KR970053190A - Wire Bonding Method - Google Patents

Wire Bonding Method Download PDF

Info

Publication number
KR970053190A
KR970053190A KR1019950067132A KR19950067132A KR970053190A KR 970053190 A KR970053190 A KR 970053190A KR 1019950067132 A KR1019950067132 A KR 1019950067132A KR 19950067132 A KR19950067132 A KR 19950067132A KR 970053190 A KR970053190 A KR 970053190A
Authority
KR
South Korea
Prior art keywords
bonding method
wire bonding
lead
wire
bonding
Prior art date
Application number
KR1019950067132A
Other languages
Korean (ko)
Inventor
장성우
Original Assignee
서두칠
대우전자부품 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서두칠, 대우전자부품 주식회사 filed Critical 서두칠
Priority to KR1019950067132A priority Critical patent/KR970053190A/en
Publication of KR970053190A publication Critical patent/KR970053190A/en

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

본 발명은 와이어본딩 방법에 관한 것으로, 칩을 리드프레임 또는 기판위에 부착시키고, 알루미늄(Al) 또는 금(Au)으로 만들어진 와이어를 입출력 패드(16)와 리드(18)에 각각 연결하여 이루어진 본딩접합부(22)에 비전도성물질(24)로 코팅하게 됨으로써, 본딩접합부의 전단 및 인장강도를 강화시키므로써 제품의 신뢰성을 향상시키게 된 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method, wherein a bonding joint is formed by attaching a chip onto a lead frame or a substrate and connecting a wire made of aluminum (Al) or gold (Au) to the input / output pad 16 and the lead 18, respectively. By coating the non-conductive material (24) to (22), it is to improve the reliability of the product by strengthening the shear and tensile strength of the bonding joint.

Description

와이어본딩 방법Wire Bonding Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 와이어본딩의 종류를 설명하기 위한 도면으로, (가)는 볼본딩에 따른 와이어본딩, (나)는 웨지본딩에 따른 와이어본딩.2 is a view for explaining the type of wire bonding, (a) wire bonding according to ball bonding, (b) wire bonding according to wedge bonding.

Claims (1)

칩을 리드프레임 또는 기판위에 부착시키고, 알루미늄(Al) 또는 금(Au)으로 만들어진 와이어를 입출력 패드(16)와 리드(18)에 각각 연결하여 이루어진 본딩접합부(22)에 비전도성물질(24)로 코팅하게 된 것을 특징으로 하는 와이어본딩방법.The non-conductive material 24 is attached to a bonding joint 22 formed by attaching a chip on a lead frame or a substrate and connecting a wire made of aluminum (Al) or gold (Au) to the input / output pad 16 and the lead 18, respectively. Wire bonding method characterized in that the coating. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950067132A 1995-12-29 1995-12-29 Wire Bonding Method KR970053190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950067132A KR970053190A (en) 1995-12-29 1995-12-29 Wire Bonding Method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950067132A KR970053190A (en) 1995-12-29 1995-12-29 Wire Bonding Method

Publications (1)

Publication Number Publication Date
KR970053190A true KR970053190A (en) 1997-07-29

Family

ID=66638170

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950067132A KR970053190A (en) 1995-12-29 1995-12-29 Wire Bonding Method

Country Status (1)

Country Link
KR (1) KR970053190A (en)

Similar Documents

Publication Publication Date Title
EP0984051A4 (en) Heat-resistant adhesives and semiconductor devices produced therewith
TW200520120A (en) Semiconductor device package and method for manufacturing same
KR920020658A (en) Chip bonding method of semiconductor device
KR970042912A (en) Flip Chip Silicone Pressure Sensitive Conductive Adhesive
WO2003028088A3 (en) Methods of forming metallurgy structures for wire and solder bonding and related structures
KR980005922A (en) Low loop wire bonding
FR2720190B1 (en) Method for connecting the output pads of an integrated circuit chip, and multi-chip module thus obtained.
KR970053190A (en) Wire Bonding Method
KR920000118A (en) Wire Bonding Method
DE69615746T2 (en) Gold wire for bonding chips
KR900017719A (en) Wire bonding method
KR950009995A (en) Wire bonding method
EP0897215A3 (en) Surface acoustic wave device
KR910007597A (en) Wire bonding method
KR910003775A (en) Solder coating method of semiconductor device
KR970008540A (en) Lead Structure of Semiconductor Package Leadframe
EP0403783A3 (en) High strength low stress encapsulation of interconnected semiconductor devices
JPS62165944A (en) Wire connecting method
KR970003871A (en) Semiconductor package
KR930014856A (en) Semiconductor chip connection method
KR970053744A (en) Lead frame with increased wire bonding reliability
KR920001686A (en) Package structure using two-step bonding
KR920005240A (en) Semiconductor wire bonding method
TW352465B (en) Method for connecting semiconductor chips to a lead frame, and mounting support for such method
KR970058503A (en) Tab package mounting structure

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination