KR960026686A - How to Strengthen Package Adhesion in IC Lead Frame - Google Patents
How to Strengthen Package Adhesion in IC Lead Frame Download PDFInfo
- Publication number
- KR960026686A KR960026686A KR1019940032499A KR19940032499A KR960026686A KR 960026686 A KR960026686 A KR 960026686A KR 1019940032499 A KR1019940032499 A KR 1019940032499A KR 19940032499 A KR19940032499 A KR 19940032499A KR 960026686 A KR960026686 A KR 960026686A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- chip
- attachment region
- package adhesion
- hole
- Prior art date
Links
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 IC 반도체의 리이드 프레임에 부착되는 IC 칩이 리이드 프레임으로부터 쉽게 이탈되지 않도록 패키지 부착력 강화방법에 관한 것으로, 상, 하면에 IC 칩이 몰딩 부착되는 SQFP용 리이드 프레임에 있어서, 상기 리이드 프레임에서의 IC 칩 부착영역에 다수의 미세통공이 마련되고, 상, 하 IC 칩 몰딩공정시 액상 몰드 수지가 통공을 통하여 다른 한쪽의 몰드수지와 접합되도록 한 특징이 있다.The present invention relates to a method for enhancing package adhesion so that an IC chip attached to a lead frame of an IC semiconductor is not easily separated from the lead frame. The present invention relates to a lead frame for an SQFP in which an IC chip is molded and attached to upper and lower surfaces thereof. A plurality of micro-pores are provided in the IC chip attachment region of the IC chip, and the liquid mold resin is bonded to the other mold resin through the through-holes during the IC chip molding process.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명의 일 실시예에 의한 리이드 프레임의 일부 발췌 평면도, 제2도는 제1도의 부분확대도, 제3도는 본 발명에 의한 리이드 프레임의 상, 하면에 IC 칩이 부착된 상태의 확대 단면도.1 is a plan view of a part of a lead frame according to an embodiment of the present invention, FIG. 2 is a partially enlarged view of FIG. 1, and FIG. 3 is an enlargement of a state where IC chips are attached to upper and lower surfaces of the lead frame according to the present invention. Cross-section.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940032499A KR960026686A (en) | 1994-12-02 | 1994-12-02 | How to Strengthen Package Adhesion in IC Lead Frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940032499A KR960026686A (en) | 1994-12-02 | 1994-12-02 | How to Strengthen Package Adhesion in IC Lead Frame |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960026686A true KR960026686A (en) | 1996-07-22 |
Family
ID=66648456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940032499A KR960026686A (en) | 1994-12-02 | 1994-12-02 | How to Strengthen Package Adhesion in IC Lead Frame |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960026686A (en) |
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1994
- 1994-12-02 KR KR1019940032499A patent/KR960026686A/en not_active Application Discontinuation
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Legal Events
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WITN | Withdrawal due to no request for examination |