射电子显微镜(TEM)测量纳米粒子。
与包含二氧化硅聚集体的热解法二氧化硅不同,本文使用的纳米粒子包含足够浓度的离散非聚集纳米粒子。本文相对于粒子所用的“聚集体”是指强力粘合或熔凝的粒子,其中所得的外表面积可以显著小于各个组分的计算的表面积之和。将聚集体保持在一起的力是很强的力,例如共价键,或由烧结或复杂物理缠结产生的力。尽管可以(例如)通过施加表面处理使团聚的纳米粒子分解成较小个体,例如离散的原生粒子,但对聚集体施加表面处理仅仅会形成经过表面处理的聚集体。在一些实施方案中,大多数纳米粒子(即,至少50%)作为离散的非团聚纳米粒子存在。例如,至少70%、80%或90%的纳米粒子作为离散的非聚集纳米粒子存在。
示例性的无机纳米粒子材料包括(例如)金属磷酸盐、磺酸盐和碳酸盐(如碳酸钙、磷酸钙、羟基-磷灰石);金属氧化物(如氧化锆、二氧化钛、二氧化硅、二氧化铈、氧化铝、氧化铁、氧化钒、氧化锌、氧化锑、氧化锡和氧化铝-二氧化硅)和金属(如金、银或其他贵金属)。
纳米粒子的形状通常为大致球形。然而,作为另外一种选择,可采用其它形状如细长形状。就细长形而言,纵横比通常为小于或等于10,更通常小于或等于3。
在一些实施方案中,纳米粒子可包含有机材料。可用的有机材料的具体实例包括(如烷基化)巴克球(富勒烯)和(如烷基化)聚酰氨基胺(PAMAM)树枝状聚合物。富勒烯的具体示例包括C60、C70、C82和C84。PAMAM树枝状聚合物的具体示例包括购自威斯康星州密尔沃基的奥德里奇化学公司(Aldrich Chemical Company,Milwaukee,Wis)的2至10代(G2G10)的那些树枝状聚合物。目前市售的PAMAM树枝状聚合物具有C12表面官能团。有机分子上的烷基基团可以是直链或支链的,并可以在至少C3至不大于C30的范围内,并可以是C3与C30之间的任何大小或范围。例如,范围可以为C3至C22;C3至C18;C3至C12;或C3至C8,以及它们之间的任何组合或整体。表面改性有机分子可以至少0.1重量%的水平存在于乳液的连续相中,诸如美国专利No.7,001,580(Baran,Jr.等人)中所述。
有机聚合物微球的具体实例包括微球,所述微球包含作为粉末或分散体的聚苯乙烯(得自Bangs Laboratories,Inc.(Fishers,Ind.))。聚苯乙烯微球的平均粒度为在至少20nm至不大于60nm的范围内。目前市售的平均粒度为20、30、50和60nm。
当纳米粒子由有机材料构成时,根据有机材料的疏水性,纳米粒子可以在不存在表面处理的情况下具有足够的疏水性。
在一些实施例中,纳米粒子优选地包含无机材料,例如金属氧化物。各种纳米粒子可商购获得。在一些实施例中,纳米粒子包含二氧化硅、氧化锆或它们的混合物。二氧化硅纳米粒子的商业来源可得自伊利诺伊州纳波维尔的纳尔科公司(Nalco Co,Naperville,IL)。也可以使用本领域中已知的技术来制备纳米粒子。例如,可以用水热技术制备氧化锆纳米粒子,如WO2009/085926中所述。
在一些实施方案中,(例如,未表面改性的)纳米粒子可呈胶态分散体的形式。例如,胶态二氧化硅分散体可以商品名“NALCO 1040”、“NALCO 1050”、“NALCO 1060”、“NALCO2327”和“NALCO2329”得自Nalco Co.。氧化锆纳米粒子分散体可以商品名“NALCO OOSSOO8”得自纳尔科化工公司(Nalco Chemical Co.),以及以商品名“Buhler zirconia Z-WO”得自布勒公司(Buhler AG)(Uzwil,Switzerland)。可以将一些胶态分散体(尤其是表面改性的纳米粒子)进行干燥,从而得到用于干磨工艺的纳米粒子。
纳米粒子可被完全凝聚。充分凝结的纳米粒子(除二氧化硅之外)的结晶度(以分离的金属氧化物粒子的形式测量)通常大于55%、优选地大于60%,并且更优选地大于70%。例如,结晶度可在至多约86%或更高的范围内。结晶度可通过X射线衍射技术来确定。凝结的晶体(例如,氧化锆)纳米粒子具有高折射率,而无定形的纳米粒子通常具有低折射率。
无机(如金属氧化物)纳米粒子通常是本身亲水的。用疏水性表面处理进行表面改性时,便使纳米粒子具有疏水性。
表面改性涉及将表面改性剂附着到无机氧化物粒子上,以改变表面特性。通常,表面处理具有第一末端和第二末端,第一末端(共价地、离子化地或通过强物理吸附)附着到纳米粒子表面,第二末端赋予可防止粒子凝聚(例如永久性地融凝在一起)的空间稳定性。表面改性的纳入还可改善粒子与其它材料的相容性。例如,有机端基(例如有机硅烷的有机基团)可以提高粒子与有机基质材料(例如可聚合树脂和热塑性树脂)的相容性。
表面处理剂的示例包括醇、胺、羧酸、磺酸、膦酸、硅烷和钛酸盐。处理剂的优选类型部分地由(例如,金属氧化物)纳米粒子表面的化学性质决定。对于二氧化硅和其它硅质填料来说,硅烷是优选的。硅烷和羧酸对于金属氧化物诸如氧化锆来说是优选的。当对金属氧化物纳米粒子施加有机硅烷表面处理时,硅烷端通常被纳米粒子吸附。当将羧酸施加到氧化锆纳米粒子时,酸端通常被氧化锆吸附。示例性的硅烷(例如,有机硅烷)包括(但不限于):烷基三烷氧基硅烷,如正辛基三甲氧基硅烷、正辛基三乙氧基硅烷、异辛基三甲氧基硅烷、十二烷基三甲氧基硅烷、十八烷基三甲氧基硅烷、丙基三甲氧基硅烷和己基三甲氧基硅烷;甲基丙烯酰氧基烷基三烷氧基硅烷或丙烯酰氧基烷基三烷氧基硅烷,如3-甲基丙烯酰氧基丙基三甲氧基硅烷、3-丙烯酰氧丙基三甲氧基硅烷和3-(甲基丙烯酰氧基)丙基三乙氧基硅烷;甲基丙烯酰氧基烷基烷基二烷氧基硅烷或丙烯酰氧基烷基烷基二烷氧基硅烷,如3-(甲基丙烯酰氧基)丙基甲基二甲氧基硅烷和3-(丙烯酰氧丙基)甲基二甲氧基硅烷;甲基丙烯酰氧基烷基二烷基烷氧基硅烷或丙烯酰氧基烷基二烷基烷氧基硅烷,如3-(甲基丙烯酰氧基)丙基二甲基乙氧基硅烷;巯烷基三烷氧基硅烷,如3-巯丙基三甲氧基硅烷;芳基三烷氧基硅烷,例如苯乙烯基乙基三甲氧基硅烷、苯基三甲氧基硅烷、苯基三乙氧基硅烷、和对甲苯基三乙氧基硅烷;乙烯基硅烷,如乙烯基甲基二乙酰氧基硅烷、乙烯基二甲基乙氧基硅烷、乙烯基甲基二乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三乙酰氧基硅烷、乙烯基三异丙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三苯氧基硅烷、乙烯基三叔丁氧基硅烷、乙烯基三(异丁氧基)硅烷、乙烯基三异丙烯氧基硅烷和乙烯基三(2-甲氧基乙氧基)硅烷;以及它们的组合。
在优选的实施例中,通过用有机硅烷进行表面处理赋予纳米粒子疏水性,其中有机硅烷包含烷基。烷基优选地包含的碳原子数为至少4或5。此类烷基可以是支链的或环状的,但通常为直链烷基。当烷基的链长增大时,疏水性通常会提高。在一些优选的实施例中,烷基包含的碳原子数为至少6、7或8。烷基通常包含的碳原子数为不大于26。烷基的非限制性实例包括丁基、异丁基、仲丁基、戊基、异戊基、新戊基、己基、2-乙基己基、辛基、癸基、十一烷基、十二烷基、十四烷基、十五烷基、十八烷基、环己基、4-甲基环己基、环己基甲基、环戊基和环辛基。烷基可以任选地包含其它取代基。在一些实施例中,此类取代基可以是疏水性取代基。然而,亲水性取代基可以任选地存在,前提条件是烷基硅烷足够疏水,使得吸水性(如吸水性/BET表面积)降低。
羧酸表面改性剂可以包括邻苯二甲酸酐与具有羟基的有机化合物的反应产物。合适的示例包括(例如)邻苯二甲酸单-(2-苯基硫烷基-乙基)酯、邻苯二甲酸单-(2-苯氧基-乙基)酯或邻苯二甲酸单-[2-(2-甲氧基-乙氧基)-乙基]酯。在一些示例中,具有羟基的有机化合物是(甲基)丙烯酸羟烷基酯,例如(甲基)丙烯酸羟乙酯、(甲基)丙烯酸羟丙酯或(甲基)丙烯酸羟丁酯。示例包括但不限于琥珀酸单-(2-丙烯酰氧基-乙基)酯、马来酸单-(2-丙烯酰氧基-乙基)酯、戊二酸单-(2-丙烯酰氧基-乙基)酯、邻苯二甲酸单-(2-丙烯酰氧基-乙基)酯和邻苯二甲酸单-(2-丙烯酰-丁基)酯。还有的其它示例包括单-(甲基)丙烯酰氧基聚乙二醇琥珀酸酯以及由马来酸酐、戊二酸酐和邻苯二甲酸酐制成的类似材料。
又如,表面改性剂为聚己内酯与琥珀酸酸酐的反应产物,例如WO2010/074862中所述。
多种其他表面处理剂是本领域已知的,例如WO2007/019229中所述;这些专利以引用方式并入本文。
表面处理剂可以包括两种或更多种疏水性表面处理剂的共混物。例如,表面处理剂可以包括至少一种具有相对较长的取代的或未取代的烃基的表面处理剂。在一些实施方案中,表面处理剂包含至少一个碳原子数为至少6或8的烃基,例如异辛基三甲氧基硅烷,其中第二表面处理剂不太疏水,例如甲基三甲氧基硅烷。
表面处理剂还可以包括疏水性表面处理剂与(如浓度小的)亲水性表面处理剂的共混物,前提条件是添加此类亲水性表面处理剂的步骤不会降低疏水性表面处理剂对吸水性的抑制效果。
通常在纳米粒子与粒子混合之前将纳米粒子与表面改性剂混合。表面改性剂的量取决于若干因素,如纳米粒子尺寸、纳米粒子类型、表面改性剂的分子量和改性剂类型。一般来说,优选将大致单层的改性剂附接到纳米粒子的表面。附接程序或反应条件也取决于所用的表面改性剂。对于硅烷而言,优选的是在酸性或碱性的高温条件下进行约1-24小时的表面处理。表面处理剂如羧酸不需要高温或长时间。
胶态分散体中纳米粒子的表面改性可以多种方式实现。该过程包括将无机分散体与表面改性剂混合。可任选地,此时可加入助溶剂,例如1-甲氧基-2-丙醇、甲醇、乙醇、异丙醇、乙二醇、N,N-二甲基乙酰胺、1-甲基-2-吡咯烷酮以及它们的混合物。助溶剂可提高表面改性剂的溶解度以及表面改性纳米粒子的分散性。含有无机溶胶和表面改性剂的混合物随后在室温或高温、搅拌或不搅拌的条件下发生反应。
阻隔性粘合剂组合物通常包含相对于组合物的总重量计约1重量%至约10重量%、约2重量%至约5重量%的疏水性纳米粒子。
本发明的阻隔性粘合剂组合物还包含吸附剂纳米粒子诸如纳米尺寸干燥剂和/或吸气材料以吸收和/或吸附氧气和/或水分。
合适的干燥剂的示例包括脱水金属卤化物、盐、硅酸盐、氧化物、氢氧化物、卤化物、硫酸盐、过氯酸盐、碳酸盐和活性炭。具体的示例包括氯化钴、氯化钙、溴化钙、氯化锂、氯化锌、溴化锌、二氧化硅(硅胶)、氧化铝(活性氧化铝)、硫酸钙、硫酸铜、碳酸钾、碳酸镁、二氧化钛、膨润土、酸性粘土、蒙脱土、硅藻土(粘土矿物)二氧化硅氧化铝、沸石、二氧化硅、氧化锆、活性炭、五氧化二磷、硫酸镁和碱土金属氧化物(诸如氧化钡、氧化钙、氧化铁和氧化镁)。
合适的吸气材料的示例包括微细金属(诸如Al、Fe、Mg和Mn)。
在一些实施方案中,氧化钙是优选的吸附剂材料。在一些实施方案中,吸附剂材料具有不大于约200nm(例如约1至约200nm)的平均粒度。
阻隔性粘合剂组合物通常包含相对于组合物的总重量计约0.5重量%至约10重量%或约1重量%至约5重量%的吸附剂纳米粒子。
在一些实施方案中,本发明的阻隔性粘合剂组合物为溶剂基粘合剂。可使用溶解树脂的任何可用溶剂。合适的溶剂的示例包括庚烷、甲苯、二甲苯、苯、乙苯和己烷(优选庚烷、甲苯或它们的组合)。在一些实施方案中,优选的是溶剂具有低于约200℃的沸点。
在一些实施方案中,溶剂包含约40重量%至约95重量%、约65重量%至约95重量%、约70重量%至约90重量%、约75重量%至约85重量%或约80重量%的总阻隔性粘合剂组合物。
在一些实施方案中,本发明的阻隔性粘合剂组合物包含紫外线阻断剂。
本发明的阻隔性粘合剂组合物可通过本领域技术人员已知的各种方法来制备。例如,阻隔性粘合剂组合物可通过将上述组分完全混合来制备。可使用任意的混合机(例如捏合机或挤出机)来混合该组合物。在一些实施方案中,该组合物可例如通过下列步骤来制备:用溶剂制备树脂体系的混合物,将疏水性表面改性纳米粒子和吸附剂纳米粒子分散到溶剂中,然后将树脂混合物与纳米粒子分散体混合。
本发明的阻隔性粘合剂组合物表现出良好的可见光透过率和低雾度。在一些实施方案中,阻隔性粘合剂组合物具有大约90%或更大的可见光透过率。在一些实施方案中,阻隔性粘合剂组合物具有大约3%或更小的雾度。
本发明的阻隔性粘合剂组合物通常为不可固化或非反应性组合物。不可固化的组合物是有利的,因为它们不需要使用迁移物质(如引发剂)。它们还消除了对高温固化的需要,否则可损坏下面的器件。该组合物可为(例如)溶剂基干燥粘合剂、压敏粘合剂、触压粘合剂或热熔融粘合剂。优选地,该组合物为在干燥时硬化的溶剂基干燥粘合剂。随着溶剂蒸发,粘度增加并且粘合剂组合物硬化。
可通过任何可用的涂覆方法将本发明的阻隔性粘合剂组合物施加至基底、器件或任何器件部件上。溶剂基干燥粘合剂通常通过刷、棍、珠或带或喷雾器施加。可将阻隔性粘合剂组合物涂覆到适当的基底上以形成阻隔性粘合剂制品。
可将阻隔性粘合剂组合物例如涂覆到阻气膜上并使其干燥形成粘合性阻挡膜。阻气膜具有低氧渗透性,并且可用于帮助防止物品(诸如食品、电子产品和药物产品)通过与氧气接触而恶化。食品级阻气膜在20℃和65%相对湿度下通常具有小于约1cm3/m2/天的氧气透过率。优选地,阻气膜也具有对水分的阻挡性能。
聚合物型阻气膜的示例包括乙基乙烯醇共聚物(EVOH)膜,诸如聚乙烯EVOH膜和聚丙烯EVOH膜;聚酰胺膜,诸如共挤出的聚酰胺/聚乙烯膜、共挤出的聚丙烯/聚酰胺/聚丙烯膜;以及聚乙烯膜,诸如低密度、中等密度或高密度聚乙烯膜和共挤出的聚乙烯/乙烯醋酸乙烯酯膜。例如通过将一薄层金属(诸如铝)涂覆在聚合物膜上也可将聚合物型阻气膜金属化。
无机阻气膜的示例包括包含氧化硅、氮化硅、氮氧化硅、氧化铝、类金刚石膜、类金刚石玻璃和箔(如铝箔)的膜。
优选地,阻气膜是柔性的。对于一些应用,还优选的是,阻气膜可以是透可见光的。如本文所用,术语“透可见光的”意指在光谱的可见部分(例如,介于400nm和700nm之间)上的平均透射率为至少约80%,优选至少约88%或90%。
对于一些应用,需要保护免受水分和氧气的损害。对于特别敏感的应用,“超阻挡膜”可能是必要的。超阻挡膜在23℃和90%RH下通常具有小于约0.005cc/m2/天的氧气透过率,并且在23℃和90%RH下具有小于约0.005g/m2/天的水蒸气透过率。
一些超阻挡膜为包括设置在聚合物层之间的无机透可见光层的多层膜。合适的超阻挡膜的一个示例包括设置在聚合物之间的透可见光无机阻挡层,该聚合物的玻璃化转变温度(Tg)大于或等于热稳定聚对苯二甲酸乙二醇酯(HSPET)的玻璃化转变温度(Tg)。
可采用具有大于或等于HSPET的Tg的多种聚合物。尤其优选形成适当高的Tg聚合物的易挥发性单体。优选地,第一聚合物层具有大于PMMA的Tg,更优选地至少约110℃的Tg,还更优选地至少约150℃的Tg,以及最优选地至少约200℃的Tg。可用于形成第一层的特别优选的单体包括聚氨酯丙烯酸酯(例如,CN-968,Tg=约84℃,以及CN-983,Tg=约90℃,两者均可从沙多玛公司(Sartomer Co.)商购获得)、丙烯酸异冰片酯(例如,SR-506,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约88℃)、五丙烯酸二戊赤藓醇酯(例如,SR-399,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约90℃)、与苯乙烯共混的环氧丙烯酸酯(例如,CN-120S80,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约95℃)、二-三羟甲基丙烷四丙烯酸酯(例如,SR-355,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约98℃)、二乙二醇二丙烯酸酯(例如,SR-230,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约100℃)、1,3-丁二醇二丙烯酸酯(例如,SR-212,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约101℃)、五丙烯酸酯(例如,SR-9041,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约102℃)、季戊四醇四丙烯酸酯(例如,SR-295,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约103℃)、季戊四醇三丙烯酸酯(例如,SR-444,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约103℃)、乙氧基化(3)三羟甲基丙烷三丙烯酸酯(例如,SR-454,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约103℃)、乙氧基化(3)三羟甲基丙烷三丙烯酸酯(例如,SR-454HP,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约103℃)、烷氧基化三官能丙烯酸酯(例如,SR-9008,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约103℃)、二丙二醇二丙烯酸酯(例如,SR-508,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约104℃)、新戊二醇二丙烯酸酯(例如,SR-247,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约107℃)、乙氧基化(4)双酚a二甲基丙烯酸酯(例如,CD-450,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约108℃)、环己烷二甲醇二丙烯酸酯(例如,CD-406,可从沙多玛公司(SartomerCo.)商购获得,Tg=约110℃)、甲基丙烯酸异冰片酯(例如,SR-423,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约110℃)、环状二丙烯酸酯(例如,IRR-833,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约186℃)和三(2-羟基乙基)异氰尿酸酯三丙烯酸酯(例如,SR-368,可从沙多玛公司(Sartomer Co.)商购获得,Tg=约272℃),前述甲基丙烯酸酯的丙烯酸酯以及上述丙烯酸酯的甲基丙烯酸酯。
第一聚合物层可这样形成:通过将一层单体或低聚物施加至基底并使该层交联以原位形成聚合物,例如,通过辐射可交联单体的闪蒸和气相沉积,之后通过使用例如电子束装置、UV光源、放电装置或其它合适的器件来交联。可通过冷却载体来改善涂覆效率。也可以使用常规的涂布方法诸如辊涂(例如,凹版辊涂布)或喷涂(例如,静电喷雾涂布)将单体或低聚物施加至衬底,然后如上文所述进行交联。第一聚合物层也可通过施用溶剂中包含低聚物或聚合物的层以及干燥这样施用的层以取出溶剂来形成。如果提供在高温下具有玻璃态的聚合物层,其玻璃化转变温度大于或等于HSPET的玻璃化转变温度,也可采用等离子体聚合。最优选地,通过闪蒸和气相沉积随后通过原位交联来形成第一聚合物层,例如如以下文献中所述:美国专利No.4,696,719(Bischoff)、No.4,722,515(Ham)、No.4,842,893(Yializis等人)、No.4,954,371(Yializis)、No.5,018,048(Shaw等人)、No.5,032,461(Shaw等人)、No.5,097,800(Shaw等人)、No.5,125,138(Shaw等人)、No.5,440,446(Shaw等人)、No.5,547,908(Furuzawa等人)、No.6,045,864(Lyons等人)、No.6,231,939(Shaw等人)和No.6,214,422(Yializis);公布的PCT专利申请No.WO 00/26973(Delta V技术公司(Delta V Technologies,Inc.));D.G.Shaw和M.G.Langlois,“一种用于涂布纸和聚合物幅材的新型气相沉积工艺”,第六届国际真空涂覆会议(1992年)(A New Vapor DepositionProcess for Coating Paper and Polymer Webs,6th International Vacuum CoatingConference(1992));D.G.Shaw和M.G.Langlois,“一种用于气相沉积丙烯酸酯薄膜的新型高速工艺:更新”,真空涂布机协会第36届技术年会论文集(1993年)(“A New High SpeedProcess for Vapor Depositing Acrylate Thin Films:An Update”,Society of VacuumCoaters 36th Annual Technical Conference Proceedings(1993));D.G.Shaw和M.G.Langlois,“气相沉积丙烯酸酯涂层用于改善金属化膜的阻挡性能的用途”,真空涂布机协会第37届技术年会论文集(1994年)(“Use of Vapor Deposited Acrylate Coatingsto Improve the Barrier Properties of Metallized Film”,Society of VacuumCoaters 37th Annual Technical Conference Proceedings(1994));D.G.Shaw、M.Roehrig、M.G.Langlois和C.Sheehan,“使用蒸发丙烯酸酯涂层来平整聚酯和聚丙烯膜基底的表面”,RadTech(1996年)(“Use of Evaporated Acrylate Coatings to Smooth theSurface of Polyester and Polypropylene Film Substrates”,RadTech(1996));J.Affinito、P.Martin、M.Gross、C.Coronado和E.Greenwell,“光学应用中的真空沉积聚合物/金属多层膜”,《固体薄膜》,第270卷,第43至48页(1995年)(“Vacuum depositedpolymer/metal multilayer films for optical application”,Thin Solid Films 270,43-48(1995));以及J.D.Affinito、M.E.Gross、C.A.Coronado、G.L.Graff、E.N.Greenwell和P.M.Martin,“聚合物-氧化物透明阻挡层”,真空涂布机协会第39届技术年会论文集(1996年)(“Polymer-Oxide Transparent Barrier Layers”,Society of VacuumCoaters39th Annual Technical Conference Proceedings(1996))。
优选地通过适当的预处理来提高每个聚合物层的光滑度和连续性以及其对下层的附着力。优选的预处理方式采用在存在合适的反应性或非反应性气氛(例如,等离子体、辉光放电、电晕放电、介质阻挡放电或大气压放电)的情况下放电;化学预处理或火焰预处理。这些预处理有助于使下面层的表面更加易于接受随后所施用的聚合物层的形成。等离子体预处理是特别优选的。也可在下面层顶上使用可具有与高Tg聚合物层不同组成的单独的粘附促进层以改善层间粘附力。粘附促进层可为例如单独的聚合物层或含金属层,诸如金属层、金属氧化物层、金属氮化物层、或金属氧氮化物层。粘附促进层可具有数纳米(例如1nm或2nm)至约50nm的厚度,并且如果需要可以更厚。
第一聚合物层所需的化学组成和厚度部分地取决于支撑体的性质和表面形状。厚度优选地足以提供光滑、无缺陷的表面,随后可施加第一无机阻挡层至该表面。例如,第一聚合物层可以具有数纳米(例如2nm或3nm)至约5微米的厚度,并且如果需要可以更厚。
一个或多个被聚合物层分开的透可见光无机阻挡层的Tg大于或等于位于第一聚合物层顶上的HSPET的Tg。这些层可分别被称为“第一无机阻挡层”、“第二无机阻挡层”和“第二聚合物层”。如果需要,附加的无机阻挡层和聚合物层也可以存在,包括不具有Tg大于或等于HSPET的Tg的聚合物层。然而,每相邻对无机阻挡层优选只被Tg大于或等于HSPET的Tg的一层或多层聚合物层分离,并且更优选只被Tg大于PMMA的Tg的一层或多层聚合物层分离。
这些无机阻挡层无需相同。可以采用多种无机阻挡材料。优选的无机阻隔材料包括金属氧化物、金属氮化物、金属碳化物、金属氮氧化物、金属硼氧化物以及它们的组合,例如,氧化硅诸如二氧化硅、氧化铝诸如矾土、氧化钛诸如二氧化钛、氧化铟、氧化锡、铟锡氧化物(“ITO”)、氧化钽、氧化锆、氧化铌、碳化硼,碳化钨、碳化硅、氮化铝、氮化硅、氮化硼、氮氧化铝、氧化硅、氮氧化硼、硼氧化锆、硼氧化钛以及它们的组合。氧化铟锡、氧化硅、氧化铝以及它们的组合是特别优选的无机阻隔材料。ITO为正确选择各元素成分的相对比例可变得导电的特定类别陶瓷材料的示例。无机阻挡层优选地通过使用膜金属化领域中所采用的诸如溅射(例如阴极或平面磁控溅射)、蒸镀(例如电阻式或电子束蒸镀)、化学气相沉积、原子层沉积、电镀等技术形成。最优选使用溅射,例如,反应性溅射来形成无机阻挡层。当无机层通过相比较低能量技术诸如常规化学气相沉积工艺而言的高能量沉积技术诸如溅射而形成时,已经观察到增强的阻隔特性。可以通过预处理(例如,等离子体预处理)诸如以上参照第一聚合物层所描述的方法来提高各无机阻挡层的光滑度和连续性以及其对下面层的粘附力。
这些无机阻挡层无需具有相同的厚度。各无机阻挡层所需的化学组成和厚度将部分地取决于下面层的性质和表面形貌以及阻挡组件所需的光学性质。优选的无机阻挡层足够厚以便连续,并且足够薄以便保证阻挡组件和包含组件的制品具有所需程度的可见光透射和柔韧性。各无机阻挡层优选的物理厚度(相对于光学厚度)为约3nm至约150nm,更优选地为约4nm至约75nm。
分离第一、第二以及任何附加无机阻挡层的第二聚合物层无需相同,也无需具有相同的厚度。可以采用多种第二聚合物层材料。优选的第二聚合物层材料包括上面提到的关于第一聚合物层的材料。优选地,第二聚合物层(一层或多层)通过上述关于第一聚合物层的闪蒸和气相沉积随后通过原位交联来施加。诸如上述那些的预处理(例如,等离子体预处理)也优选地在第二聚合物层形成之前采用。一层或多层第二聚合物层所需的化学组成和厚度部分地取决于一层或多层下层的性质和表面形状。第二聚合物层优选地具有足以提供光滑、无缺陷的表面并且随后第一无机阻挡层可施加至该表面的厚度。通常一层或多层第二聚合物层可具有比第一聚合物层更小的厚度。例如,每个第二聚合物层可具有约5nm至约10μm的厚度,如果需要可以更厚。
柔性透可见光的超阻挡膜及其制造在例如美国专利No.7,940,004(Padiyath等人)中有所描述,该专利以引用方式并入本文。
可商购获得的超阻挡膜包括例如购自3M公司(3M Company)的FTB 3-50和FTB 3-125。
涂覆有本发明的粘合性阻挡组合物层的阻气膜可提供在基底上。基底优选为柔性的和透可见光的。合适的基底材料包括:有机聚合物材料,诸如聚对苯二甲酸乙二醇酯(PET)、聚丙烯酸酯、聚碳酸酯、有机硅树脂、环氧树脂、有机硅官能化环氧树脂;聚酯,诸如Mylar(由杜邦公司(E.I.du Pont de Nemours&Co.)制备);聚酰亚胺,诸如Kapton H或Kapton E(由杜邦公司(du Pont)制备);Apical AV(由钟渊化学工业公司(KanegafugiChemical Industry Company)制备);Upilex(由宇部兴产株式会社(UBE Industries,Ltd.)制备);聚醚砜(PES,由住友基团(Sumitomo)制备);聚醚酰亚胺;聚乙烯萘(PEN);聚甲基丙烯酸甲酯;苯乙烯/丙烯腈;苯乙烯/马来酸酐;聚甲醛;聚乙烯基萘;聚醚醚酮;聚芳醚酮;高Tg含氟聚合物(例如,六氟丙烯、四氟乙烯和乙烯的DYNEONTMHTE三元共聚物);聚α-甲基苯乙烯;聚丙烯酸酯;聚砜;聚苯醚;聚酰胺酰亚胺;聚酰亚胺;聚邻苯二甲酰胺;聚乙烯和聚丙烯。也可使用无色聚酰亚胺、环烯烃共聚物和环烯烃共聚物。优选地,该基底包含PET。
图1示出了示例性阻挡膜构造100的横截面构造,该构造包括基底110、阻气膜120(优选为超阻挡膜)和阻隔性粘合剂层130。在一些实施方案中,阻隔性粘合剂层具有约5μm至约50μm的厚度。在一些实施方案中,阻挡膜构造具有约20μm至约250μm的厚度。
在一些实施方案中,可使用诸如剥离衬垫(140)之类的装置保护阻隔性粘合剂层的外表面。可使用任何可用的剥离衬垫,诸如例如用剥离剂(例如,有机硅树脂)处理的膜或片材。最终用户可以将剥离衬垫移除以将阻挡构造附着到它将保护的器件上。
或者,本发明的阻隔性粘合剂可以设置在两个剥离衬垫之间的方式提供给最终用户。
本发明的阻隔性粘合剂和/或阻挡膜构造可用于保护OLED显示器和固态照明、太阳能电池、电泳和电致变色显示器、薄膜电池、量子点器件、传感器(例如,触摸传感器)和其它有机电子器件免受氧气和水分的损害。它们尤其非常适合需要保护免受氧气和水分损害以及良好柔韧性和良好光学透射性的应用。
图2示出了用于封装有机电子器件(诸如例如OLED)的本发明阻挡膜构造。有机电子器件250被设置在器件基底260上。有机电子器件250用阻挡膜构造200进行封装,该构造包括超阻挡膜220、阻隔性粘合剂层230和基底210,以及器件基底260。
实施例
下面的实施例对本发明的目的和有益效果作出更进一步的解释,但这些实施例中列举的具体材料和用量以及其它条件和细节不应解释为是对本发明不当的限制。除非另外指明,否则下述实例中提及的所有份数、百分比和比率均按重量计。除非另外指明,否则试剂购自密苏里州圣路易斯的西格玛奥德里奇公司(Sigma Aldrich Company,St.Louis,MO)。
表1:材料和来源。
光学性质表征
利用BYK Gardner Haze-Gard Plus(马里兰州哥伦比亚市的毕克-加特纳(美国)公司(BYK-Gardner USA,Inc.,Columbia,MD))采集透射率、清晰度和雾度数据。
水分阻挡测试
通过将阻挡组件层合到已沉积元素钙的玻璃上以产生测试样本,测试阻挡组件防止水分或水蒸气透过的能力。然后将这些测试样本暴露于高温和高湿度下,并且测量由于元素钙与水反应而造成的光学密度损失。首先在80℃下真空中烘烤每个阻挡组件以确保移除任何残留水分。将钙(反射金属)热沉积在玻璃板的指定区域上,成正方形阵列。将每个阻挡组件设置在玻璃板上的四个钙正方形(被称为像素)上,并且将该组件层合以提供测试样本。使用专业版Epson v750来扫描测试样本,并使用Aphelion图像分析软件来分析扫描结果,测量每个刚刚制备测试样本的每个钙像素的光密度。然后将每个测试样本置于环境室中,在60℃和90%相对湿度下进行加速老化。在前3天里,每天测量光密度两次。然后每天测量光密度一次,直到光密度为初始密度的50%为止。水蒸气透过率(WVTR)与钙像素的光密度达到其初始值50%所需的时间成反比。该关系由下式描述:
其中dCa为钙层的厚度;
ρCa为钙的密度;
ti为时间;
nCa为钙的摩尔数;
MWCa为钙的分子量。
聚异丁烯基粘合剂溶液
通过将20克Oppanol B80、10.2克Oppanol B50SF、9.8克Escorez5300和160克正庚烷在透明广口瓶中混合来制备聚异丁烯基粘合剂的溶液。将广口瓶用盖密封,然后放置在滚筒混合机上保持一周,使得所有材料溶解并形成澄清溶液。
疏水性表面改性的二氧化硅纳米粒子
根据美国专利8,834,618B2中所述的方法制备未团聚的20nm疏水性表面改性的二氧化硅纳米粒子,其在表中被称为“硅石”。将100g的NALCO 2327(水中41.45%的固体,购自伊利诺伊州纳波维尔的纳尔科公司(Nalco Company,Naperville,Ill.))量入3颈圆底烧瓶中。将具有经TeflonTM涂覆桨叶的玻璃搅拌棒附接到圆底***中央颈。将烧瓶沉入油浴锅中,连接冷凝器,然后以中高速率搅拌内容物。依次将以下组分量入150mL烧杯中:56.25g1-甲氧基丙醇、4.86g异辛基三甲氧基硅烷和0.50g甲基三甲氧基硅烷。将溶液充分混合,并将其加入盛有Nalco 2327材料的三颈圆底烧瓶中。用另外的56.25g 1-甲氧基丙醇将150mL烧杯中的任何剩余的硅烷都冲洗到反应物中。在设定为80℃的油浴中将反应物搅拌4小时。将表面改性的纳米粒子溶胶转移至结晶皿并在设定为150℃的烘箱中干燥大约1.5小时。用研钵和研杵或咖啡研磨机将干燥的白色产物手动碾碎,并转移至玻璃广口瓶,使用时无需进一步纯化。
吸附剂溶液
通过将1.43克未团聚的20nm疏水性表面改性的二氧化硅纳米粒子、0.57克氧化钙纳米粉末(CaO)和38克甲苯在透明罐中混合来制备吸附剂材料的溶液。将广口瓶用盖密封,并且使用Sonics Vibra Cell VCX750超声波仪(康乃狄克州纽镇的Sonics&Materials公司(Sonics&Materials Inc.,Newtown,CT))将纳米粒子在18%至20%振幅下分散20分钟。这样得到5重量%(wt.%)的吸附剂悬浮液,其为5:2重量/重量比的未团聚20nm疏水性表面改性的二氧化硅纳米粒子比氧化钙纳米粉末。
吸附剂改性的阻隔性粘合剂溶液1
通过将47克聚异丁烯基粘合剂溶液和10克吸附剂溶液在透明广口瓶中混合来制备吸附剂改性的阻隔性粘合剂的溶液。将广口瓶用盖密封并放置在滚筒混合机上,在室温下保持7天。最终的溶液包含17.4重量%的固体。该溶液的固体由95重量%的阻隔性粘合剂和5重量%的吸附剂组成,其为5:2重量/重量比的未团聚20nm疏水性表面改性的二氧化硅纳米粒子比氧化钙纳米粉末。
涂覆工艺
将吸附剂改性的阻隔性粘合剂溶液施加到SKC-02N有机硅剥离衬垫上。随后使用4密耳刀高度将溶液刀涂以形成均匀的湿层,随后在70℃下在对流烘箱中干燥30分钟,得到0.5密耳厚的干燥粘合剂涂层。另外,使用8密耳的刀高度来制备若干粘合剂涂层,得到1.0密耳厚的干燥粘合剂涂层。最后,用手压辊将FTB3-50超阻挡膜层合到每个粘合剂涂层的表面上,并且超阻挡膜放置在粘合剂上,膜的阻挡层侧面向粘合剂。
通过从每个带涂层的膜上切下3英寸乘3英寸(7.6cm乘7.6cm)部分并且移除SKC-02N衬垫以提供阻挡组件来制备用于测试的经涂覆样品。用BYK Gardner Haze-Gard Plus对每个样品进行表征,结果提供于表2中。
表2:经涂覆阻隔性粘合剂的光学特性。
使用3英寸乘3英寸(7.6cm乘7.6cm)阻挡组件来制备测试样本,如水分阻挡测试中所描述的那样进行加速老化测试。表3描述了在暴露于加速老化条件下的每个测试样本中使用的阻隔性粘合剂。图6示出了通过暴露于测试条件下675小时经历加速老化之后的三个测试样本。从左到右,测试样本为6(a)比较例1(a)、6(b)实施例1和6(c)实施例2。可以看出,与用于包含比较例1(a)的测试样本的像素相比,包含实施例1和2的测试样本的钙像素显示最小的视觉变化。
单个钙像素的光密度损失作为暴露于60℃和90%RH环境测试条件下的时间的函数示于图7中。示例性吸附剂改性的粘合剂相比于比较例1的阻隔性粘合剂表现出显著的改善,需要两倍以上达到50%光密度损失的加速环境暴露小时数。
表3:暴露于加速老化条件下的测试样本。
标识符 | 说明 | 图7中的图示 |
比较例1(a) | 1密耳阻隔性粘合剂比较 | 圆形 |
实施例1 | 0.5密耳吸附剂改性的阻隔性粘合剂1 | 菱形 |
实施例2 | 0.5密耳吸附剂改性的阻隔性粘合剂1 | 方块 |
制备例1:聚异丁烯基粘合剂混合物
将大块Oppanol B80和Oppanol B50SF聚异丁烯聚合物树脂切成大约1英寸(2.5cm)的方块。然后在加盖玻璃广口瓶中将称重量的这些树脂方块在甲苯中与Escorez5300增粘剂混合。粘合剂混合物的重量比为两份Oppanol B80、一份Oppanol B50SF和一份Escorez 5300在足够的甲苯中以提供25重量%的溶液。使用滚筒混合机将所得制剂混合2周,直至溶液均匀。
制备例2至4:纳米粒子分散体
纳米粒子为氧化钙纳米粉末(CaO)和未团聚的20nm疏水性表面改性的二氧化硅纳米粒子,这些纳米粒子按表4中提供的重量比加入甲苯中。以5重量%固体将纳米粒子直接加入甲苯中,然后使用Sonics Vibra Cell VCX750超声波仪(康乃狄克州纽镇的Sonics&Materials公司(Sonics&Materials Inc.,Newtown,CT))在18%至20%振幅下分散20分钟。
表4:用于该工作的分散体中纳米粒子的比率。
制备例5至10:填充纳米粒子的粘合剂制剂
将制备例2至4的纳米粒子分散体与制备例1的聚异丁烯基聚合物溶液按表5中提供的重量比混合。使用滚筒混合机将所得制剂混合一周。用甲苯将所得溶液稀释以达到20重量%固体的最终固体含量。
表5:填充纳米粒子的聚异丁烯基粘合剂制剂的组成。
为制备粘合剂膜,使用台式凹口刮棒涂布机将制备例5至10的填充纳米粒子的粘合剂制剂施加到SKC-12N剥离衬垫上。将经涂覆剥离衬垫放置于烘箱中,于80℃下保持20分钟以移除溶剂,从而提供具有12微米厚度的粘合剂膜。之后,将M74F或SKC-02N任一剥离衬垫层合到粘合剂上,使得粘合剂被夹置在两个剥离衬垫之间。随后通过下列步骤将粘合剂转移至3M FTB3-50超阻挡膜:移除M74F或SKC-02N任一剥离衬垫并将粘合剂层合至超阻挡膜的阻挡层侧以提供阻挡组件。用于制备所测试阻挡组件的粘合剂的组成提供于表6中。包含聚异丁烯但不包含纳米粒子的粘合剂在表中被称为PIB。
表6:粘合剂组合物。
测试样本的加速老化
如图3至图5中所示以及先前在水分阻挡测试中所述那样(其中470、570为玻璃基底并且480、580为钙)制备并测试用于加速老化测试的测试样本。测试样本的加速老化测试结果汇总于表7和图8中。当粘合剂制剂包含氧化钙纳米粉末和未团聚20nm疏水性表面改性的二氧化硅纳米粒子时,水分阻挡性能有显著改善,如通过将实施例3的数据与比较例2至7的数据进行比较可以看出。如表7中所示,在大多数情况下,与未填充的粘合剂(比较例2)相比,包含三种纳米粒子类型中任一种的测试样本(比较例3至8)达到50%光密度损失所需的时间更长。但是对于实施例3观察到协同增强效应。实施例3包含在比较例4和6中以组合方式使用的量的纳米粒子类型,但比任一比较例(分别为570和250小时)持续长得多的时间(1480小时)并长达这两个比较例组合时间的180%。
表7:比较例2至7和实施例3达到50%光密度损失所需的时间。
粘合剂 | 粘合剂描述符号 | 达到50%光密度损失所需的时间(小时) |
比较例2 | PIB | 390 |
比较例3 | 99:1PIB:CaO | 510 |
比较例4 | 98:2PIB:CaO | 570 |
比较例5 | 95:5PIB:CaO | 550 |
比较例6 | 95:5PIB:二氧化硅 | 250 |
比较例7 | 90:10PIB:二氧化硅 | 690 |
实施例3 | 93:5:2PIB:二氧化硅:CaO | 1480 |
在图8中,具有菱形标记的线为未填充聚异丁烯粘合剂(比较例2)。具有圆形标记的线为具有1重量%氧化钙的聚异丁烯粘合剂(比较例3)。具有小方形标记的线为具有2重量%氧化钙的聚异丁烯粘合剂(比较例4)。具有“-”标记的线为具有5重量%氧化钙的聚异丁烯粘合剂(比较例5)。具有“x”标记的线为具有5重量%未团聚的20nm疏水性表面改性的二氧化硅纳米粒子的聚异丁烯(比较例6)。具有大方形标记的线为具有10重量%未团聚的20nm疏水性表面改性的二氧化硅纳米粒子的聚异丁烯(比较例7)。具有三角形标记的线为具有5重量%未团聚的20nm疏水性表面改性的二氧化硅纳米粒子和2重量%氧化钙的聚异丁烯(实施例3)。
图8中实施例3的数据清晰地落在比较例2至7的数据下方,其包含未填充粘合剂或填充有仅纳米粒子类型中一者的粘合剂。在300小时加速老化之后差异变得非常明显。实施例3的数据指示改善的水分阻挡性能。实施例3的粘合剂中氧化钙纳米粉末和未团聚20nm疏水性表面改性的二氧化硅纳米粒子的组合表现出显著改善的水分阻挡性能,如与包含较大负载的单一类型纳米粒子的粘合剂相比(比较例5和7)光密度损失的速率有所降低所示。
比较例2和实施例3的测试样本的照片在图9中提供。不含纳米粒子的粘合剂的测试样本(比较例2)位于左手列(图9(a)、图9(c)和图9(e))。实施例3的粘合剂的测试样本位于右手列(图9(b)、图9(d)和图9(f))。图9(a)和图9(b)为在暴露于加速老化条件之前的测试样本。图9(c)和图9(d)为在暴露于加速老化条件502小时之后的测试样本。图9(e)和图9(f)为在暴露于加速老化条件984小时之后的测试样本。由未填充粘合剂制备的测试样本(比较例2)的钙像素在60℃/90%RH环境暴露984小时之后几乎完全消失,这是渗透通过阻挡构造并与钙反应的水蒸气造成的。相比之下,由实施例3的阻隔性粘合剂制备的测试样本的钙像素即使在60℃/90%RH环境暴露984小时之后在很大程度上仍是完整的。这些图像清楚地示出与比较例2的测试样本(其包括用标准聚异丁烯粘合剂层合的阻挡膜)相比,实施例3的测试样本(其包括用填充有氧化钙纳米粉末和未团聚20nm疏水性表面改性的二氧化硅纳米粒子两者的聚异丁烯粘合剂层合到玻璃的阻挡膜)具有优异的水分阻挡性能。
本文所引述的专利公开的全部公开内容以引用方式全文并入本文,如同每种专利公开单独并入本文。在不脱离本发明范围和实质的前提下,对本发明的各种变型和更改对本领域的技术人员而言将显而易见。应当理解,本发明并非意图不当地限制于本文所示出的示例性实施方案和实施例,并且上述实施例和实施方案仅以举例的方式提出,而且本发明的范围旨在仅受下面本文所示出的权利要求书的限制。
Claims (32)
1.一种阻隔性粘合剂组合物,包含:
(a)聚异丁烯树脂;
(b)疏水性纳米粒子,所述疏水性纳米粒子具有不大于100nm的平均原生或团聚粒径;以及
(c)吸附剂纳米粒子,
其中至少70%的所述疏水性纳米粒子作为离散的非聚集纳米粒子存在,并且所述阻隔性粘合剂组合物为压敏粘合剂。
2.根据权利要求1所述的阻隔性粘合剂组合物,其中所述疏水性纳米粒子经过表面改性。
3.根据权利要求1所述的阻隔性粘合剂组合物,其中所述疏水性纳米粒子包括表面改性的金属氧化物纳米粒子。
4.根据权利要求1所述的阻隔性粘合剂组合物,其中所述疏水性纳米粒子是用硅烷或羧酸处理的。
5.根据权利要求3所述的阻隔性粘合剂组合物,其中所述疏水性纳米粒子包括表面改性的纳米二氧化硅。
6.根据权利要求5所述的阻隔性粘合剂组合物,其中疏水性表面改性的纳米粒子包括用有机硅烷处理的纳米二氧化硅,其中所述有机硅烷包含烷基基团。
7.根据权利要求1所述的阻隔性粘合剂组合物,其中所述疏水性纳米粒子具有3nm至30nm的平均粒度。
8.根据权利要求1所述的阻隔性粘合剂组合物,其中所述吸附剂纳米粒子包含金属氧化物。
9.根据权利要求8所述的阻隔性粘合剂组合物,其中所述吸附剂纳米粒子包含氧化钙。
10.根据权利要求9所述的阻隔性粘合剂组合物,其中所述氧化钙具有不大于200nm的平均粒度。
11.根据权利要求1所述的阻隔性粘合剂组合物,其中树脂体系包含具有40,000g/mol至2,600,000g/mol的粘均分子量的聚异丁烯树脂。
12.根据权利要求11所述的阻隔性粘合剂组合物,其中所述树脂体系包含具有300,000g/mol至900,000g/mol的粘均分子量的聚异丁烯树脂。
13.根据权利要求中1所述的阻隔性粘合剂组合物,包含相对于所述组合物的总重量计1重量%至10重量%的所述疏水性纳米粒子。
14.根据权利要求13所述的阻隔性粘合剂组合物,包含相对于所述组合物的总重量计2重量%至5重量%的所述疏水性纳米粒子。
15.根据权利要求1所述的阻隔性粘合剂组合物,包含相对于所述组合物的总重量计0.5重量%至10重量%的所述吸附剂纳米粒子。
16.根据权利要求15所述的阻隔性粘合剂组合物,包含相对于所述组合物的总重量计1重量%至5重量%的所述吸附剂纳米粒子。
17.根据权利要求1所述的阻隔性粘合剂组合物,还包含溶剂。
18.根据权利要求1所述的阻隔性粘合剂组合物,还包含紫外线阻断剂。
19.根据权利要求1所述的阻隔性粘合剂组合物,还包含增粘剂。
20.根据权利要求1所述的阻隔性粘合剂组合物,其中所述聚异丁烯树脂包括异丁烯共聚物。
21.根据权利要求20所述的阻隔性粘合剂组合物,其中所述聚异丁烯树脂包括丁基橡胶。
22.一种阻隔性粘合剂组合物,包含:
(a)50重量%至75重量%的具有300,000g/mol至900,000g/mol的粘均分子量的聚异丁烯树脂,
(b)1重量%至10重量%的疏水性表面改性的纳米二氧化硅,
(c)1重量%至5重量%的氧化钙纳米粒子,
(d)10重量%至25重量%的增粘剂,并且
以上所有的量均相对于所述组合物的总重量计,
其中所述阻隔性粘合剂组合物为具有至少90%的光学透射率的压敏粘合剂。
23.一种粘合性阻挡膜,包括设置在阻气膜上的权利要求1所述的阻隔性粘合剂组合物的层。
24.根据权利要求23所述的粘合性阻挡膜,其中所述阻气膜为在23℃和90%RH下具有小于0.005cc/m2/天的氧气透过率并且在23℃和90%RH下具有小于0.005g/m2/天的水蒸气透过率的超阻挡膜。
25.根据权利要求24所述的粘合性阻挡膜,其中所述超阻挡膜为包括设置在聚合物层之间的无机透可见光层的多层膜。
26.根据权利要求23所述的粘合性阻挡膜,还包括设置在所述阻气膜上且与所述阻隔性粘合剂组合物的层相背对的基底。
27.根据权利要求26所述的粘合性阻挡膜,其中所述基底包含聚对苯二甲酸乙二醇酯。
28.根据权利要求23所述的粘合性阻挡膜,还包括设置在所述阻隔性粘合剂组合物的层上且与所述阻气膜相背对的剥离层。
29.一种封装的有机电子器件,包含封装薄膜器件的根据权利要求1所述的阻隔性粘合剂组合物。
30.根据权利要求29所述的封装的有机电子器件,其中所述器件为OLED。
31.一种封装的触摸传感器,包含封装触摸传感器的根据权利要求1所述的阻隔性粘合剂组合物。
32.一种阻隔性粘合剂制品,包括设置在剥离层之间的根据权利要求1所述的阻隔性粘合剂组合物的层。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662351086P | 2016-06-16 | 2016-06-16 | |
US62/351,086 | 2016-06-16 | ||
PCT/US2017/037160 WO2017218476A2 (en) | 2016-06-16 | 2017-06-13 | Nanoparticle filled barrier adhesive compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109312201A CN109312201A (zh) | 2019-02-05 |
CN109312201B true CN109312201B (zh) | 2021-12-07 |
Family
ID=60664174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780037374.2A Active CN109312201B (zh) | 2016-06-16 | 2017-06-13 | 填充纳米粒子的阻隔性粘合剂组合物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10894903B2 (zh) |
EP (1) | EP3472253A4 (zh) |
JP (1) | JP2019524911A (zh) |
KR (1) | KR102406867B1 (zh) |
CN (1) | CN109312201B (zh) |
TW (1) | TW201811963A (zh) |
WO (1) | WO2017218476A2 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108630829B (zh) * | 2017-03-17 | 2019-11-08 | 京东方科技集团股份有限公司 | 显示面板的制作方法、显示面板及显示装置 |
WO2019152707A1 (en) * | 2018-01-31 | 2019-08-08 | Adaptive Surface Technologies, Inc. | Methods and compositions for forming food-safe, uniformly-textured surfaces, and applications thereof |
KR102056759B1 (ko) * | 2018-09-03 | 2019-12-17 | 재단법인 오송첨단의료산업진흥재단 | 영상처리 기반의 수분 및 광 투과도 측정 시스템 및 이를 이용한 수분 및 광 투과도 측정 방법 |
CN109301083B (zh) * | 2018-09-17 | 2020-02-14 | 武汉华星光电半导体显示技术有限公司 | Oled封装结构的保护膜、oled封装结构及制备方法 |
CN109346622A (zh) * | 2018-10-19 | 2019-02-15 | 武汉华星光电半导体显示技术有限公司 | Oled阵列基板及其制作方法 |
KR102085912B1 (ko) * | 2018-12-06 | 2020-03-06 | 주식회사 아이에스티이 | 디스플레이 패키지용 나노다공 구조체 및 그 제조방법 |
CN109796975A (zh) * | 2019-03-25 | 2019-05-24 | 深圳扑浪创新科技有限公司 | 一种二氧化硅和氧化铝两层包覆量子点及其制备方法及量子点薄膜的制备方法 |
WO2021053793A1 (ja) * | 2019-09-19 | 2021-03-25 | シャープ株式会社 | 発光デバイスおよび発光デバイスの製造方法 |
CN114269877B (zh) * | 2019-12-11 | 2023-12-22 | 株式会社Lg化学 | 用于水处理元件的热熔粘合剂组合物、包含其的粘合剂膜和水处理元件 |
KR20230170723A (ko) * | 2021-04-15 | 2023-12-19 | 다우 글로벌 테크놀로지스 엘엘씨 | 폴리이소부틸렌 및 폴리올레핀 입자의 수성 분산액 |
CN113861479A (zh) * | 2021-09-24 | 2021-12-31 | 南京贝迪新材料科技股份有限公司 | 一种水氧阻隔膜 |
CN114025486B (zh) * | 2021-10-21 | 2024-02-23 | 深圳明阳电路科技股份有限公司 | 一种印制电路板盲槽、印制电路板、电子设备及其制作方法 |
KR102562212B1 (ko) * | 2021-11-29 | 2023-08-01 | 한국광기술원 | 수분 및 가스 배리어성을 향상시킨 접착소재 및 그의 제조방법 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105122939A (zh) * | 2013-03-29 | 2015-12-02 | 古河电气工业株式会社 | 有机电子器件用元件密封用树脂组合物、有机电子器件用元件密封用树脂片、有机电致发光元件、及图像显示装置 |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5125138A (en) | 1983-12-19 | 1992-06-30 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making same |
US5018048A (en) | 1983-12-19 | 1991-05-21 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making |
US5032461A (en) | 1983-12-19 | 1991-07-16 | Spectrum Control, Inc. | Method of making a multi-layered article |
US4842893A (en) | 1983-12-19 | 1989-06-27 | Spectrum Control, Inc. | High speed process for coating substrates |
US5097800A (en) | 1983-12-19 | 1992-03-24 | Spectrum Control, Inc. | High speed apparatus for forming capacitors |
US4722515A (en) | 1984-11-06 | 1988-02-02 | Spectrum Control, Inc. | Atomizing device for vaporization |
EP0242460A1 (en) | 1985-01-18 | 1987-10-28 | SPECTRUM CONTROL, INC. (a Pennsylvania corporation) | Monomer atomizer for vaporization |
US4954371A (en) | 1986-06-23 | 1990-09-04 | Spectrum Control, Inc. | Flash evaporation of monomer fluids |
JP2825736B2 (ja) | 1993-07-30 | 1998-11-18 | 京セラ株式会社 | 誘電体磁器組成物および半導体素子収容用パッケージ |
US5440446A (en) | 1993-10-04 | 1995-08-08 | Catalina Coatings, Inc. | Acrylate coating material |
BR9407741A (pt) | 1993-10-04 | 1997-02-12 | Catalina Coatings Inc | Revestimento de acrilato |
US6083628A (en) | 1994-11-04 | 2000-07-04 | Sigma Laboratories Of Arizona, Inc. | Hybrid polymer film |
US5916685A (en) | 1996-07-09 | 1999-06-29 | Tetra Laval Holdings & Finance, Sa | Transparent high barrier multilayer structure |
US6045864A (en) | 1997-12-01 | 2000-04-04 | 3M Innovative Properties Company | Vapor coating method |
CA2353506A1 (en) | 1998-11-02 | 2000-05-11 | 3M Innovative Properties Company | Transparent conductive oxides for plastic flat panel displays |
US6936131B2 (en) | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
US6936161B2 (en) | 2002-08-21 | 2005-08-30 | Arvin Technologies, Inc. | Fluid filter apparatus |
US7018713B2 (en) | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
AU2006278571B2 (en) | 2005-08-05 | 2011-11-24 | 3M Innovative Properties Company | Compositions exhibiting improved flowability |
JP2007197517A (ja) * | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機el素子 |
WO2008057045A1 (en) * | 2006-11-06 | 2008-05-15 | Agency For Science, Technology And Research | Nanoparticulate encapsulation barrier stack |
CN101945824B (zh) | 2007-12-28 | 2014-07-23 | 3M创新有限公司 | 制备含氧化锆的纳米粒子的方法 |
EP2291477B1 (en) * | 2008-06-02 | 2016-03-23 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
SG171872A1 (en) | 2008-12-15 | 2011-07-28 | 3M Innovative Properties Co | High refractive index inorganic oxide nanoparticles comprising surface treatment, polymerizable resin, and articles |
US20100314575A1 (en) * | 2009-06-16 | 2010-12-16 | Di Gao | Anti-icing superhydrophobic coatings |
WO2011062932A1 (en) * | 2009-11-18 | 2011-05-26 | 3M Innovative Properties Company | Flexible assembly and method of making and using the same |
US8834618B2 (en) | 2009-12-03 | 2014-09-16 | 3M Innovative Properties Company | Method of inhibiting water adsorption of powder by addition of hydrophobic nanoparticles |
JP2012193335A (ja) | 2010-09-27 | 2012-10-11 | Dainippon Printing Co Ltd | 粘着組成物、積層体及び画像表示装置 |
WO2012060621A2 (ko) | 2010-11-02 | 2012-05-10 | 주식회사 엘지화학 | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
KR101846434B1 (ko) | 2011-06-10 | 2018-04-09 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
CN103102518B (zh) | 2011-11-15 | 2015-05-20 | 白城市工业滤材厂 | 过滤毡封闭胶及其制备工艺 |
TWI477824B (zh) * | 2011-12-27 | 2015-03-21 | Asahi Kasei E Materials Corp | Optical substrate and light emitting device |
CN104169386B (zh) | 2012-03-12 | 2016-10-26 | Lg化学株式会社 | 压敏性粘合剂组合物 |
DE102012211335A1 (de) | 2012-06-29 | 2014-01-02 | Tesa Se | Klebeband für die Kapselung einer organischen elektronischen Anordnung |
CN104704035B (zh) * | 2012-07-19 | 2018-10-19 | 巴斯夫涂料有限公司 | 用于水清除层的可辐射固化的组合物及其制备方法 |
JP5959362B2 (ja) * | 2012-08-01 | 2016-08-02 | アイカ工業株式会社 | ホットメルトシール組成物 |
TWI620774B (zh) | 2013-03-25 | 2018-04-11 | 荷蘭Tno自然科學組織公司 | 奈米複合物,其製造方法,用於電子裝置之障壁結構及含其之oled |
CN110372967A (zh) | 2013-03-27 | 2019-10-25 | 古河电气工业株式会社 | 密封用树脂组合物、密封用树脂片、有机电致发光元件、及图像显示装置 |
US20160075883A1 (en) * | 2013-04-25 | 2016-03-17 | The Ohio State University | Methods of fabricating superhydrophobic, optically transparent surfaces |
EP2803711B1 (en) | 2013-05-17 | 2018-06-27 | 3M Innovative Properties Company | Pressure sensitive adhesive assembly comprising filler material |
CN105722933A (zh) * | 2013-07-26 | 2016-06-29 | 泽费罗斯股份有限公司 | 热固性粘合膜的改进或涉及它的改进 |
CA2950391A1 (en) * | 2014-05-28 | 2015-12-03 | Centro De Investigacion En Polimeros S.A. De C.V. | Hybrid latex method for obtaining the same and its use as hydrophobic and superhydrophobic coatings |
US10370514B2 (en) * | 2014-06-23 | 2019-08-06 | Southwire Company, Llc | UV-resistant superhydrophobic coating compositions |
EP2975096B1 (en) * | 2014-07-17 | 2021-11-17 | 3M Innovative Properties Company | Pressure sensitive adhesive assembly suitable for bonding to uneven substrates |
CN105037976B (zh) | 2015-07-14 | 2017-10-03 | 航天材料及工艺研究所 | 室温至200℃使用真空袋密封胶条及其制备方法 |
-
2017
- 2017-06-13 EP EP17813904.4A patent/EP3472253A4/en not_active Withdrawn
- 2017-06-13 WO PCT/US2017/037160 patent/WO2017218476A2/en unknown
- 2017-06-13 US US16/309,812 patent/US10894903B2/en active Active
- 2017-06-13 KR KR1020197000930A patent/KR102406867B1/ko active IP Right Grant
- 2017-06-13 JP JP2018565878A patent/JP2019524911A/ja active Pending
- 2017-06-13 CN CN201780037374.2A patent/CN109312201B/zh active Active
- 2017-06-15 TW TW106119953A patent/TW201811963A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105122939A (zh) * | 2013-03-29 | 2015-12-02 | 古河电气工业株式会社 | 有机电子器件用元件密封用树脂组合物、有机电子器件用元件密封用树脂片、有机电致发光元件、及图像显示装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2017218476A2 (en) | 2017-12-21 |
KR20190020321A (ko) | 2019-02-28 |
TW201811963A (zh) | 2018-04-01 |
CN109312201A (zh) | 2019-02-05 |
EP3472253A4 (en) | 2019-12-25 |
US20190127609A1 (en) | 2019-05-02 |
WO2017218476A3 (en) | 2018-03-01 |
JP2019524911A (ja) | 2019-09-05 |
KR102406867B1 (ko) | 2022-06-13 |
US10894903B2 (en) | 2021-01-19 |
EP3472253A2 (en) | 2019-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109312201B (zh) | 填充纳米粒子的阻隔性粘合剂组合物 | |
CN109415607B (zh) | 纳米粒子填充的阻隔性粘合剂组合物 | |
CN107925010B (zh) | 阻挡膜构造 | |
CN107922805B (zh) | 纳米粘土填充的阻挡粘合剂组合物 | |
US9982148B2 (en) | Gas barrier coatings | |
JP2017515935A5 (zh) | ||
JP2015157947A (ja) | ガスバリアコーティング | |
CA2678273A1 (en) | Method for encapsulating an electronic arrangement | |
US20190091976A1 (en) | Barrier composites | |
WO2015068805A1 (ja) | 封止用樹脂組成物 | |
CN110536945B (zh) | 阻隔性粘合剂组合物和制品 | |
KR20220100902A (ko) | 밀봉용 시트 | |
WO2015178474A1 (ja) | 樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |