KR970058503A - Tab package mounting structure - Google Patents
Tab package mounting structure Download PDFInfo
- Publication number
- KR970058503A KR970058503A KR1019950046012A KR19950046012A KR970058503A KR 970058503 A KR970058503 A KR 970058503A KR 1019950046012 A KR1019950046012 A KR 1019950046012A KR 19950046012 A KR19950046012 A KR 19950046012A KR 970058503 A KR970058503 A KR 970058503A
- Authority
- KR
- South Korea
- Prior art keywords
- tab package
- pad
- pcb substrate
- package
- mounting structure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Abstract
본 발명은 탭 패키지(TAB PACKAGE)의 실장구조에 관한 것으로, 종래 피시비 기판에 탭 패키지를 실장한 구조는 본딩 패의 면적이 너무 작아 기계적인 접착력이 약하게 되어 작은 힘에도 접착부분이 떨어져 피시비 기판에서 탭 패키지가 이탈되는 문제점이 있었던 바, 본 발명은 피시비 기판(10)의 상부에 본드패드(11)가 구비된 연결단자(12)와 그 본드패드(11)보다 넓은 패드부(13)가 구비된 연결단자(12')를 교대로 형성하고, 탭 패키지(14)의 상면에 본딩패드(15)보다 넓게 접착부(16)를 형성하여 상기 패드부(13)에 접착부(16)가 부착되도록 탭 패키지(14)를 실장함으로써 접착면적이 넓어지는데 따른 접착력이 향상되어 피시비 기판에서 탭 패키지가 떨어지는 것이 방지되는 효과가 있다.The present invention relates to a mounting structure of a tab package (TAB PACKAGE), the conventional structure in which the tab package is mounted on the PCB substrate, the bonding pad area is too small, the mechanical adhesive force is weakened, the adhesion portion is separated from the PCB substrate in the small force Since the tab package is separated, the present invention provides a connection terminal 12 having a bond pad 11 on the PCB substrate 10 and a pad portion 13 wider than the bond pad 11. The connection terminals 12 ′ alternately formed, and the adhesive part 16 is formed on the upper surface of the tab package 14 to be wider than the bonding pad 15 so that the adhesive part 16 is attached to the pad part 13. The mounting of the package 14 improves the adhesive force as the adhesive area is widened, thereby preventing the tab package from falling off the PCB substrate.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명 피시비 기판과 탭 패키지를 각각 보인 평면도.3 is a plan view showing a PCB substrate and a tab package of the present invention, respectively.
제4도는 본 발명에 의한 탭 패키지의 실장구조를 보인 평면도.4 is a plan view showing the mounting structure of the tab package according to the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950046012A KR100206871B1 (en) | 1995-12-01 | 1995-12-01 | Tap package mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950046012A KR100206871B1 (en) | 1995-12-01 | 1995-12-01 | Tap package mounting structure |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970058503A true KR970058503A (en) | 1997-07-31 |
KR100206871B1 KR100206871B1 (en) | 1999-07-01 |
Family
ID=19437324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950046012A KR100206871B1 (en) | 1995-12-01 | 1995-12-01 | Tap package mounting structure |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100206871B1 (en) |
-
1995
- 1995-12-01 KR KR1019950046012A patent/KR100206871B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100206871B1 (en) | 1999-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR900005587A (en) | Semiconductor device and manufacturing method | |
KR940003002A (en) | Integrated circuit | |
KR860007735A (en) | Semiconductor device, manufacturing method thereof, and lead frame used in manufacturing method | |
KR970077555A (en) | Stacked bottom lead package | |
EP0966038A3 (en) | Bonding of semiconductor power devices | |
KR970003884A (en) | Semiconductor devices | |
KR850008244A (en) | Semiconductor devices | |
KR970058503A (en) | Tab package mounting structure | |
KR970058434A (en) | Bonding pad of printed circuit board (PCB) in LCD display device | |
KR930003333A (en) | Semiconductor devices | |
KR930007920Y1 (en) | Double package structure having both side thin film | |
KR970023917A (en) | Semiconductor package to prevent short circuit of wire | |
KR930017158A (en) | Semiconductor package | |
KR200154809Y1 (en) | A lead frame of surface acoustic filter | |
KR970030530A (en) | Flip chip packing structure with supporting means for electrical connection | |
KR970067796A (en) | LOC package with internal leads directly bonded to bonding pads | |
KR910010675A (en) | Semiconductor device | |
KR970053652A (en) | Package with Tab Tape | |
KR970024084A (en) | Semiconductor Chip Package Using Substrate Pads | |
KR970053650A (en) | BLP package | |
KR970077550A (en) | A gull wing type package in which the distal end of the lead foot is bent upward | |
KR970013283A (en) | Laminated chip packing structure using tab tape | |
KR970053640A (en) | Columnar package | |
KR960703274A (en) | ELECTRICALLY AND THERMALLY ENHANCED PACKAGE USING A SEPARATE SILICON SUBSTRATE | |
KR970023950A (en) | Holder cap with fastening means for cushioning |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050322 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |