KR970058503A - Tab package mounting structure - Google Patents

Tab package mounting structure Download PDF

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Publication number
KR970058503A
KR970058503A KR1019950046012A KR19950046012A KR970058503A KR 970058503 A KR970058503 A KR 970058503A KR 1019950046012 A KR1019950046012 A KR 1019950046012A KR 19950046012 A KR19950046012 A KR 19950046012A KR 970058503 A KR970058503 A KR 970058503A
Authority
KR
South Korea
Prior art keywords
tab package
pad
pcb substrate
package
mounting structure
Prior art date
Application number
KR1019950046012A
Other languages
Korean (ko)
Other versions
KR100206871B1 (en
Inventor
이원기
Original Assignee
문정환
Lg 반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체 주식회사 filed Critical 문정환
Priority to KR1019950046012A priority Critical patent/KR100206871B1/en
Publication of KR970058503A publication Critical patent/KR970058503A/en
Application granted granted Critical
Publication of KR100206871B1 publication Critical patent/KR100206871B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명은 탭 패키지(TAB PACKAGE)의 실장구조에 관한 것으로, 종래 피시비 기판에 탭 패키지를 실장한 구조는 본딩 패의 면적이 너무 작아 기계적인 접착력이 약하게 되어 작은 힘에도 접착부분이 떨어져 피시비 기판에서 탭 패키지가 이탈되는 문제점이 있었던 바, 본 발명은 피시비 기판(10)의 상부에 본드패드(11)가 구비된 연결단자(12)와 그 본드패드(11)보다 넓은 패드부(13)가 구비된 연결단자(12')를 교대로 형성하고, 탭 패키지(14)의 상면에 본딩패드(15)보다 넓게 접착부(16)를 형성하여 상기 패드부(13)에 접착부(16)가 부착되도록 탭 패키지(14)를 실장함으로써 접착면적이 넓어지는데 따른 접착력이 향상되어 피시비 기판에서 탭 패키지가 떨어지는 것이 방지되는 효과가 있다.The present invention relates to a mounting structure of a tab package (TAB PACKAGE), the conventional structure in which the tab package is mounted on the PCB substrate, the bonding pad area is too small, the mechanical adhesive force is weakened, the adhesion portion is separated from the PCB substrate in the small force Since the tab package is separated, the present invention provides a connection terminal 12 having a bond pad 11 on the PCB substrate 10 and a pad portion 13 wider than the bond pad 11. The connection terminals 12 ′ alternately formed, and the adhesive part 16 is formed on the upper surface of the tab package 14 to be wider than the bonding pad 15 so that the adhesive part 16 is attached to the pad part 13. The mounting of the package 14 improves the adhesive force as the adhesive area is widened, thereby preventing the tab package from falling off the PCB substrate.

Description

탭 패키지 실장구조Tab package mounting structure

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명 피시비 기판과 탭 패키지를 각각 보인 평면도.3 is a plan view showing a PCB substrate and a tab package of the present invention, respectively.

제4도는 본 발명에 의한 탭 패키지의 실장구조를 보인 평면도.4 is a plan view showing the mounting structure of the tab package according to the present invention.

Claims (2)

피시비 기판의 상면에 형성되는 수개의 연결단자의 단부에 그 연결단자 보다 넓게 패드부가 형성되고, 탭 패키지의 상면에 형성된 수개의 본딩패드의 단부에 그 본딩패드 보다 넓게 접착부가 형성되며, 상기 피시비 기판의 패드부에 탭 패키지의 접착부가 고정부착되도록 실장된 것을 특징으로 하는 탭 패키지의 실장구조.The pad portion is formed at the end of several connecting terminals formed on the upper surface of the PCB, and the bonding portion is formed at the end of several bonding pads formed on the upper surface of the tab package, the bonding portion is wider than the bonding pad. The mounting structure of the tab package, characterized in that the mounting portion is fixed to the adhesive portion of the tab package to the pad portion. 제1항에 있어서, 상기 피시비 기판에 형성된 패드부는 수개의 연결단자에 교대로 형성되고, 상기 탭 패키지에 형성된 접착부가 상기 패드부에 대응되도록 수개의 본딩패드에 교대로 형성된 것을 특징으로 하는 탭 패키지의 실장구조.The tab package of claim 1, wherein the pad part formed on the PCB substrate is alternately formed on several connection terminals, and the adhesive part formed on the tab package is alternately formed on several bonding pads so as to correspond to the pad part. Mounting structure. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950046012A 1995-12-01 1995-12-01 Tap package mounting structure KR100206871B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950046012A KR100206871B1 (en) 1995-12-01 1995-12-01 Tap package mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950046012A KR100206871B1 (en) 1995-12-01 1995-12-01 Tap package mounting structure

Publications (2)

Publication Number Publication Date
KR970058503A true KR970058503A (en) 1997-07-31
KR100206871B1 KR100206871B1 (en) 1999-07-01

Family

ID=19437324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950046012A KR100206871B1 (en) 1995-12-01 1995-12-01 Tap package mounting structure

Country Status (1)

Country Link
KR (1) KR100206871B1 (en)

Also Published As

Publication number Publication date
KR100206871B1 (en) 1999-07-01

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