EP0897215A3 - Surface acoustic wave device - Google Patents

Surface acoustic wave device Download PDF

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Publication number
EP0897215A3
EP0897215A3 EP98402035A EP98402035A EP0897215A3 EP 0897215 A3 EP0897215 A3 EP 0897215A3 EP 98402035 A EP98402035 A EP 98402035A EP 98402035 A EP98402035 A EP 98402035A EP 0897215 A3 EP0897215 A3 EP 0897215A3
Authority
EP
European Patent Office
Prior art keywords
acoustic wave
surface acoustic
wave device
holes
wave element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98402035A
Other languages
German (de)
French (fr)
Other versions
EP0897215A2 (en
Inventor
Makoto Shibutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of EP0897215A2 publication Critical patent/EP0897215A2/en
Publication of EP0897215A3 publication Critical patent/EP0897215A3/en
Withdrawn legal-status Critical Current

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    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

A surface acoustic wave device substantially eliminates a stress caused by a curing shrinkage of an adhesive (8) and substantially eliminates a strain in a case (2) containing a surface acoustic wave element (3) to prevent variation in characteristics of the surface acoustic wave device. In addition, a strength of joining of bonding wires (14, 15) provided in the surface acoustic wave device is improved to have an improved reliability. The surface acoustic wave element (3) of the surface acoustic wave device is fixed on a case member (4) via a soft adhesive (8) and bonding electrodes (9a, 9b) of the surface acoustic wave element have a plurality of through holes (11). Ends of the bonding wires (14, 15) are wire-bonded to the bonding electrodes (9a, 9b) having the through holes (11) formed therein.
EP98402035A 1997-08-11 1998-08-11 Surface acoustic wave device Withdrawn EP0897215A3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP216494/97 1997-08-11
JP21649497 1997-08-11
JP9216494A JPH1168504A (en) 1997-08-11 1997-08-11 Surface acoustic wave device

Publications (2)

Publication Number Publication Date
EP0897215A2 EP0897215A2 (en) 1999-02-17
EP0897215A3 true EP0897215A3 (en) 2000-08-09

Family

ID=16689320

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98402035A Withdrawn EP0897215A3 (en) 1997-08-11 1998-08-11 Surface acoustic wave device

Country Status (4)

Country Link
US (1) US6087756A (en)
EP (1) EP0897215A3 (en)
JP (1) JPH1168504A (en)
CN (1) CN1144359C (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000307373A (en) 1999-02-18 2000-11-02 Murata Mfg Co Ltd Surface wave unit and its manufacture
JP3428488B2 (en) * 1999-04-12 2003-07-22 株式会社村田製作所 Electronic component manufacturing method
US6297562B1 (en) * 1999-09-20 2001-10-02 Telefonaktieboalget Lm Ericsson (Publ) Semiconductive chip having a bond pad located on an active device
JP2001267355A (en) * 2000-03-17 2001-09-28 Murata Mfg Co Ltd Method for wire bonding and surface acoustic wave device using the method for wire bonding
JP3764450B2 (en) * 2003-07-28 2006-04-05 Ｔｄｋ株式会社 Surface acoustic wave device, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave device
JP5036840B2 (en) * 2010-03-25 2012-09-26 株式会社東芝 Light emitting element
WO2016006189A1 (en) * 2014-07-07 2016-01-14 Skyworks Panasonic Filter Solutions Japan Co., Ltd. Acoustic wave devices, and antenna duplexers, modules, and communication devices using same
CN112564661A (en) * 2020-12-03 2021-03-26 广东广纳芯科技有限公司 Method for improving interface bonding strength of surface acoustic wave filter film layer

Citations (4)

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Publication number Priority date Publication date Assignee Title
JPS6119136A (en) * 1984-07-05 1986-01-28 Toshiba Corp Wire-bonding method for semiconductor device and bonding pad to be used for that
JPS63161634A (en) * 1986-12-24 1988-07-05 Nec Corp Semiconductor integrated circuit device
JPH0637135A (en) * 1992-07-20 1994-02-10 Murata Mfg Co Ltd Semiconductor device
US5686762A (en) * 1995-12-21 1997-11-11 Micron Technology, Inc. Semiconductor device with improved bond pads

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GB2108800B (en) * 1981-10-14 1985-03-20 Gen Electric Co Plc Surface acoustic wave devices
JPS59232432A (en) * 1983-06-15 1984-12-27 Fujitsu Ltd Manufacture of hybrid integrated circuit
JPS61172362A (en) * 1985-01-28 1986-08-04 Seiko Epson Corp Bonding electrode structure
JPS62174934A (en) * 1986-01-28 1987-07-31 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
US4999535A (en) * 1989-09-25 1991-03-12 The United States Of America As Represented By The Secretary Of The Army Saw transducer with improved bus-bar design

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JPS6119136A (en) * 1984-07-05 1986-01-28 Toshiba Corp Wire-bonding method for semiconductor device and bonding pad to be used for that
JPS63161634A (en) * 1986-12-24 1988-07-05 Nec Corp Semiconductor integrated circuit device
JPH0637135A (en) * 1992-07-20 1994-02-10 Murata Mfg Co Ltd Semiconductor device
US5686762A (en) * 1995-12-21 1997-11-11 Micron Technology, Inc. Semiconductor device with improved bond pads

Non-Patent Citations (4)

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Title
HIROMI YATSUDA ET AL: "MINIATURIZED SAW FILTERS USING A FLIP-CHIP TECHNIQUE", IEEE TRANSACTIONS ON ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL,US,IEEE INC. NEW.YORK, vol. 43, no. 1, 1 January 1996 (1996-01-01), pages 125 - 129, XP000557496, ISSN: 0885-3010 *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 168 (E - 411) 14 June 1986 (1986-06-14) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 423 (E - 680) 9 November 1988 (1988-11-09) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 252 (E - 1547) 13 May 1994 (1994-05-13) *

Also Published As

Publication number Publication date
JPH1168504A (en) 1999-03-09
US6087756A (en) 2000-07-11
CN1144359C (en) 2004-03-31
CN1216415A (en) 1999-05-12
EP0897215A2 (en) 1999-02-17

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