KR920001686A - Package structure using two-step bonding - Google Patents

Package structure using two-step bonding Download PDF

Info

Publication number
KR920001686A
KR920001686A KR1019900008487A KR900008487A KR920001686A KR 920001686 A KR920001686 A KR 920001686A KR 1019900008487 A KR1019900008487 A KR 1019900008487A KR 900008487 A KR900008487 A KR 900008487A KR 920001686 A KR920001686 A KR 920001686A
Authority
KR
South Korea
Prior art keywords
package structure
auxiliary
paddle
lead
chip
Prior art date
Application number
KR1019900008487A
Other languages
Korean (ko)
Inventor
차기본
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019900008487A priority Critical patent/KR920001686A/en
Publication of KR920001686A publication Critical patent/KR920001686A/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용 없음No content

Description

2스텝 본딩을 이용한 패키지 구조Package structure using two-step bonding

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2(A)도 본 발명에 의한 패키지 구조의 평면도2 (A) is also a plan view of a package structure according to the present invention

제2(B)도 본 발명에 의한 패키지 구조의 단면도2 (B) is also a cross-sectional view of the package structure according to the present invention

제2(C)도 (A)(B)의 요부 사시도Main part perspective view of FIG. 2 (C) (A) (B)

Claims (2)

리드 프레임 패물(1)에 칩(3)이 부착되고 칩(3)의 본드패드(6)와 리드(7)가 1스텝 와이어 본딩에 의해 연결되는 패키지구조에 있어서, 이 리드프레임 패들(1)과 리드(7)사이에는 보조패들(1a)이 리드프레임 패들(1)과 일체로 형성되고 이 보조패들(1a)위에는 상, 하부가 각각 연결편(5) 및 절연필름(4)으로 이루어진 임의 갯수의 보조본드패드(2)가 부착되며, 칩(3)의 본드패드(6)와 리드(7)는 보조본드패드(2)를 사이에 두고 와이어(8) (9)로 연결되어짐을 특징으로 하는 2스텝 본딩을 이용한 패키지 구조.In the package structure in which the chip 3 is attached to the lead frame pad 1 and the bond pad 6 and the lead 7 of the chip 3 are connected by one-step wire bonding, the lead frame paddle 1 An auxiliary paddle 1a is formed integrally with the leadframe paddle 1 between the lead 7 and the lead 7, and the upper and lower portions of the auxiliary paddle 1a are formed of a connecting piece 5 and an insulating film 4, respectively. Any number of auxiliary bond pads 2 are attached, and the bond pads 6 and leads 7 of the chip 3 are connected by wires 8 and 9 with the auxiliary bond pads 2 interposed therebetween. Package structure using two-step bonding. 제1항에 있어서, 보조본드패드(2)의 상부 연결편(5)의 상측 중앙부위에는 V홈(11)을 형성시킨을 특징으로 하는 2스텝 본딩을 이용한 패키지 구조.The package structure using a two-step bonding according to claim 1, wherein a V-groove (11) is formed in the upper central portion of the upper connection piece (5) of the auxiliary bond pad (2). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900008487A 1990-06-09 1990-06-09 Package structure using two-step bonding KR920001686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900008487A KR920001686A (en) 1990-06-09 1990-06-09 Package structure using two-step bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900008487A KR920001686A (en) 1990-06-09 1990-06-09 Package structure using two-step bonding

Publications (1)

Publication Number Publication Date
KR920001686A true KR920001686A (en) 1992-01-30

Family

ID=67482393

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900008487A KR920001686A (en) 1990-06-09 1990-06-09 Package structure using two-step bonding

Country Status (1)

Country Link
KR (1) KR920001686A (en)

Similar Documents

Publication Publication Date Title
KR860007735A (en) Semiconductor device, manufacturing method thereof, and lead frame used in manufacturing method
KR920010853A (en) Resin-sealed semiconductor device
KR890007410A (en) Semiconductor devices
KR880011939A (en) Assembly method of semiconductor laser
KR980005922A (en) Low loop wire bonding
KR920015525A (en) Semiconductor device
KR920001686A (en) Package structure using two-step bonding
KR930011190A (en) Semiconductor leadframe
KR970008537A (en) Leadframes for lead-on chips with extended leads
KR960043143A (en) Lead Frames for Semiconductor Packages
KR970024081A (en) Chip scale package with leadframe
KR930007920Y1 (en) Double package structure having both side thin film
KR970023917A (en) Semiconductor package to prevent short circuit of wire
KR870000753A (en) Resin Sealed Semiconductor Device
KR880003425A (en) Resin-sealed semiconductor device
KR970023905A (en) Semiconductor L.O.C (Lead On Chip) Package Structure
KR970053681A (en) Package with die pad structure to prevent package cracking
KR960035996A (en) Chip Holding Lead-on Chip Type Semiconductor Package
KR970053779A (en) BLP package
KR970053650A (en) BLP package
KR910010675A (en) Semiconductor device
KR920005377A (en) SOJ / ZIP Package with Jumper Pads
KR920013683A (en) Semiconductor leadframe
KR920007156A (en) Resin Sealed Semiconductor Device
KR970003871A (en) Semiconductor package

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination