KR930001361A - 플립 칩 실장 및 결선 패키지 및 그 방법 - Google Patents
플립 칩 실장 및 결선 패키지 및 그 방법 Download PDFInfo
- Publication number
- KR930001361A KR930001361A KR1019920011120A KR920011120A KR930001361A KR 930001361 A KR930001361 A KR 930001361A KR 1019920011120 A KR1019920011120 A KR 1019920011120A KR 920011120 A KR920011120 A KR 920011120A KR 930001361 A KR930001361 A KR 930001361A
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- South Korea
- Prior art keywords
- substrate
- chip
- circuit
- circuit board
- conductive
- Prior art date
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- 238000000034 method Methods 0.000 title claims 10
- 239000004020 conductor Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 7
- 229910000679 solder Inorganic materials 0.000 claims 3
- 239000004593 Epoxy Substances 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 전도체들의 레이 아웃을 포함하는 본 발명의 반도체 칩의 부착 및 실장을 예시하는 다층 회로 기판의 사시도.
제2도는 제1도에 도시된 회로 기판의 다층 구조를 예시하는 단면도.
제3도는 제2도의 단면도를 확대한 도면.
Claims (19)
- 용적체를 통하여 연장하는 전도성 트레이스와, 홀과 연관된 전도성 트레이스의 부분을 노출시키기에 충분한 길이로 회로 기판의 표면으로부터 상기 용적체내로 연장하는 일련의 상기 홀을 가지는 상기 회로기판과; 상기 일련의 각각의 홀내의 전도성 물질과; 상기 홀내로 연장하며, 상기 전도성 물질과 접촉하여 상기 트레이스와 전기적 접속을 형성하는 일련의 금속 기둥을 가지는 반도체 칩을 포함하는 회로.
- 제1항에 있어서, 상기 전도성 물질은 땜납인 회로.
- 제1항에 있어서, 상기 전도성 물질은 전도성 에폭시인 회로.
- 제1항에 있어서, 상기 금속 기둥은 전착된 금속 기둥인 회로.
- 제1항에 있어서, 상기 회로 기판은 상기 반도체 칩과 인접한 공동을 형성하는 회로.
- 제5항에 있어서, 유전체 부동성 층이 상기 반도체 칩과 상기 회로기판 사이에서 연장하는 회로.
- 제6항에 있어서, 상기 유전체 부동성 층은 유리로 이루어진 회로.
- 제1항에 있어서, 상기 회로 기판상에 다수의 반도체 칩을 더 포함하는 회로
- 제1항에 있어서, 상기 기판은 다층 회로 기판인 회로.
- 제5항에 있어서, 상기 공동은 상기 홀들 사이에서 상기 칩의 대부분의 영역 아래에서 연장하므로써 상기 칩의 주요 부분을 회로 기판으로부터 격리시키는 공기 간극을 제공하는 회로.
- 입력/출력 패드를 가지는 칩을 기판상에 실장하는 방법이:그 용적체를 통하여 연장하는 전도성 트레이스를 가지는 기판을 형성하는 단계와; 금속 기둥을 상기 칩의 입력/출력 패드상에 형성하는 단계와; 상기 기판에 상기 전도성 트레이스에 접근하는 일련의 홀을 상기 칩의 상기 금속 기둥에 조화하는 패턴으로 형성하는 단계와; 상기 기판의 홀에 상기 트레이스와 전기적으로 접촉하는 전도성 물질을 배치하는 단계와; 상기 칩의 상기 금속 기둥을 상기 기판의 상기 홀내에 정렬시킴으로써 상기 칩을 상기 기판상에 실장하는 단계를 포함하는 방법.
- 제11항에 있어서, 상기 금속 기둥은 전기 도금에 의해 형성되는 방법.
- 제11항에 있어서, 상기 기판은 다층 회로 기판인 방법.
- 제13항에 있어서, 상기 회로 기판은 다층으로 되어 있으며, 상기 전도성 트레이스는 상기 회로 기판의 상기 층들사이에서 연장하는 방법.
- 제11항에 있어서, 상기 전도성 물질은 전도성 에폭시인 방법.
- 제11항에 있어서, 상기 전도성 물질은 땜납인 방법.
- 제16항에 있어서, 상기 기판을 가열하여 상기 칩의 기둥과 상기 전도성 트레이스 사이에 땜납 접속을 형성하는 단계를 더 포함하는 방법.
- 제11항에 있어서, 상기 기판에서 상기 기판의 외부로 개방된 공동을 형성하는 단계를 더 포함하며, 상기 칩은 상기 기판상에서 상기 공동위에 실장되는 방법.
- 제11항에 있어서, 상기 실장 단계 이전에 상기 유전체 부동성 층을 상기 반도체 칩에 인접하게 배치하는 단계를 더 포함하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72173591A | 1991-06-26 | 1991-06-26 | |
US721,735 | 1991-06-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930001361A true KR930001361A (ko) | 1993-01-16 |
KR960009092B1 KR960009092B1 (ko) | 1996-07-10 |
Family
ID=24899100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920011120A KR960009092B1 (ko) | 1991-06-26 | 1992-06-25 | 집적된 소켓형 패키지 및 기판상의 칩 실장 방법 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0520434A1 (ko) |
JP (1) | JPH0810718B2 (ko) |
KR (1) | KR960009092B1 (ko) |
AU (1) | AU647632B2 (ko) |
CA (1) | CA2071662A1 (ko) |
IL (1) | IL102269A (ko) |
Cited By (1)
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US9691434B2 (en) | 2014-10-20 | 2017-06-27 | Western Digital Technologies, Inc. | Feedthrough connector for hermetically sealed electronic devices |
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EP0657932B1 (en) * | 1993-12-13 | 2001-09-05 | Matsushita Electric Industrial Co., Ltd. | Chip package assembly and method of production |
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DE9419868U1 (de) * | 1994-12-12 | 1996-01-18 | Siemens AG, 80333 München | Mehrlagen-Leiterplatte |
US5561085A (en) * | 1994-12-19 | 1996-10-01 | Martin Marietta Corporation | Structure for protecting air bridges on semiconductor chips from damage |
JPH08288452A (ja) * | 1995-04-20 | 1996-11-01 | Mitsubishi Electric Corp | 集積回路装置,及びその製造方法 |
US5936847A (en) * | 1996-05-02 | 1999-08-10 | Hei, Inc. | Low profile electronic circuit modules |
US6549105B2 (en) | 1998-06-02 | 2003-04-15 | Matsushita Electric Industrial Co., Ltd. | Millimeter wave module and radio apparatus |
US6778041B2 (en) | 1998-06-02 | 2004-08-17 | Matsushita Electric Industrial Co., Ltd. | Millimeter wave module and radio apparatus |
JP3331967B2 (ja) * | 1998-06-02 | 2002-10-07 | 松下電器産業株式会社 | ミリ波モジュール |
DE19942631A1 (de) * | 1999-09-07 | 2001-03-08 | Endress Hauser Gmbh Co | Verfahren zum Bestücken einer Leiterplatte |
CN100386873C (zh) * | 2004-01-05 | 2008-05-07 | 扬智科技股份有限公司 | 打线接合封装体 |
US7297875B2 (en) * | 2004-04-27 | 2007-11-20 | Merrimac Industries, Inc. | Fusion bonded assembly with attached leads |
JP5139347B2 (ja) * | 2009-02-18 | 2013-02-06 | 新光電気工業株式会社 | 電子部品装置及びその製造方法 |
US9888568B2 (en) | 2012-02-08 | 2018-02-06 | Crane Electronics, Inc. | Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module |
JP6079501B2 (ja) * | 2013-08-12 | 2017-02-15 | アイシン・エィ・ダブリュ株式会社 | 電子部品モジュール |
US9230726B1 (en) | 2015-02-20 | 2016-01-05 | Crane Electronics, Inc. | Transformer-based power converters with 3D printed microchannel heat sink |
KR102587203B1 (ko) | 2015-07-13 | 2023-10-10 | 브룩스 오토메이션 인코퍼레이티드 | 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치 |
CN108027718B (zh) * | 2015-07-13 | 2022-04-08 | 博鲁可斯自动化美国有限责任公司 | 在传输中自动晶圆定中方法及设备 |
JP2017212283A (ja) * | 2016-05-24 | 2017-11-30 | ソニー株式会社 | 表示装置、および電子機器 |
US10189706B2 (en) * | 2016-11-08 | 2019-01-29 | Dunan Microstaq, Inc. | Method for self-aligning solder-attached MEMS die to a mounting surface |
CN117012658B (zh) * | 2023-07-27 | 2024-04-12 | 北京智创芯源科技有限公司 | 一种芯片倒装互连方法 |
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-
1992
- 1992-06-19 CA CA002071662A patent/CA2071662A1/en not_active Abandoned
- 1992-06-21 IL IL102269A patent/IL102269A/xx not_active IP Right Cessation
- 1992-06-24 AU AU18550/92A patent/AU647632B2/en not_active Ceased
- 1992-06-25 KR KR1019920011120A patent/KR960009092B1/ko not_active IP Right Cessation
- 1992-06-25 EP EP92110686A patent/EP0520434A1/en not_active Withdrawn
- 1992-06-26 JP JP4169374A patent/JPH0810718B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9691434B2 (en) | 2014-10-20 | 2017-06-27 | Western Digital Technologies, Inc. | Feedthrough connector for hermetically sealed electronic devices |
Also Published As
Publication number | Publication date |
---|---|
CA2071662A1 (en) | 1992-12-27 |
JPH0810718B2 (ja) | 1996-01-31 |
IL102269A0 (en) | 1993-01-14 |
JPH05275492A (ja) | 1993-10-22 |
KR960009092B1 (ko) | 1996-07-10 |
EP0520434A1 (en) | 1992-12-30 |
AU1855092A (en) | 1993-03-11 |
AU647632B2 (en) | 1994-03-24 |
IL102269A (en) | 1997-03-18 |
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