PH12016502286A1 - Composite sheet for forming protective film - Google Patents
Composite sheet for forming protective filmInfo
- Publication number
- PH12016502286A1 PH12016502286A1 PH12016502286A PH12016502286A PH12016502286A1 PH 12016502286 A1 PH12016502286 A1 PH 12016502286A1 PH 12016502286 A PH12016502286 A PH 12016502286A PH 12016502286 A PH12016502286 A PH 12016502286A PH 12016502286 A1 PH12016502286 A1 PH 12016502286A1
- Authority
- PH
- Philippines
- Prior art keywords
- protective film
- composite sheet
- forming protective
- supporting sheet
- forming
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title abstract 3
- 239000002131 composite material Substances 0.000 title abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
Abstract
This composite sheet (3) for forming a protective film is provided with: a supporting sheet (4); and a protective film forming film (1) that is laminated on a first surface of the supporting sheet (4). A second surface of the supporting sheet (4) has an arithmetic mean roughness (Ra1) of 0.2 mm or more, and the second surface of the supporting sheet (4) has an arithmetic mean roughness (Ra2) of 0.25 mm or less after being heated at 130oC for 2 hours.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014106757 | 2014-05-23 | ||
PCT/JP2015/064202 WO2015178346A1 (en) | 2014-05-23 | 2015-05-18 | Composite sheet for forming protective film |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12016502286A1 true PH12016502286A1 (en) | 2017-02-13 |
Family
ID=54554016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12016502286A PH12016502286A1 (en) | 2014-05-23 | 2016-11-16 | Composite sheet for forming protective film |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6319433B2 (en) |
KR (1) | KR102378063B1 (en) |
CN (1) | CN106463373B (en) |
PH (1) | PH12016502286A1 (en) |
SG (1) | SG11201609543VA (en) |
TW (2) | TWI741336B (en) |
WO (1) | WO2015178346A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201609543VA (en) * | 2014-05-23 | 2016-12-29 | Lintec Corp | Composite sheet for forming protective film |
JP6893498B2 (en) * | 2016-02-22 | 2021-06-23 | リンテック株式会社 | Protective film forming sheet, manufacturing method of protective film forming sheet and manufacturing method of semiconductor device |
KR102233439B1 (en) * | 2016-03-02 | 2021-03-30 | 후루카와 덴키 고교 가부시키가이샤 | Wafer processing tape |
WO2017149926A1 (en) * | 2016-03-04 | 2017-09-08 | リンテック株式会社 | Semiconductor processing sheet |
JP6893500B2 (en) * | 2016-03-24 | 2021-06-23 | リンテック株式会社 | Composite sheet for forming a protective film |
TWI722170B (en) * | 2016-04-28 | 2021-03-21 | 日商琳得科股份有限公司 | Film for forming protective film and composite sheet for forming protective film |
TWI721158B (en) * | 2016-04-28 | 2021-03-11 | 日商琳得科股份有限公司 | Protective film forming film and composite sheet for forming protective film |
TWI778960B (en) * | 2016-04-28 | 2022-10-01 | 日商琳得科股份有限公司 | Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film |
JP6935807B2 (en) * | 2017-02-02 | 2021-09-15 | 昭和電工マテリアルズ株式会社 | Manufacturing method of electronic parts, resin composition for temporary protection and resin film for temporary protection |
JP6298226B1 (en) * | 2017-03-30 | 2018-03-20 | リンテック株式会社 | Composite sheet for protective film formation |
KR102445532B1 (en) * | 2017-03-30 | 2022-09-20 | 린텍 가부시키가이샤 | Composite sheet for forming a protective film |
JP2019079961A (en) * | 2017-10-25 | 2019-05-23 | リンテック株式会社 | Semiconductor processing sheet |
CN111989764A (en) * | 2018-04-18 | 2020-11-24 | 琳得科株式会社 | Sheet for processing workpiece |
JP7435624B2 (en) | 2019-12-23 | 2024-02-21 | 株式会社レゾナック | Dicing/die bonding integrated film, its quality control method, and semiconductor device manufacturing method |
JP2022157810A (en) | 2021-03-31 | 2022-10-14 | リンテック株式会社 | Support sheet, composite sheet for resin film formation, kit, and manufacturing method of chip with resin film |
JP2023144842A (en) | 2022-03-28 | 2023-10-11 | リンテック株式会社 | Composite sheet for resin film formation, kit, and method for manufacturing workpiece processed product with resin film |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58149048A (en) * | 1982-03-02 | 1983-09-05 | Sony Corp | Cover film for use in color hard copy printing paper |
EP1635390B1 (en) | 2002-03-12 | 2011-07-27 | Hamamatsu Photonics K. K. | Substrate dividing method |
JP4128058B2 (en) * | 2002-09-24 | 2008-07-30 | 三井化学株式会社 | Adhesive film and method of using the same |
JP5165829B2 (en) * | 2004-02-26 | 2013-03-21 | 日東電工株式会社 | Rolled wafer processing adhesive sheet |
JP4642436B2 (en) * | 2004-11-12 | 2011-03-02 | リンテック株式会社 | Marking method and protective film forming and dicing sheet |
JP2007109808A (en) * | 2005-10-12 | 2007-04-26 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer dicing die bond |
JP4762671B2 (en) | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | Dicing tape and semiconductor wafer dicing method |
JP2011040449A (en) * | 2009-08-07 | 2011-02-24 | Du Pont Mitsui Polychem Co Ltd | Substrate for dicing tape, the dicing tape, and method for manufacturing semiconductor device |
JP5603757B2 (en) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | Laser dicing adhesive sheet and method for manufacturing semiconductor device |
JP2011151362A (en) | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface |
WO2011096350A1 (en) * | 2010-02-02 | 2011-08-11 | 三井化学東セロ株式会社 | Surface protective film |
JP6188324B2 (en) * | 2010-03-01 | 2017-08-30 | スリーエム イノベイティブ プロパティズ カンパニー | Translucent film that protects rough surfaces |
JP5483713B2 (en) * | 2010-05-12 | 2014-05-07 | 日東電工株式会社 | Surface protection film |
JP5391158B2 (en) * | 2010-06-30 | 2014-01-15 | 古河電気工業株式会社 | Wafer sticking adhesive sheet and wafer processing method using the same |
JP2012033637A (en) * | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
WO2012172959A1 (en) * | 2011-06-14 | 2012-12-20 | 電気化学工業株式会社 | Adhesive sheet, and method for manufacturing electronic component |
US9786541B2 (en) * | 2011-09-30 | 2017-10-10 | Lintec Corporation | Dicing sheet with protective film forming layer and chip fabrication method |
JP5583725B2 (en) * | 2012-09-20 | 2014-09-03 | リンテック株式会社 | Laser dicing sheet-peeling sheet laminate, laser dicing sheet and chip body manufacturing method |
SG11201609543VA (en) * | 2014-05-23 | 2016-12-29 | Lintec Corp | Composite sheet for forming protective film |
-
2015
- 2015-05-18 SG SG11201609543VA patent/SG11201609543VA/en unknown
- 2015-05-18 KR KR1020167031951A patent/KR102378063B1/en active IP Right Grant
- 2015-05-18 WO PCT/JP2015/064202 patent/WO2015178346A1/en active Application Filing
- 2015-05-18 CN CN201580025643.4A patent/CN106463373B/en active Active
- 2015-05-18 JP JP2016521094A patent/JP6319433B2/en active Active
- 2015-05-20 TW TW108127491A patent/TWI741336B/en active
- 2015-05-20 TW TW104116042A patent/TWI675900B/en active
-
2016
- 2016-11-16 PH PH12016502286A patent/PH12016502286A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2015178346A1 (en) | 2015-11-26 |
JPWO2015178346A1 (en) | 2017-04-20 |
CN106463373B (en) | 2020-01-03 |
JP6319433B2 (en) | 2018-05-09 |
KR20170008749A (en) | 2017-01-24 |
CN106463373A (en) | 2017-02-22 |
TWI675900B (en) | 2019-11-01 |
TWI741336B (en) | 2021-10-01 |
TW201602303A (en) | 2016-01-16 |
TW201940624A (en) | 2019-10-16 |
KR102378063B1 (en) | 2022-03-23 |
SG11201609543VA (en) | 2016-12-29 |
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