KR950034706A - 반도체 장치 및 그 제조 방법 - Google Patents
반도체 장치 및 그 제조 방법 Download PDFInfo
- Publication number
- KR950034706A KR950034706A KR1019950002026A KR19950002026A KR950034706A KR 950034706 A KR950034706 A KR 950034706A KR 1019950002026 A KR1019950002026 A KR 1019950002026A KR 19950002026 A KR19950002026 A KR 19950002026A KR 950034706 A KR950034706 A KR 950034706A
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- KR
- South Korea
- Prior art keywords
- polyimide resin
- lead frame
- semiconductor device
- protective film
- resin layer
- Prior art date
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- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
반도체 펙키지가 반도체 칩 기판에 부착된 제1패시배이션 보호막, 제1보호막에 부착된 제2보호막 및 제2보호막에 부착되고 반도체 칩 안에 형성된 회로에 연결된 리드 프레임을 갖는다. 리드 프레임의 주요 부분은 제2보호막의 열가소성 수지 층을 통하여 제2보호막에 부착된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 LOC 구조를 갖는 IC 팩키지의 단면도, 제2도는 (제4도의 선 Ⅱ-Ⅱ을 따라 절취한) 제1도의 팩키지의 주요 부분의 확대 단면도, 제3도는 (제4도의 선 Ⅲ-Ⅲ을 따라 절취한) 제1도의 팩키지의 주요 부분의 확대 단면도.
Claims (15)
- 반도체 칩 상의 제1보호막, 제1보호막 상에 배치된 제2보호막 및 주요 부분이 적어도 제2보호막의 일부로서 작용되는 열가소성 수지에 의하여 제2보호막에 부착되도록 제2보호막에 부착되고 전기적으로 반도체 칩 내에 형성된 회로에 연결된 리드 프레임을 포함하는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 상기 제2보호막이 그 하단 층이 열경화성 폴리이미드형 수지로 만들어지고 그 상단의 층이 열가소성 폴리이미드형 수지로 만들어지고 그 상단의 층이 열가소성 폴리이미드형 수지로 만들어진 라미네이트인 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 리드 프레임이 접착되는 영역에서는, 열가소성 폴리이드형 수지 층의 두께는 15 내지 35㎛이고 열경화성 폴리이미드형 수지의 두께는 10 내지 30㎛인 상기 열가소성 폴리이드형 수지 층과 상기 열경화성 폴리이미드형 수지 층들이 거의 같은 패턴으로 형성되고, 상기 리드 프레임이 접착되지 않는 영역에서는 열경화성 포리이미드형 수지의 두께가 5 내지 15㎛인 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 열가소성 폴리이미드형 수지 층이 리드 프레임이 접착되지 않은 영역에서는 열경화성 폴리이미드형 수지 층 상에 역시 배치되고, 열가소성 폴리이미드형 수지 층의 두께가 15 내지 35㎛이고, 열경화성 폴리이미드형 수지의 두께는 10 내지 30㎛인 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 상기 라미네이트의 전체 두께가 적어도 리드 프레임의 접착영역내에서 35 내지 65㎛인 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 제2보호막이 단기 열가소성 폴리이미드형 수지인 것을 특징으로 하는 반도체 장치.
- 제6항에 있어서, 열가소성 폴리이미드형 수지 층의 두께가 30 내지 50㎛인 것을 특징으로 하는 반도체 장치.
- 제6항에 있어서, 열가소성 폴리이미드형 수지가 리드 프레임이 접착되지 않은 영역 상에 역시 배치되는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 리드 프레임이 접차고디는 영역 상의 열가소성 폴리이미드형 수지 층의 단부가 상기 리드 프레임의 단부로부터 0.1 내지 0.15㎜만큼 돌출한 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 반도체 칩의 접착 패드의 변(side)상에서, 반도체 칩의 셀부분의 단부와 열가소성 폴리이미드형 수지 층의 단부 사이의 간격이 100 내지 500㎛인 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 접착 영역 내에 열가소성 폴리이미드형 수지 층 및/또는 열경화성 폴리이미드형 수지층이 있는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 접착 패드와 리드 프레임들이 장치의 전채 바디(body)가 수지에 의하여 밀봉된 상태로 와이어-접착되는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 리드 프레임들이 신호 와이어링(wiring)을 위한 제1리드 프레임 부분과 전원 와이어링을 위한 제2리드 프레임을 포함하는 것을 특징으로 하는 반도체 장치.
- 제1항의 반도체 장치를 제조하는 방법으로서, 반도체 칩의 보호막 상에 열가소성 수지 층을 코팅하는 단계와 그 다음으로 코팅된 수지를 패터닝(patterning)하고 경화(curing)하며, 그 다음으로 열가소성 수지 층상에 리드 프레임을 접착시키는 단계들을 포함하는 것을 특징으로 하는 반도체 장치.
- 제14항에 있어서, 리드 프레임을 접착시킨 후, 반도체 칩의 접착 패드를 리드 프레임에 와이어-접착시키는 단계가 수행되는 것을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02736794A JP3388369B2 (ja) | 1994-01-31 | 1994-01-31 | 半導体パッケージ装置 |
JP94-27367 | 1994-01-31 |
Publications (1)
Publication Number | Publication Date |
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KR950034706A true KR950034706A (ko) | 1995-12-28 |
Family
ID=12219082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950002026A KR950034706A (ko) | 1994-01-31 | 1995-02-02 | 반도체 장치 및 그 제조 방법 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0665592A1 (ko) |
JP (1) | JP3388369B2 (ko) |
KR (1) | KR950034706A (ko) |
TW (1) | TW311268B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3427713B2 (ja) * | 1997-01-22 | 2003-07-22 | 株式会社日立製作所 | 樹脂封止型半導体装置およびその製造方法 |
TW378345B (en) | 1997-01-22 | 2000-01-01 | Hitachi Ltd | Resin package type semiconductor device and manufacturing method thereof |
JP3169072B2 (ja) | 1998-05-15 | 2001-05-21 | 日本電気株式会社 | 半導体装置 |
JP4666703B2 (ja) * | 1999-10-12 | 2011-04-06 | 旭化成イーマテリアルズ株式会社 | 半導体装置及びその材料 |
JP4003780B2 (ja) | 2004-09-17 | 2007-11-07 | カシオ計算機株式会社 | 半導体装置及びその製造方法 |
DE102005047856B4 (de) | 2005-10-05 | 2007-09-06 | Infineon Technologies Ag | Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten, Systemträger zur Aufnahme der Halbleiterbauteilkomponenten und Verfahren zur Herstellung des Systemträgers und von Halbleiterbauteilen |
JP2007207873A (ja) * | 2006-01-31 | 2007-08-16 | Aisin Seiki Co Ltd | 電子装置 |
Family Cites Families (3)
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KR100234824B1 (ko) * | 1991-03-20 | 1999-12-15 | 윌리엄 비. 켐플러 | 반도체 장치 |
US5448450A (en) * | 1991-08-15 | 1995-09-05 | Staktek Corporation | Lead-on-chip integrated circuit apparatus |
US5286679A (en) * | 1993-03-18 | 1994-02-15 | Micron Technology, Inc. | Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer |
-
1994
- 1994-01-31 JP JP02736794A patent/JP3388369B2/ja not_active Expired - Fee Related
-
1995
- 1995-01-31 EP EP95300600A patent/EP0665592A1/en not_active Ceased
- 1995-02-02 KR KR1019950002026A patent/KR950034706A/ko not_active Application Discontinuation
- 1995-03-31 TW TW084103098A patent/TW311268B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW311268B (ko) | 1997-07-21 |
JPH07221259A (ja) | 1995-08-18 |
EP0665592A1 (en) | 1995-08-02 |
JP3388369B2 (ja) | 2003-03-17 |
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