NO981876D0 - Vµskekj÷ling av elektroniske komponenter - Google Patents
Vµskekj÷ling av elektroniske komponenterInfo
- Publication number
- NO981876D0 NO981876D0 NO981876A NO981876A NO981876D0 NO 981876 D0 NO981876 D0 NO 981876D0 NO 981876 A NO981876 A NO 981876A NO 981876 A NO981876 A NO 981876A NO 981876 D0 NO981876 D0 NO 981876D0
- Authority
- NO
- Norway
- Prior art keywords
- channels
- span
- heat sink
- electronic components
- liquid cooling
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/22—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49364—Tube joined to flat sheet longitudinally, i.e., tube sheet
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/547,196 US5829516A (en) | 1993-12-15 | 1995-10-24 | Liquid cooled heat sink for cooling electronic components |
PCT/US1996/016990 WO1997015801A1 (en) | 1995-10-24 | 1996-10-23 | Liquid cooled heat sink for cooling electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
NO981876D0 true NO981876D0 (no) | 1998-04-24 |
NO981876L NO981876L (no) | 1998-06-12 |
Family
ID=24183713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO981876A NO981876L (no) | 1995-10-24 | 1998-04-24 | Vµskekj°ling av elektroniske komponenter |
Country Status (11)
Country | Link |
---|---|
US (1) | US5829516A (no) |
EP (1) | EP0858578B1 (no) |
JP (1) | JP3199384B2 (no) |
KR (1) | KR19990067040A (no) |
AT (1) | ATE234452T1 (no) |
AU (1) | AU700624B2 (no) |
CA (1) | CA2235620A1 (no) |
DE (2) | DE858578T1 (no) |
ES (1) | ES2129382T1 (no) |
NO (1) | NO981876L (no) |
WO (1) | WO1997015801A1 (no) |
Families Citing this family (113)
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US7017651B1 (en) * | 2000-09-13 | 2006-03-28 | Raytheon Company | Method and apparatus for temperature gradient control in an electronic system |
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-
1995
- 1995-10-24 US US08/547,196 patent/US5829516A/en not_active Expired - Lifetime
-
1996
- 1996-10-23 AU AU74696/96A patent/AU700624B2/en not_active Ceased
- 1996-10-23 DE DE0858578T patent/DE858578T1/de active Pending
- 1996-10-23 JP JP51674497A patent/JP3199384B2/ja not_active Expired - Fee Related
- 1996-10-23 CA CA002235620A patent/CA2235620A1/en not_active Abandoned
- 1996-10-23 EP EP96936884A patent/EP0858578B1/en not_active Expired - Lifetime
- 1996-10-23 ES ES96936884T patent/ES2129382T1/es active Pending
- 1996-10-23 AT AT96936884T patent/ATE234452T1/de not_active IP Right Cessation
- 1996-10-23 WO PCT/US1996/016990 patent/WO1997015801A1/en active IP Right Grant
- 1996-10-23 KR KR1019980702977A patent/KR19990067040A/ko active IP Right Grant
- 1996-10-23 DE DE69626662T patent/DE69626662T2/de not_active Expired - Lifetime
-
1998
- 1998-04-24 NO NO981876A patent/NO981876L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU7469696A (en) | 1997-05-15 |
DE69626662T2 (de) | 2004-04-22 |
DE858578T1 (de) | 1999-05-20 |
AU700624B2 (en) | 1999-01-07 |
DE69626662D1 (de) | 2003-04-17 |
KR19990067040A (ko) | 1999-08-16 |
EP0858578A4 (en) | 1999-05-19 |
EP0858578B1 (en) | 2003-03-12 |
EP0858578A1 (en) | 1998-08-19 |
US5829516A (en) | 1998-11-03 |
CA2235620A1 (en) | 1997-05-01 |
JPH11510962A (ja) | 1999-09-21 |
JP3199384B2 (ja) | 2001-08-20 |
NO981876L (no) | 1998-06-12 |
ES2129382T1 (es) | 1999-06-16 |
WO1997015801A1 (en) | 1997-05-01 |
ATE234452T1 (de) | 2003-03-15 |
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