KR940005200A - 배선기판상의 배선표면 처리방법 - Google Patents
배선기판상의 배선표면 처리방법 Download PDFInfo
- Publication number
- KR940005200A KR940005200A KR1019930015341A KR930015341A KR940005200A KR 940005200 A KR940005200 A KR 940005200A KR 1019930015341 A KR1019930015341 A KR 1019930015341A KR 930015341 A KR930015341 A KR 930015341A KR 940005200 A KR940005200 A KR 940005200A
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- Prior art keywords
- wiring
- alloy layer
- bonded
- bonding
- semiconductor element
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- 238000000034 method Methods 0.000 title claims abstract description 4
- 238000004381 surface treatment Methods 0.000 title claims description 3
- 229910000679 solder Inorganic materials 0.000 claims abstract 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910000521 B alloy Inorganic materials 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
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Abstract
(목적)Al본딩 와이어와의 접합성이 양호한 것에 덧붙여 용융 연질 땜납 접촉성 및 땜납부착성이 양호하고 상기 땜납 부착성이 히이트사이클의 반복에 의해서도 저하되지 않는 배선기판상의 배션표면 처리 방법을 제공한다.
(구성)세라믹 적층기판(1)상에는 W에 의한 배선층(2)이 형성되어 있다. Ni-B합금층(10)상에는 Ag페이스트나 연질 땜납 등에 의한 납재 또는 에폭시 수지등의 접착제에 의한 접합층(5)을 거쳐서 반도체 소자(베이칩)(6)가 펠렛 본딩되어 있다. 또, Ni-B합금층(10)상에는 연질 땜납(7)에 의해서 칩 부품(8)이 접합되어 있다. 그리고, 칩 부품(8)이 접합되고 있는 Ni-B합금층(10)과 반도체 소자(6)를 Al본딩와이어(9)에 의해서 와이어 본딩하므로서 칩 부품(8)과 반도체 소자(6)를 전기적으로 접속하고 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명을 구체화한 1실시예의 배선 기판상의 배선표면 처리 방법을 모식적으로 도시하는 요부 단면도.
Claims (1)
- 배선기판상에 W 또는 Cu 및 그 합금으로 이루어진 배선을 형성하고 상기 배선의 표면에 B를 함유하는 Ni합금층을 피막으로서 형성하고 상기 Ni합금층에 함유하는 납땜 및 Al본딩 와이어를 와이어 본딩하는 것을 특징으로 하는 배선기판상의 배선표면 처리방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04-221824 | 1992-08-20 | ||
JP4221824A JPH06216184A (ja) | 1992-08-20 | 1992-08-20 | 配線基板上の配線の表面処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940005200A true KR940005200A (ko) | 1994-03-16 |
KR0127277B1 KR0127277B1 (ko) | 1998-04-06 |
Family
ID=16772767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930015341A KR0127277B1 (ko) | 1992-08-20 | 1993-08-17 | 배선기판상의 배선표면 처리방법 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0588093A1 (ko) |
JP (1) | JPH06216184A (ko) |
KR (1) | KR0127277B1 (ko) |
TW (1) | TW239219B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3435484B2 (ja) * | 1995-06-08 | 2003-08-11 | 日本特殊陶業株式会社 | セラミック基板及びその製造方法 |
JPH1050751A (ja) * | 1996-07-30 | 1998-02-20 | Kyocera Corp | ワイヤボンディング細線の接合方法 |
JP2005057132A (ja) * | 2003-08-06 | 2005-03-03 | Fcm Kk | 回路基板およびそれを含むことを特徴とする製品 |
JP4984473B2 (ja) * | 2005-09-30 | 2012-07-25 | 富士電機株式会社 | 電子部品および電子部品の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4077854A (en) * | 1972-10-02 | 1978-03-07 | The Bendix Corporation | Method of manufacture of solderable thin film microcircuit with stabilized resistive films |
EP0092971B1 (en) * | 1982-04-27 | 1989-08-16 | Richardson Chemical Company | Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
JPH0634442B2 (ja) * | 1986-11-25 | 1994-05-02 | 株式会社日立製作所 | ムライト配線基板の製造方法 |
JPH01169996A (ja) * | 1987-12-25 | 1989-07-05 | Hitachi Ltd | 湿式多層セラミック回路板のメタライズ方法 |
-
1992
- 1992-08-20 JP JP4221824A patent/JPH06216184A/ja active Pending
-
1993
- 1993-08-17 KR KR1019930015341A patent/KR0127277B1/ko not_active IP Right Cessation
- 1993-08-19 EP EP93113276A patent/EP0588093A1/en not_active Withdrawn
- 1993-08-20 TW TW082106729A patent/TW239219B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPH06216184A (ja) | 1994-08-05 |
TW239219B (ko) | 1995-01-21 |
KR0127277B1 (ko) | 1998-04-06 |
EP0588093A1 (en) | 1994-03-23 |
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