MY181207A - Dicing sheet - Google Patents
Dicing sheetInfo
- Publication number
- MY181207A MY181207A MYPI2016704523A MYPI2016704523A MY181207A MY 181207 A MY181207 A MY 181207A MY PI2016704523 A MYPI2016704523 A MY PI2016704523A MY PI2016704523 A MYPI2016704523 A MY PI2016704523A MY 181207 A MY181207 A MY 181207A
- Authority
- MY
- Malaysia
- Prior art keywords
- base material
- dicing sheet
- laminated
- adhesive layer
- sheet
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laser Beam Processing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A dicing sheet of the invention is a dicing sheet (1) including a base material (2), an adhesive layer (3) which is laminated on the first surface side of the base material (2), and a release sheet (6) which is laminated on the adhesive layer (3) on the side opposite to the base material (2), in which an arithmetic mean roughness (Ral) of a second surface of the base material (2) is 0.2 ?m or greater, and an arithmetic mean roughness (Ra2) of the second surface of the base material (2) after the dicing sheet (1) is heated for 2 hours at 130?C is 0.25 ?m or less. Figure 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014120034 | 2014-06-10 | ||
PCT/JP2015/064181 WO2015190230A1 (en) | 2014-06-10 | 2015-05-18 | Dicing sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
MY181207A true MY181207A (en) | 2020-12-21 |
Family
ID=54833335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2016704523A MY181207A (en) | 2014-06-10 | 2015-05-18 | Dicing sheet |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6319438B2 (en) |
KR (1) | KR102355108B1 (en) |
CN (2) | CN106463375B (en) |
MY (1) | MY181207A (en) |
PH (1) | PH12016502287A1 (en) |
SG (1) | SG11201609451VA (en) |
TW (2) | TWI675901B (en) |
WO (1) | WO2015190230A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106463375B (en) * | 2014-06-10 | 2019-06-28 | 琳得科株式会社 | Cutting sheet |
KR20180122316A (en) * | 2016-03-04 | 2018-11-12 | 린텍 가부시키가이샤 | Semiconductor processing sheet |
JP6573841B2 (en) * | 2016-03-04 | 2019-09-11 | リンテック株式会社 | Semiconductor processing sheet |
WO2017149926A1 (en) * | 2016-03-04 | 2017-09-08 | リンテック株式会社 | Semiconductor processing sheet |
JPWO2017169387A1 (en) * | 2016-03-30 | 2019-02-07 | リンテック株式会社 | Film adhesive, semiconductor processing sheet, and semiconductor device manufacturing method |
JP6196751B1 (en) | 2016-03-31 | 2017-09-13 | 三井化学東セロ株式会社 | Film for parts production and method for producing parts |
KR102082065B1 (en) * | 2016-03-31 | 2020-02-26 | 미쓰이 가가쿠 토세로 가부시키가이샤 | Film for manufacturing parts and manufacturing method for parts |
WO2019146607A1 (en) * | 2018-01-24 | 2019-08-01 | リンテック株式会社 | Long laminated sheet, and winding body thereof |
JP2022157810A (en) | 2021-03-31 | 2022-10-14 | リンテック株式会社 | Support sheet, composite sheet for resin film formation, kit, and manufacturing method of chip with resin film |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000344915A (en) * | 1999-04-02 | 2000-12-12 | Toray Ind Inc | Roughness-changeable film |
EP3664131A3 (en) | 2002-03-12 | 2020-08-19 | Hamamatsu Photonics K. K. | Substrate dividing method |
JP5165829B2 (en) * | 2004-02-26 | 2013-03-21 | 日東電工株式会社 | Rolled wafer processing adhesive sheet |
JP4642436B2 (en) * | 2004-11-12 | 2011-03-02 | リンテック株式会社 | Marking method and protective film forming and dicing sheet |
JP2007109808A (en) * | 2005-10-12 | 2007-04-26 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer dicing die bond |
JP4762671B2 (en) | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | Dicing tape and semiconductor wafer dicing method |
JP4767144B2 (en) * | 2006-10-04 | 2011-09-07 | 日東電工株式会社 | Adhesive sheet for laser processing |
JP4430085B2 (en) * | 2007-03-01 | 2010-03-10 | 日東電工株式会社 | Dicing die bond film |
WO2008126515A1 (en) * | 2007-03-19 | 2008-10-23 | Lintec Corporation | Releasing sheet and adhesive body |
JP2011040449A (en) * | 2009-08-07 | 2011-02-24 | Du Pont Mitsui Polychem Co Ltd | Substrate for dicing tape, the dicing tape, and method for manufacturing semiconductor device |
JP5603757B2 (en) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | Laser dicing adhesive sheet and method for manufacturing semiconductor device |
JPWO2011096350A1 (en) * | 2010-02-02 | 2013-06-10 | 三井化学東セロ株式会社 | Surface protection film |
JP5391158B2 (en) * | 2010-06-30 | 2014-01-15 | 古河電気工業株式会社 | Wafer sticking adhesive sheet and wafer processing method using the same |
JP2012033637A (en) * | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
WO2012172959A1 (en) * | 2011-06-14 | 2012-12-20 | 電気化学工業株式会社 | Adhesive sheet, and method for manufacturing electronic component |
US9786541B2 (en) * | 2011-09-30 | 2017-10-10 | Lintec Corporation | Dicing sheet with protective film forming layer and chip fabrication method |
JP2013095842A (en) * | 2011-10-31 | 2013-05-20 | Lintec Corp | Adhesive sheet and method for producing the same |
JP2013181063A (en) * | 2012-02-29 | 2013-09-12 | Nitto Denko Corp | Self-rolling adhesive film |
JP5583725B2 (en) * | 2012-09-20 | 2014-09-03 | リンテック株式会社 | Laser dicing sheet-peeling sheet laminate, laser dicing sheet and chip body manufacturing method |
WO2014046121A1 (en) * | 2012-09-20 | 2014-03-27 | リンテック株式会社 | Laser dicing sheet / peeling sheet laminate, laser dicing sheet, and chip manufacturing method |
JP6029481B2 (en) * | 2013-02-04 | 2016-11-24 | リンテック株式会社 | Laser dicing sheet and semiconductor chip manufacturing method |
CN106463375B (en) * | 2014-06-10 | 2019-06-28 | 琳得科株式会社 | Cutting sheet |
-
2015
- 2015-05-18 CN CN201580030575.0A patent/CN106463375B/en active Active
- 2015-05-18 JP JP2016527710A patent/JP6319438B2/en active Active
- 2015-05-18 SG SG11201609451VA patent/SG11201609451VA/en unknown
- 2015-05-18 KR KR1020167020119A patent/KR102355108B1/en active IP Right Grant
- 2015-05-18 MY MYPI2016704523A patent/MY181207A/en unknown
- 2015-05-18 CN CN201910444689.XA patent/CN110211912B/en active Active
- 2015-05-18 WO PCT/JP2015/064181 patent/WO2015190230A1/en active Application Filing
- 2015-05-27 TW TW104116955A patent/TWI675901B/en active
- 2015-05-27 TW TW108127490A patent/TWI741335B/en active
-
2016
- 2016-11-16 PH PH12016502287A patent/PH12016502287A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102355108B1 (en) | 2022-01-24 |
JP6319438B2 (en) | 2018-05-09 |
CN106463375A (en) | 2017-02-22 |
JPWO2015190230A1 (en) | 2017-04-20 |
TW201940623A (en) | 2019-10-16 |
TW201604260A (en) | 2016-02-01 |
TWI741335B (en) | 2021-10-01 |
CN110211912A (en) | 2019-09-06 |
PH12016502287A1 (en) | 2017-02-13 |
CN106463375B (en) | 2019-06-28 |
KR20170016814A (en) | 2017-02-14 |
WO2015190230A1 (en) | 2015-12-17 |
TWI675901B (en) | 2019-11-01 |
CN110211912B (en) | 2023-06-02 |
SG11201609451VA (en) | 2016-12-29 |
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