KR960026686A - How to Strengthen Package Adhesion in IC Lead Frame - Google Patents

How to Strengthen Package Adhesion in IC Lead Frame Download PDF

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Publication number
KR960026686A
KR960026686A KR1019940032499A KR19940032499A KR960026686A KR 960026686 A KR960026686 A KR 960026686A KR 1019940032499 A KR1019940032499 A KR 1019940032499A KR 19940032499 A KR19940032499 A KR 19940032499A KR 960026686 A KR960026686 A KR 960026686A
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KR
South Korea
Prior art keywords
lead frame
chip
attachment region
package adhesion
hole
Prior art date
Application number
KR1019940032499A
Other languages
Korean (ko)
Inventor
김영선
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019940032499A priority Critical patent/KR960026686A/en
Publication of KR960026686A publication Critical patent/KR960026686A/en

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 발명은 IC 반도체의 리이드 프레임에 부착되는 IC 칩이 리이드 프레임으로부터 쉽게 이탈되지 않도록 패키지 부착력 강화방법에 관한 것으로, 상, 하면에 IC 칩이 몰딩 부착되는 SQFP용 리이드 프레임에 있어서, 상기 리이드 프레임에서의 IC 칩 부착영역에 다수의 미세통공이 마련되고, 상, 하 IC 칩 몰딩공정시 액상 몰드 수지가 통공을 통하여 다른 한쪽의 몰드수지와 접합되도록 한 특징이 있다.The present invention relates to a method for enhancing package adhesion so that an IC chip attached to a lead frame of an IC semiconductor is not easily separated from the lead frame. The present invention relates to a lead frame for an SQFP in which an IC chip is molded and attached to upper and lower surfaces thereof. A plurality of micro-pores are provided in the IC chip attachment region of the IC chip, and the liquid mold resin is bonded to the other mold resin through the through-holes during the IC chip molding process.

Description

IC 리이드 프레임에서의 패키지 부착력 강화방법How to Strengthen Package Adhesion in IC Lead Frame

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 일 실시예에 의한 리이드 프레임의 일부 발췌 평면도, 제2도는 제1도의 부분확대도, 제3도는 본 발명에 의한 리이드 프레임의 상, 하면에 IC 칩이 부착된 상태의 확대 단면도.1 is a plan view of a part of a lead frame according to an embodiment of the present invention, FIG. 2 is a partially enlarged view of FIG. 1, and FIG. 3 is an enlargement of a state where IC chips are attached to upper and lower surfaces of the lead frame according to the present invention. Cross-section.

Claims (4)

상, 하면에 IC 칩(4)이 몰딩되는 SQEP용 리이드 프레임(1)에 있어서, 상기 리이드 프레임(1)에서의 IC칩 부착영역(2)에 통공(3)이 마련되고, 상, 하 IC칩 몰딩 공정시 적어도 어느 한쪽의 액상 몰드물이 통공(3)을 통하여 다른 한쪽의 몰드물에 접합되도록 한 IC 리이드 프레임에서의 패키지 부착력 강화방법.In the SQEP lead frame (1) in which the IC chip (4) is molded on the upper and lower surfaces, a through hole (3) is provided in the IC chip attachment region (2) in the lead frame (1), and the upper and lower ICs are provided. A method for enhancing package adhesion in an IC lead frame in which at least one liquid mold is bonded to the other mold through the through hole (3) during the chip molding process. 제1항에 있어서, 상기 리이드 프레임(1)에 형성되어 있는 통공(3)은 다수로 배치하여서 됨을 특징으로 하는 IC 리이드 프레임에서의 패키지 부착력 강화방법.The method according to claim 1, wherein a plurality of through holes (3) formed in the lead frame (1) are arranged. 제1항에 있어서, 상기 리이드 프레임(1)에 형성되어 있는 통공(3)을 IC 칩 부착영역(2)의 전역에 걸쳐 균등한 분포로 배치됨을 특징으로 한 IC 리이드 프레임에서의 패키지 부착력 강화방법.The method according to claim 1, wherein the through holes (3) formed in the lead frame (1) are arranged in an even distribution over the entire area of the IC chip attachment region (2). . 제1항에 있어서, 상기 리이드 프레임(1)에 형성되어 있는 통공(3)은 IC 칩 부착영역(2)의 50% 이상의 통공률을 가진 것을 특징으로 한 IC 리이드 프레임에서의 패키지 부착력 강화방법.The method according to claim 1, wherein the through hole (3) formed in the lead frame (1) has a porosity of 50% or more of the IC chip attachment region (2). ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is to be disclosed based on the initial application.
KR1019940032499A 1994-12-02 1994-12-02 How to Strengthen Package Adhesion in IC Lead Frame KR960026686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940032499A KR960026686A (en) 1994-12-02 1994-12-02 How to Strengthen Package Adhesion in IC Lead Frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940032499A KR960026686A (en) 1994-12-02 1994-12-02 How to Strengthen Package Adhesion in IC Lead Frame

Publications (1)

Publication Number Publication Date
KR960026686A true KR960026686A (en) 1996-07-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940032499A KR960026686A (en) 1994-12-02 1994-12-02 How to Strengthen Package Adhesion in IC Lead Frame

Country Status (1)

Country Link
KR (1) KR960026686A (en)

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