MY164338A - Dicing film - Google Patents

Dicing film

Info

Publication number
MY164338A
MY164338A MYPI2017000684A MYPI2017000684A MY164338A MY 164338 A MY164338 A MY 164338A MY PI2017000684 A MYPI2017000684 A MY PI2017000684A MY PI2017000684 A MYPI2017000684 A MY PI2017000684A MY 164338 A MY164338 A MY 164338A
Authority
MY
Malaysia
Prior art keywords
base material
film
dicing film
dicing
layer
Prior art date
Application number
MYPI2017000684A
Inventor
Yoshinori Nagao
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY164338A publication Critical patent/MY164338A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

THE PRESENT INVENTION PROVIDES A BASE MATERIAL FILM (4) FOR A DICING FILM (100), INCLUDING A BASE MATERIAL LAYER (41) AND A SURFACE LAYER DISPOSED ON ONE MAIN SURFACE OF THE BASE MATERIAL LAYER (41), IN WHICH THE BASE MATERIAL LAYER (41) CONTAINS LOW-DENSITY POLYETHYLENE, THE SURFACE LAYER CONTAINS AN IONOMER RESIN, AND THE IONOMER RESIN HAS A MFR (MEASUREMENT METHOD: BASED ON JIS K 7210, MEASUREMENT CONDITIONS: A TEMPERATURE OF 190°C AND A LOAD OF 21.18 N) OF EQUAL TO OR LOWER THAN 3 G/10 MIN. THE PRESENT INVENTION ALSO PROVIDES A DICING FILM (100) INCLUDING THE BASE MATERIAL FILM (4) FOR A DICING FILM (100) AND AN ADHESIVE LAYER (60) DISPOSED ON A MAIN SURFACE ON THE SURFACE LAYER SIDE OF THE BASE MATERIAL FILM (4), AND A BLADE DICING METHOD USING THE DICING FILM (100). (FIG.1)
MYPI2017000684A 2014-11-19 2015-11-16 Dicing film MY164338A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014234102 2014-11-19

Publications (1)

Publication Number Publication Date
MY164338A true MY164338A (en) 2017-12-15

Family

ID=56013865

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017000684A MY164338A (en) 2014-11-19 2015-11-16 Dicing film

Country Status (5)

Country Link
JP (1) JP6103140B2 (en)
CN (1) CN107004587A (en)
MY (1) MY164338A (en)
TW (1) TWI642717B (en)
WO (1) WO2016080324A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6804860B2 (en) * 2016-04-05 2020-12-23 パナック株式会社 Manufacturing method of carrier sheet and cutting member
JP6875011B2 (en) * 2016-09-20 2021-05-19 リンテック株式会社 Adhesive sheet for semiconductor processing
JP7174518B2 (en) * 2017-11-16 2022-11-17 リンテック株式会社 Semiconductor device manufacturing method
JP7067904B2 (en) * 2017-11-16 2022-05-16 リンテック株式会社 Manufacturing method of semiconductor device
JP7154686B2 (en) * 2018-06-06 2022-10-18 株式会社ディスコ Wafer processing method
KR102359469B1 (en) * 2020-01-31 2022-02-08 주식회사 케이비엘러먼트 Dicing tape and manufacturing method for the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4744196B2 (en) * 2005-05-31 2011-08-10 電気化学工業株式会社 Adhesive sheet
JP2009200076A (en) * 2008-02-19 2009-09-03 Furukawa Electric Co Ltd:The Tape for processing wafer
JP2011210887A (en) * 2010-03-29 2011-10-20 Furukawa Electric Co Ltd:The Adhesive tape for processing radiation curing wafer
JP4976522B2 (en) * 2010-04-16 2012-07-18 日東電工株式会社 Thermosetting die bond film, dicing die bond film, and semiconductor device manufacturing method
JP5210346B2 (en) * 2010-04-19 2013-06-12 電気化学工業株式会社 Method for manufacturing adhesive sheet and electronic component
WO2012014487A1 (en) * 2010-07-28 2012-02-02 三井・デュポンポリケミカル株式会社 Laminate film, and film for use in production of semiconductor comprising same
JP5666875B2 (en) * 2010-10-21 2015-02-12 アキレス株式会社 Base film for tape for semiconductor manufacturing process
JP5889892B2 (en) * 2011-06-14 2016-03-22 デンカ株式会社 Method for manufacturing adhesive sheet and electronic component
JP2015162561A (en) * 2014-02-27 2015-09-07 住友ベークライト株式会社 dicing film

Also Published As

Publication number Publication date
JP6103140B2 (en) 2017-03-29
TWI642717B (en) 2018-12-01
CN107004587A (en) 2017-08-01
TW201629141A (en) 2016-08-16
WO2016080324A1 (en) 2016-05-26
JPWO2016080324A1 (en) 2017-04-27

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