KR970023898A - Lead Frame Feeder in Automatic Molding Equipment - Google Patents
Lead Frame Feeder in Automatic Molding Equipment Download PDFInfo
- Publication number
- KR970023898A KR970023898A KR1019950037050A KR19950037050A KR970023898A KR 970023898 A KR970023898 A KR 970023898A KR 1019950037050 A KR1019950037050 A KR 1019950037050A KR 19950037050 A KR19950037050 A KR 19950037050A KR 970023898 A KR970023898 A KR 970023898A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- molding
- block
- chase block
- seated
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
본 발명은 자동 몰딩 장비에서의 중앙부위에는 와이어 본딩이 완료된 반도체 칩이 설치되고, 가장자리에는 일정간격으로 홀이 형성된 리이드 프레임 공급장치에 있어서, 중앙부위에 일정간격으로 리이드 프레임의 일면 일부를 몰딩시키기 위한 제1몰딩 다이가 형성되어 있고, 일측에는 상면에 안착되는 리이드 프레임의 홀이 각각 삽탈되는 위치핀이 형성되며, 또 다른 축에는 리이드 프레임의 홀이 위치핀에서 빠질때에 리이드 프레임의 가장자리를 지지하여 리이드 프레임이 수평을 유지하도록 하는 가이드핀이 형성되어 있는 체이스 블럭과, 체이스 블럭의 상단에 설치되고, 양측에는 클로즈드되어 리이드 프레임의 가장자리를 잡아서 리이드 프레임를 로딩시키거나, 오픈되어 리이드 프레임를 놓아서 리이드 프레임을 언로딩시켜서 체이스 블럭의 상면에 안착되도록 하는 핑거가 형성되고, 또한 리이드 프레임의 위치를 고정시키기 위하여 리이드 프레임의 홀이 삽탈되는 센서핀이 양측에 형성되어 있는 가이드 블럭과, 가이드 블럭의 중앙부위에 설치되고, 체이스 블럭의 제1몰딩다이에 대응되어 형성되어서 핑거가 오픈됨에 따라 체이스 블럭에 상면에 안착되는 리이드 프레임에서의 체이스 블럭의 제1몰딩다이에 의해 몰딩된 부위에 대칭되는 리이드 프레임의 반대면을 몰딩시키기 위한 제2몰딩다이가 하단부에 형성되어 있는 프레스를 포함하여 이루어진다.The present invention provides a lead frame supplying device in which a semiconductor chip in which wire bonding is completed is installed at a center portion of an automatic molding equipment, and holes are formed at a predetermined interval at an edge thereof, and for molding a part of one surface of the lead frame at a predetermined interval at a central portion thereof. A first molding die is formed, and on one side, a position pin for inserting holes of the lead frame seated on the upper surface thereof is formed, and another axis supports the edge of the lead frame when the hole of the lead frame is removed from the position pin. And a chase block having guide pins to keep the lead frame horizontal, and is installed at the top of the chase block, and is closed on both sides to hold the edge of the lead frame to load the lead frame, or open the lead frame to release the lead frame. Unload the chase block Fingers are formed to be seated on the upper surface, and the guide block is formed on both sides of the sensor pin to be inserted into the hole of the lead frame in order to fix the position of the lead frame, and the central portion of the guide block, A molding for molding the opposite surface of the lead frame which is formed corresponding to the first molding die and is symmetrical to the part molded by the first molding die of the chase block in the lead frame seated on the top surface as the finger is opened. Two molding dies are formed, including a press formed at the lower end.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제3도는 본 발명에 의한 자동 몰딩 장비에서의 리이드 프레임 공급장치를 도시한 정면도 및 측면도.3 is a front view and a side view showing a lead frame supply apparatus in the automatic molding equipment according to the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950037050A KR0165817B1 (en) | 1995-10-25 | 1995-10-25 | Lead frame supply apparatus in automatic molding equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950037050A KR0165817B1 (en) | 1995-10-25 | 1995-10-25 | Lead frame supply apparatus in automatic molding equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970023898A true KR970023898A (en) | 1997-05-30 |
KR0165817B1 KR0165817B1 (en) | 1999-02-01 |
Family
ID=19431243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950037050A KR0165817B1 (en) | 1995-10-25 | 1995-10-25 | Lead frame supply apparatus in automatic molding equipment |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0165817B1 (en) |
-
1995
- 1995-10-25 KR KR1019950037050A patent/KR0165817B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0165817B1 (en) | 1999-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1214254B (en) | SEMICONDUCTOR DEVICE IN PLASTIC OR CERAMIC CONTAINER WITH "CHIPS" FIXED ON BOTH SIDES OF THE CENTRAL ISLAND OF THE "FRAME". | |
EP0825653A3 (en) | Optoelectronic device package | |
EP0397320A3 (en) | Encapsulated integrated circuit with lead frame | |
KR950015738A (en) | Semiconductor lead frame | |
KR910015034A (en) | Resin Encapsulation Device of Semiconductor Device | |
DE69112264T2 (en) | Automatic equalizer and semiconductor integrated circuit containing such an equalizer. | |
KR970023898A (en) | Lead Frame Feeder in Automatic Molding Equipment | |
KR970008432A (en) | Package Forming Equipment | |
KR910020875A (en) | Leadframe for IC | |
KR930007173Y1 (en) | Rack for inserting lead frame hole | |
JPH07202080A (en) | Mounter for ic package to ic socket | |
KR920006175Y1 (en) | Lead frame cutter | |
KR970024106A (en) | Upset Adjusted Lead Frame and Semiconductor Chip Packages Using the Same | |
KR19990008641U (en) | Inclined mill pin device of injection mold | |
KR960015865A (en) | Semiconductor package | |
KR920010799A (en) | Wire bonding method | |
KR940004791A (en) | Lead frame for semiconductor | |
KR970018272A (en) | Degate device with displacement prevention stripper | |
KR960026686A (en) | How to Strengthen Package Adhesion in IC Lead Frame | |
KR970053288A (en) | Lead frame positioning device of semiconductor molding mold | |
JPS58127643U (en) | Mold for semiconductor integrated circuits | |
JPH03283369A (en) | Ic socket | |
KR940016716A (en) | Leadframe Structure for Mounting Rectangular Dies | |
IT1230934B (en) | OPENING PROCEDURE FOR MICROMETRIC CONTACTS IN SEMICONDUCTOR ELECTRONIC DEVICES. | |
JPS59143152U (en) | Adjustable plate sliding device for free size telephone stand |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050824 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |