KR970053190A - Wire Bonding Method - Google Patents
Wire Bonding Method Download PDFInfo
- Publication number
- KR970053190A KR970053190A KR1019950067132A KR19950067132A KR970053190A KR 970053190 A KR970053190 A KR 970053190A KR 1019950067132 A KR1019950067132 A KR 1019950067132A KR 19950067132 A KR19950067132 A KR 19950067132A KR 970053190 A KR970053190 A KR 970053190A
- Authority
- KR
- South Korea
- Prior art keywords
- bonding method
- wire bonding
- lead
- wire
- bonding
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
Abstract
본 발명은 와이어본딩 방법에 관한 것으로, 칩을 리드프레임 또는 기판위에 부착시키고, 알루미늄(Al) 또는 금(Au)으로 만들어진 와이어를 입출력 패드(16)와 리드(18)에 각각 연결하여 이루어진 본딩접합부(22)에 비전도성물질(24)로 코팅하게 됨으로써, 본딩접합부의 전단 및 인장강도를 강화시키므로써 제품의 신뢰성을 향상시키게 된 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method, wherein a bonding joint is formed by attaching a chip onto a lead frame or a substrate and connecting a wire made of aluminum (Al) or gold (Au) to the input / output pad 16 and the lead 18, respectively. By coating the non-conductive material (24) to (22), it is to improve the reliability of the product by strengthening the shear and tensile strength of the bonding joint.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 와이어본딩의 종류를 설명하기 위한 도면으로, (가)는 볼본딩에 따른 와이어본딩, (나)는 웨지본딩에 따른 와이어본딩.2 is a view for explaining the type of wire bonding, (a) wire bonding according to ball bonding, (b) wire bonding according to wedge bonding.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950067132A KR970053190A (en) | 1995-12-29 | 1995-12-29 | Wire Bonding Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950067132A KR970053190A (en) | 1995-12-29 | 1995-12-29 | Wire Bonding Method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053190A true KR970053190A (en) | 1997-07-29 |
Family
ID=66638170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950067132A KR970053190A (en) | 1995-12-29 | 1995-12-29 | Wire Bonding Method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053190A (en) |
-
1995
- 1995-12-29 KR KR1019950067132A patent/KR970053190A/en not_active Application Discontinuation
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0984051A4 (en) | Heat-resistant adhesives and semiconductor devices produced therewith | |
TW200520120A (en) | Semiconductor device package and method for manufacturing same | |
KR920020658A (en) | Chip bonding method of semiconductor device | |
KR970042912A (en) | Flip Chip Silicone Pressure Sensitive Conductive Adhesive | |
WO2003028088A3 (en) | Methods of forming metallurgy structures for wire and solder bonding and related structures | |
KR980005922A (en) | Low loop wire bonding | |
FR2720190B1 (en) | Method for connecting the output pads of an integrated circuit chip, and multi-chip module thus obtained. | |
KR970053190A (en) | Wire Bonding Method | |
KR920000118A (en) | Wire Bonding Method | |
DE69615746T2 (en) | Gold wire for bonding chips | |
KR900017719A (en) | Wire bonding method | |
KR950009995A (en) | Wire bonding method | |
EP0897215A3 (en) | Surface acoustic wave device | |
KR910007597A (en) | Wire bonding method | |
KR910003775A (en) | Solder coating method of semiconductor device | |
KR970008540A (en) | Lead Structure of Semiconductor Package Leadframe | |
EP0403783A3 (en) | High strength low stress encapsulation of interconnected semiconductor devices | |
JPS62165944A (en) | Wire connecting method | |
KR970003871A (en) | Semiconductor package | |
KR930014856A (en) | Semiconductor chip connection method | |
KR970053744A (en) | Lead frame with increased wire bonding reliability | |
KR920001686A (en) | Package structure using two-step bonding | |
KR920005240A (en) | Semiconductor wire bonding method | |
TW352465B (en) | Method for connecting semiconductor chips to a lead frame, and mounting support for such method | |
KR970058503A (en) | Tab package mounting structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |