KR940016716A - Leadframe Structure for Mounting Rectangular Dies - Google Patents
Leadframe Structure for Mounting Rectangular Dies Download PDFInfo
- Publication number
- KR940016716A KR940016716A KR1019920024464A KR920024464A KR940016716A KR 940016716 A KR940016716 A KR 940016716A KR 1019920024464 A KR1019920024464 A KR 1019920024464A KR 920024464 A KR920024464 A KR 920024464A KR 940016716 A KR940016716 A KR 940016716A
- Authority
- KR
- South Korea
- Prior art keywords
- support
- leadframe structure
- die
- leadframe
- pqfp
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 직사각형 모양을 가진 반도체 칩이 다이(Die) 또는 베어 칩(Bare chip)을 탑재하기 위한 PQFP 리드프레임 구조에 관한 것으로 직사각형 다이패들을 지지대로 지지하고, 이 다이패들 상에 놓여지는 반도체 칩의 I/O 단자와 리드를 와이어 본딩하도록 하는 PQFP 리드프레임에 있어서, 상기 지지대가 상기 직사각형 다이패들의 각 변에서의 중앙부분에 접속되고, 이 지지대와 상기 각 변은 서로 수직인 관계에 있는 것이다.The present invention relates to a PQFP leadframe structure in which a semiconductor chip having a rectangular shape for mounting a die or bare chip supports a rectangular die paddle as a support and is placed on the die paddle. In a PQFP leadframe for wire-bonding the chip's I / O terminals and leads, the support is connected to a central portion at each side of the rectangular die paddles, the support and each side being perpendicular to each other. will be.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제 1 도는 일반적인 PQFP(Plastic Quad-flat Packae)의 리드프레임의 구조를 예시한 평면도, 제 2 도는 직사각형 다이를 일반적인 PQFP의 리드프레임 위에 본딩한 상태를 보인 평면도, 제 3 도는 직사각형 다이를 붙이기 위한 종래의 변형된 리드프레임 구조를 예시한 평면도, 제 4 도는 직사각형 다이를 붙이기 위한 종래의 다른 변형된 리드프레임 구조를 예시한 평면도, 제 5 도는 직사각형 다이를 붙이기 위한 본 발명의 리드프레임 구조를 예시한 평면도, 제 6 도는 제 5 도에 도시된 리드프레임 위에 직사각형 다이를 본딩한 상태를 보인 평면도.1 is a plan view illustrating a structure of a lead frame of a general plastic quad-flat packae (PQFP), FIG. 2 is a plan view showing a state of bonding a rectangular die on a lead frame of a general PQFP, and FIG. 3 is a conventional view for attaching a rectangular die. 4 is a plan view illustrating another modified leadframe structure for attaching a rectangular die, and FIG. 5 is a plan view illustrating the leadframe structure of the present invention for attaching a rectangular die. 6 is a plan view showing a state of bonding a rectangular die on the lead frame shown in FIG.
Claims (1)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920024464A KR940016716A (en) | 1992-12-16 | 1992-12-16 | Leadframe Structure for Mounting Rectangular Dies |
| KR2019960002078U KR960004872Y1 (en) | 1992-12-16 | 1996-02-10 | Lead frame structure of plastic quad flat package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920024464A KR940016716A (en) | 1992-12-16 | 1992-12-16 | Leadframe Structure for Mounting Rectangular Dies |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960002078U Division KR960004872Y1 (en) | 1992-12-16 | 1996-02-10 | Lead frame structure of plastic quad flat package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR940016716A true KR940016716A (en) | 1994-07-23 |
Family
ID=67214609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920024464A KR940016716A (en) | 1992-12-16 | 1992-12-16 | Leadframe Structure for Mounting Rectangular Dies |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR940016716A (en) |
-
1992
- 1992-12-16 KR KR1019920024464A patent/KR940016716A/en not_active Application Discontinuation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application | ||
| WICV | Withdrawal of application forming a basis of a converted application |