KR970063686A - 유기 기판을 구비한 전자 요소의 제조 방법 - Google Patents

유기 기판을 구비한 전자 요소의 제조 방법 Download PDF

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KR970063686A
KR970063686A KR1019960076645A KR19960076645A KR970063686A KR 970063686 A KR970063686 A KR 970063686A KR 1019960076645 A KR1019960076645 A KR 1019960076645A KR 19960076645 A KR19960076645 A KR 19960076645A KR 970063686 A KR970063686 A KR 970063686A
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slot
inner edge
final package
organic substrate
package body
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빅터 케이. 노미
존 알 패스토어
찰스 지. 빅러
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빈센트 비. 인그라시아
모토로라 인코포레이티드
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Abstract

집적 회로를 패키지하는 방법은 하나 이상의 디바이스 사이트(312)를 구비한 유기 기판(310)을 제공함으로써 시작된다. 각 디바이스 내에서, 하나 이상의 전자 디바이스(532)가 설치된다. 디바이스 사이트 주위에는 슬롯(316) 및 코너 구멍(318)이 형성된다. 한 실시예에 있어서, 노치(326)와 같은, 네거티브 형태는 슬롯의 내부 에지(315)를 따라 기판에서 형성된다. 전자 디바이스가 설치되어 플라스틱 패키지 몸체(320)에서 개별화된 후, 디바이스는 최종 패키지 경계선(317)의 코너 영역을 펀칭함으로써 기판으로부터 절단된다. 슬롯, 코너 구멍, 및 노치의 배치는 버르가 없는 펀치 주위에 귀착되어, 최대 실제 접속 영역을 제공하고 펀칭 동작 동안 표면 또는 에지의 손상을 최소화한다. 노치를 대신하여, 돌출부(426)와 같은, 포지티브 형태를 펀칭 도구 세그먼트로 합체하여도 동일한 장점을 제공할 수 있다.

Description

유기 가판을 구비한 전자 요소의 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제7도는 본 발명의 한 실시예에 따라 노치를 포함하는 새로운 유기 기판 구조 및 단일 디바이스 사이트를 도시한 평면 투시도.

Claims (4)

  1. 전자 요소의 제조 방법에 있어서, 다수의 전도 트레이스(536)와 4측부의 각각을 따라 형성된 슬롯(316)를 갖는 디바이스 사이트(312)를 구비하며, 각 슬롯의 내부 에지는 최종 패키지 몸체(320)의 외형 크기를 한정하고, 각 슬롯은 두 단부를 구비하며, 형태(326)는 유기 기판에 형성되어 각 슬롯의 각 두 단부 부근의 내부 에지를 따라 배치되는 구성의 유기 기판(310)을 제공하는 단계와, 디바이스 사이트 내에 전자 디아비스(532)를 설치하는 단계와, 전자 디바이스를 다수의 전도 트레이스에 전기적으로 접속하는 단계와, 형태가 절단 동작중에 최종 패키지의 외부 에지의 손상을 방지하도록, 유기 기판으로부터 최종 패키지 몸체를 절단하는 단계를 포함하는 것을 특징으로 하는 전자 요소의 제조 방법.
  2. 전자 요소의 제조 방법에 있어서, 다수의 슬롯(316)에 의해 한정된 디바이스 사이트와 다수의 전도 트레이스(536)를 구비하고, 각 슬롯은 최종 패키지 몸체(320)의 외부 에지를 한정하는 내부 에지를 가지며 또한 두 대향하는 단부를 구비한 구성의 유기 기판(310)을 제공하는 단계와, 각 슬롯의 내부 에지를 따라서 두 대향하는 각 단부 부근에서 네거티브 형태(326)를 제공하는 단계와, 전자 디바이스(532)를 디바이스 사이트 내에 설치하는 단계와, 전자 디바이스를 다수의 전도 트레이스에 전기적으로 접속하는 단계와, 형태가 절단 동작중에 최종 패키지의 외부 에지의 손상을 방지하도록, 유기 기판으로부터 최종 패키지 몸체를 절단하는 단계를 포함하는 것을 특징으로 하는 전자 요소의 제조 방법.
  3. 반도체 디바이스의 제조 방법에 있어서, 다수의 전도 트레이스(536)와, 4측부와, 4측부의 각각을 따라 형성된 슬롯(316)를 갖는 디바이스 사이트를 구비하며, 각 슬롯의 내부 에지는 최종 패키지 몸체(320)의 외형 크기를 한정하고, 각 슬롯은 두 단부를 구비하며, 노치(326)는 각 슬롯의 각 두 단부 부근에서 내부 에지를 따라 형성된 구성의 유기 기판(310)을 제공하는 단계와, 디바이스 사이트 내에 반도체 다이(532)를 설치하는 단계와, 반도체 다이를 다수의 전도 트레이스에 전기적으로 접속하는 단계와, 각 노치와 일치하는 종단부를 구비한 펀치를 사용함으로써 디바이스 사이트의 코너에서 펀칭작업이 실행되도록, 유기 기판으로부터 최종 패키지 몸체를 펀칭하는 단계를 포함하는 것을 특징으로 하는 반도체 디바이스의 제조 방법.
  4. 반도체 디바이스의 제조 방법에 있어서, 다수의 전도 트레이스(536)와, 4측부와, 4측부의 각각을 따라 형성된 슬롯(316)를 갖는 디바이스 사이트를 구비하며, 각 슬롯의 내부 에지는 최종 패키지 몸체(320)의 외형 크기를 한정하고, 각 슬롯은 두 단부를 구비하며, 드릴된 구멍(326)은 각 슬롯의 두 단부의 각각의 부근에서 내부 에지를 따라 형성되고, 바이어(538)가 안쪽에 형성된 구성의 유기 기판(320)을 제공하는 단계를 포함하며, 상기 바이어는 제1직경을 구비하고, 드릴된 구멍은 제1직경과 실제로 동일한 제2직경을 구비하는 것을 특징으로 하는 반도체 디바이스의 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960076645A 1996-02-26 1996-12-30 유기기판을가진전자부품을제조하기위한방법 KR100429319B1 (ko)

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US08/606,981 US5691242A (en) 1996-02-26 1996-02-26 Method for making an electronic component having an organic substrate
US606,981 1996-02-26

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KR970063686A true KR970063686A (ko) 1997-09-12
KR100429319B1 KR100429319B1 (ko) 2004-07-19

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US (1) US5691242A (ko)
JP (1) JP4010591B2 (ko)
KR (1) KR100429319B1 (ko)
CN (1) CN1110076C (ko)
MX (1) MX9700608A (ko)
MY (1) MY113012A (ko)
TW (1) TW356588B (ko)

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KR101147929B1 (ko) * 2005-02-05 2012-05-22 하이맥스 테크놀로지스, 인코포레이션 슬롯을 구비한 기판

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JP4161399B2 (ja) * 1998-03-12 2008-10-08 沖電気工業株式会社 半導体装置用樹脂基板及び半導体装置
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