KR970053288A - Lead frame positioning device of semiconductor molding mold - Google Patents

Lead frame positioning device of semiconductor molding mold Download PDF

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Publication number
KR970053288A
KR970053288A KR1019950046845A KR19950046845A KR970053288A KR 970053288 A KR970053288 A KR 970053288A KR 1019950046845 A KR1019950046845 A KR 1019950046845A KR 19950046845 A KR19950046845 A KR 19950046845A KR 970053288 A KR970053288 A KR 970053288A
Authority
KR
South Korea
Prior art keywords
lead frame
loaded
positioning
exposed
molding mold
Prior art date
Application number
KR1019950046845A
Other languages
Korean (ko)
Other versions
KR0161864B1 (en
Inventor
오용영
Original Assignee
문정환
Lg 반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체 주식회사 filed Critical 문정환
Priority to KR1019950046845A priority Critical patent/KR0161864B1/en
Publication of KR970053288A publication Critical patent/KR970053288A/en
Application granted granted Critical
Publication of KR0161864B1 publication Critical patent/KR0161864B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

본 발명은 리드프레임 다이(Die) 본딩 및 와이어(Wire) 본딩을 완료한 다음 수지물로 몰딩하여 패키지(Package)하는 반도체 금형에서 리드프레임을 금형내에 로딩시킬 때, 안내하는 위치 결정핀(Location pin)에 관한 것으로써, 좀더 구체적으로는 리드프레임의 위치 결정방식을 달리하여 양산라인에 적용시킬 수 있는 것이다.The present invention relates to a positioning pin for guiding a lead frame when a lead frame is loaded into a mold in a semiconductor mold packaged by molding a resin material after completing lead frame die bonding and wire bonding. ), More specifically, can be applied to the mass production line by varying the lead frame positioning method.

이를 위해, 하부 메인케비티(2)의 상부로 노출되게 라운드 파이롯트핀(6)을 설치하여 로딩되는 리드프레임(15)을 위치 결정하도록 된 것에 있어서, 리드프레임(15)이 위치되는 하부 메인케비티(2)의 양끝 둘레면에 4개의 위치 결정핀(16)을 상부로 노출되게 각각 고정하고 상부 메인캐비티(10)에는 상부로 노출된 위치 결정핀(16)을 수용하기 위한 피난홈(17)을 형성하여 로딩되는 리드프레임(15)이 각 위치 결정핀(16)의 내측면과 접속되어 위치 결정되도록 하여서 된 것이다.To this end, in order to position the lead frame 15 loaded by installing the round pilot pin 6 exposed to the upper part of the lower main cavity 2, the lower main cable on which the lead frame 15 is located Each of the four positioning pins 16 is fixed to each of the peripheral surfaces of the bites 2 so as to be exposed upward, and the upper main cavity 10 has an evacuation groove 17 for receiving the positioning pins 16 exposed upward. The lead frame 15 to be loaded by forming a) is connected to the inner surface of each positioning pin 16 to be positioned.

Description

반도체 몰딩금형의 리드프레임 위치 결정장치Lead frame positioning device of semiconductor molding mold

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제4도는 본 발명이 장착된 금형의 평면도.4 is a plan view of a mold equipped with the present invention.

제5도는 제4도의 종단면도.5 is a longitudinal cross-sectional view of FIG.

제6도는 본 발명의 요부인 위치 결정핀을 나타낸 사시도.6 is a perspective view showing a positioning pin which is a main part of the present invention.

Claims (2)

하부 메이캐비티의 상부로 노출되게 라운드 파이롯트핀을 설치하여 로딩되는 리드프레임을 위치 결정하도록 된 것에 있어서, 리드프레임이 위치되는 하부 메인캐비티의 양끝 둘레면에 4개의 위치 결정핀을 상부로 노출되게 각각 고정하고, 상부 메인 캐비티에는 상부로 노출된 위치결정핀을 수용하기 위한 피난홈을 형성하여 로딩되는 리드프레임이 각 위치 결정핀의 내측면과 접속되도록 함을 특징으로 하는 반도체 몰딩금형의 리드프레임 위치 결정장치.In order to position the lead frame loaded by installing a round pilot pin to be exposed to the upper part of the lower may cavity, each of the four positioning pins to the upper surface of the peripheral end of the lower main cavity in which the lead frame is located The lead frame position of the semiconductor molding mold, which is fixed and forms an evacuation groove for accommodating the positioning pins exposed to the upper main cavity so that the loaded lead frame is connected to the inner surface of each positioning pin. Crystal device. 제1항에 있어서, 위치 결정핑의 상부 내측에 경사면을 형성함을 특징으로 하는 반도체 몰딩금형의 리드프레임 위치 결정장치.2. The lead frame positioning apparatus according to claim 1, wherein an inclined surface is formed inside the upper portion of the positioning pin. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950046845A 1995-12-05 1995-12-05 Lead frame position deciding equipment KR0161864B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950046845A KR0161864B1 (en) 1995-12-05 1995-12-05 Lead frame position deciding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950046845A KR0161864B1 (en) 1995-12-05 1995-12-05 Lead frame position deciding equipment

Publications (2)

Publication Number Publication Date
KR970053288A true KR970053288A (en) 1997-07-31
KR0161864B1 KR0161864B1 (en) 1999-02-01

Family

ID=19437887

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950046845A KR0161864B1 (en) 1995-12-05 1995-12-05 Lead frame position deciding equipment

Country Status (1)

Country Link
KR (1) KR0161864B1 (en)

Also Published As

Publication number Publication date
KR0161864B1 (en) 1999-02-01

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