KR960003119U - 디바이스의 간격 조절장치 - Google Patents

디바이스의 간격 조절장치

Info

Publication number
KR960003119U
KR960003119U KR2019940012881U KR19940012881U KR960003119U KR 960003119 U KR960003119 U KR 960003119U KR 2019940012881 U KR2019940012881 U KR 2019940012881U KR 19940012881 U KR19940012881 U KR 19940012881U KR 960003119 U KR960003119 U KR 960003119U
Authority
KR
South Korea
Prior art keywords
spacing control
device spacing
control
spacing
Prior art date
Application number
KR2019940012881U
Other languages
English (en)
Other versions
KR970007078Y1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR94012881U priority Critical patent/KR970007078Y1/ko
Priority to DE19520053A priority patent/DE19520053B4/de
Priority to US08/455,858 priority patent/US5639203A/en
Priority to JP7160158A priority patent/JP2727309B2/ja
Publication of KR960003119U publication Critical patent/KR960003119U/ko
Application granted granted Critical
Publication of KR970007078Y1 publication Critical patent/KR970007078Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
KR94012881U 1994-06-03 1994-06-03 Devices feeding apparatus KR970007078Y1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR94012881U KR970007078Y1 (en) 1994-06-03 1994-06-03 Devices feeding apparatus
DE19520053A DE19520053B4 (de) 1994-06-03 1995-05-31 Bestückungsvorrichtung für Halbleiterelemente
US08/455,858 US5639203A (en) 1994-06-03 1995-05-31 Semiconductor device transfer apparatus
JP7160158A JP2727309B2 (ja) 1994-06-03 1995-06-05 半導体デバイスの移送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94012881U KR970007078Y1 (en) 1994-06-03 1994-06-03 Devices feeding apparatus

Publications (2)

Publication Number Publication Date
KR960003119U true KR960003119U (ko) 1996-01-22
KR970007078Y1 KR970007078Y1 (en) 1997-07-15

Family

ID=19384904

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94012881U KR970007078Y1 (en) 1994-06-03 1994-06-03 Devices feeding apparatus

Country Status (4)

Country Link
US (1) US5639203A (ko)
JP (1) JP2727309B2 (ko)
KR (1) KR970007078Y1 (ko)
DE (1) DE19520053B4 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200079967A (ko) * 2018-12-26 2020-07-06 김윤정 배치식 태양열 온수기

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6112905A (en) * 1996-07-31 2000-09-05 Aseco Corporation Automatic semiconductor part handler
US5839769A (en) * 1996-10-03 1998-11-24 Kinetrix, Inc. Expanding gripper with elastically variable pitch screw
JP2002506393A (ja) * 1997-06-19 2002-02-26 ベルグ エレクトロニクス マニュファクチャリング ビー ヴィ 次の処理のために部品を所定の位置にあらかじめ配列する装置と方法
JP2000164781A (ja) 1998-12-01 2000-06-16 Towa Corp リードフレームの加工方法及び装置
DE29907459U1 (de) * 1999-04-27 1999-07-29 Norden Pac Development Ab, Kalmar Verpackungsmaschine
JP3996768B2 (ja) 1999-09-27 2007-10-24 松下電器産業株式会社 部品実装方法及び部品実装装置
AT414077B (de) * 2001-08-14 2006-08-15 Datacon Semiconductor Equip Verfahren und einrichtung zur positionsveränderung von elektronischen bauteilen
CA2426057C (en) 2002-04-22 2018-03-06 Milos Misha Subotincic End effector with multiple pick-up members
US20040146383A1 (en) * 2003-01-14 2004-07-29 International Product Technology, Inc. Apparatus having a variable pitch pick-and-place head for packaging electrical parts and methods of operating the same
JP4038679B2 (ja) * 2003-05-13 2008-01-30 住友電気工業株式会社 半導体レーザーバーの固定用治具
NL1028824C2 (nl) * 2005-04-20 2006-10-23 Fico Bv Werkwijze en inrichting voor het verplaatsen van in een rechthoekige structuur gerangschikte elektronische componenten.
DE102005033979B4 (de) * 2005-07-20 2007-08-02 Siemens Ag Bestücksystem und Verfahren zum Bestücken von Substraten mit elektrischen Bauteilen
NL1029576C2 (nl) * 2005-07-21 2007-01-23 Fico Bv Werkwijze en inrichting voor het verplaatsen van een in een matrixstructuur gerangschikte groep componenten.
KR100800312B1 (ko) * 2006-01-25 2008-02-04 (주)테크윙 테스트핸들러 및 테스트핸들러의 로딩방법
US20070236029A1 (en) * 2006-04-07 2007-10-11 Dominick Piccininni Multi pitch slider
US20080000756A1 (en) * 2006-06-30 2008-01-03 Behnke Merlin E High speed linear pick-and-place
KR100861051B1 (ko) * 2006-12-15 2008-09-30 세크론 주식회사 테스트 핸들러용 간격 조절부 및 이를 이용하는 반도체소자 이송 방법
EP2048098B1 (en) * 2007-10-10 2012-03-14 Langen Packaging Inc. Device wiwth multiple engagement members
KR101109092B1 (ko) * 2009-02-24 2012-02-20 서울과학기술대학교 산학협력단 반도체소자이송시스템
SG172499A1 (en) * 2009-12-23 2011-07-28 Rokko Systems Pte Ltd Assembly and method for ic unit engagement
JP2013137284A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
CN104103711B (zh) * 2013-04-10 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 摆片装置及其调整方法
CN104249372B (zh) * 2013-06-26 2016-04-27 鸿富锦精密工业（深圳）有限公司 夹取装置
EP3026994B1 (en) * 2013-07-23 2019-03-20 FUJI Corporation Work machine
ITBO20130643A1 (it) * 2013-11-25 2015-05-26 Gima Spa Stazione di prelievo e consegna di prodotti
CN204802547U (zh) * 2015-05-26 2015-11-25 富泰华工业（深圳）有限公司 翻转装置
US20170194181A1 (en) * 2016-01-04 2017-07-06 Micron Technology, Inc. Overhead traveling vehicle, transportation system with the same, and method of operating the same
EP3734649A1 (en) * 2019-05-03 2020-11-04 Nexperia B.V. Electronic component transfer apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4449885A (en) * 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
JPS6038900A (ja) * 1983-08-12 1985-02-28 株式会社日立製作所 電子部品挿入装置
JPH0736920Y2 (ja) * 1987-06-18 1995-08-23 沖電気工業株式会社 電子部品搬送用の保持間隔調整装置
JPS6448442A (en) * 1987-08-19 1989-02-22 Texas Instruments Japan Shifter for semiconductor wafer
JP2590363B2 (ja) * 1988-04-05 1997-03-12 東京エレクトロン株式会社 ピッチ変換機
KR0129405B1 (ko) * 1988-04-25 1998-04-07 하자마 겐쥬 배열된 판형상체의 상호 피치간격을 변환하는 피치변환장치 및 피치변환방법
JPH0215615A (ja) * 1988-07-01 1990-01-19 Mitsubishi Electric Corp パターン形成方法
JPH0294030U (ko) * 1989-01-13 1990-07-26
US4957406A (en) * 1989-05-08 1990-09-18 Intelmatec Corporation Apparatus for transferring disks from one cassette to another with different pitch
JPH03205214A (ja) * 1989-12-29 1991-09-06 Matsushita Electric Ind Co Ltd 素子の定ピッチ分離装置
JP2796169B2 (ja) * 1990-03-23 1998-09-10 株式会社タカトリハイテック ウエーハの移載装置
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
US5188499A (en) * 1990-12-14 1993-02-23 Mactronix Method and apparatus for varying wafer spacing
JPH0512124U (ja) * 1991-07-26 1993-02-19 日本電気株式会社 ボタン組立装置
US5290134A (en) * 1991-12-03 1994-03-01 Advantest Corporation Pick and place for automatic test handler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200079967A (ko) * 2018-12-26 2020-07-06 김윤정 배치식 태양열 온수기

Also Published As

Publication number Publication date
DE19520053B4 (de) 2006-08-31
KR970007078Y1 (en) 1997-07-15
JPH0864659A (ja) 1996-03-08
JP2727309B2 (ja) 1998-03-11
US5639203A (en) 1997-06-17
DE19520053A1 (de) 1996-01-25

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