SG11201807645SA - Supporting sheet and composite sheet for protective film formation - Google Patents

Supporting sheet and composite sheet for protective film formation

Info

Publication number
SG11201807645SA
SG11201807645SA SG11201807645SA SG11201807645SA SG11201807645SA SG 11201807645S A SG11201807645S A SG 11201807645SA SG 11201807645S A SG11201807645S A SG 11201807645SA SG 11201807645S A SG11201807645S A SG 11201807645SA SG 11201807645S A SG11201807645S A SG 11201807645SA
Authority
SG
Singapore
Prior art keywords
sheet
protective film
film formation
adhesive layer
supporting sheet
Prior art date
Application number
SG11201807645SA
Inventor
Rikiya Kobashi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201807645SA publication Critical patent/SG11201807645SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B32B5/145—Variation across the thickness of the layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

This supporting sheet has a substrate, and an adhesive layer laminated to the substrate, wherein the surface roughness (Ra) of the surface of the substrate on the side on which the adhesive layer is provided is 0.4 µm or less, and the surface roughness (Ra) of the surface of the substrate on the opposite side from the side on which the adhesive layer is provided is greater than the surface roughness of the surface on the side on which the adhesive layer is provided, and is from 0.053 to 0.48 µm. A composite sheet for protective film formation includes this supporting sheet, and also has a film for protective film formation provided on the adhesive layer in the supporting sheet.
SG11201807645SA 2016-03-24 2017-03-13 Supporting sheet and composite sheet for protective film formation SG11201807645SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016060577 2016-03-24
PCT/JP2017/009921 WO2017163971A1 (en) 2016-03-24 2017-03-13 Supporting sheet and composite sheet for protective film formation

Publications (1)

Publication Number Publication Date
SG11201807645SA true SG11201807645SA (en) 2018-10-30

Family

ID=59899422

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807645SA SG11201807645SA (en) 2016-03-24 2017-03-13 Supporting sheet and composite sheet for protective film formation

Country Status (6)

Country Link
JP (1) JP6893500B2 (en)
KR (1) KR102313074B1 (en)
CN (1) CN108966671B (en)
SG (1) SG11201807645SA (en)
TW (1) TWI761335B (en)
WO (1) WO2017163971A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7059553B2 (en) * 2017-10-04 2022-04-26 昭和電工マテリアルズ株式会社 Adhesive tape for stealth dicing, dicing die bonding integrated tape, and method for manufacturing semiconductor devices
CN111279468B (en) * 2017-10-27 2023-10-20 琳得科株式会社 Film for forming protective film, composite sheet for forming protective film, and method for manufacturing semiconductor chip
TWI797180B (en) * 2017-10-31 2023-04-01 日商東麗薄膜先端加工股份有限公司 laminated film
JP7138448B2 (en) * 2018-02-22 2022-09-16 リンテック株式会社 Adhesive sheet roll
WO2019172438A1 (en) * 2018-03-09 2019-09-12 リンテック株式会社 Composite sheet for forming protective film and method for producing semiconductor chip with protective film
CN111542912B (en) * 2018-03-30 2023-10-13 琳得科株式会社 Composite sheet for forming protective film and method for producing same
JP7119070B2 (en) * 2018-03-30 2022-08-16 リンテック株式会社 Method for manufacturing composite sheet for forming protective film, method for manufacturing semiconductor chip with protective film, and method for manufacturing semiconductor device
WO2019187010A1 (en) * 2018-03-30 2019-10-03 リンテック株式会社 Composite sheet for protective film formation and method for producing same
WO2019187014A1 (en) * 2018-03-30 2019-10-03 リンテック株式会社 Support sheet and composite sheet for protective film formation
WO2019186990A1 (en) * 2018-03-30 2019-10-03 リンテック株式会社 Support sheet and composite sheet for protective film formation
WO2019186995A1 (en) * 2018-03-30 2019-10-03 リンテック株式会社 Support sheet and composite sheet for protective film formation
SG11202110169VA (en) * 2019-04-26 2021-10-28 Lintec Corp Method of manufacturing third laminate, method of manufacturing fourth laminate, method of manufacturing semiconductor device with back surface protective film, and third laminate
JP7478524B2 (en) 2019-09-05 2024-05-07 リンテック株式会社 Film for forming protective film, composite sheet for forming protective film, and method for manufacturing workpiece with protective film
JP7387510B2 (en) 2020-03-26 2023-11-28 リンテック株式会社 Protective film-forming film, protective film-forming composite sheet, and method for transporting workpieces with protective film-forming film
TWI811636B (en) * 2020-03-31 2023-08-11 日商東洋紡股份有限公司 Inorganic substrate/engineering plastic film laminate with protective film, stacking of laminates, storage method of laminates, and transportation method of laminates
CN111777961B (en) * 2020-07-15 2022-05-17 宁波东旭成新材料科技有限公司 Preparation method of UV (ultraviolet) anti-adhesion protective film
JP2022143454A (en) 2021-03-17 2022-10-03 リンテック株式会社 Support sheet, composite sheet for protective film formation, and method for manufacturing apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5457745B2 (en) * 2008-07-15 2014-04-02 サン・トックス株式会社 Base film
JP5124778B2 (en) * 2008-09-18 2013-01-23 リンテック株式会社 Laser dicing sheet and semiconductor chip manufacturing method
JP5452353B2 (en) 2010-05-14 2014-03-26 三井化学東セロ株式会社 Adhesive film for protecting semiconductor wafer and adhesive film roll for protecting semiconductor wafer
JP5391158B2 (en) * 2010-06-30 2014-01-15 古河電気工業株式会社 Wafer sticking adhesive sheet and wafer processing method using the same
JP5432853B2 (en) 2010-07-30 2014-03-05 日東電工株式会社 Dicing tape-integrated film for semiconductor back surface, manufacturing method thereof, and manufacturing method of semiconductor device
JP6010945B2 (en) * 2012-03-16 2016-10-19 住友ベークライト株式会社 Dicing film
JP5607847B1 (en) * 2013-11-29 2014-10-15 古河電気工業株式会社 Adhesive tape for semiconductor processing
SG11201609543VA (en) * 2014-05-23 2016-12-29 Lintec Corp Composite sheet for forming protective film

Also Published As

Publication number Publication date
KR102313074B1 (en) 2021-10-14
CN108966671A (en) 2018-12-07
TWI761335B (en) 2022-04-21
KR20180124868A (en) 2018-11-21
CN108966671B (en) 2023-09-26
WO2017163971A1 (en) 2017-09-28
TW201739078A (en) 2017-11-01
JPWO2017163971A1 (en) 2019-01-31
JP6893500B2 (en) 2021-06-23

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