KR950015679A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR950015679A
KR950015679A KR1019940029323A KR19940029323A KR950015679A KR 950015679 A KR950015679 A KR 950015679A KR 1019940029323 A KR1019940029323 A KR 1019940029323A KR 19940029323 A KR19940029323 A KR 19940029323A KR 950015679 A KR950015679 A KR 950015679A
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KR
South Korea
Prior art keywords
island
semiconductor
pellets
semiconductor device
semiconductor pellets
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KR1019940029323A
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English (en)
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KR0181333B1 (ko
Inventor
유이찌 스가노
Original Assignee
가네꼬 히사시
닛뽕덴끼 가부시끼가이샤
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Publication of KR950015679A publication Critical patent/KR950015679A/ko
Application granted granted Critical
Publication of KR0181333B1 publication Critical patent/KR0181333B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

다수개의 반도체 펠릿이 하나의 아일랜드상에 탑재되고, 다수개의 반도체 펠릿중 인접한 것들 사이의 아일랜드내에 형성된 하나 이상의 노치된 윈도우를 포함하는 봉입형 반도체 장치.

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 제1 실시예에 따른 와이어 본딩후 수지 봉입된 반도체 장치의 평면도.

Claims (4)

  1. 한개의 아일랜드상에 다수개의 반도체 펠릿을 탑재하는 수지 봉입형 반도체 장치에 있어서, 상기 다수개의 인접한 반도체 펠릿간의 아일랜드에 1이상의 노치된 윈도우를 형성하는 것을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 상기 노치된 윈도우는 상기 반도체 펠릿의 크기와 형상에 응하여 가능한 한 크게 형성되는 것을 특징으로 하는 반도체 장치.
  3. 한개의 아일랜드상에 2개의 반도체 펠릿을 탑재하는 수지 봉입형 반도체 장치에 있어서, 상기 2개의 인접한 반도체 펠릿간의 아일랜드에 3개의 노치된 윈도우를 형성하는 것을 특징으로 하는 반도체 장치.
  4. 한개의 아일랜드상에 3개의 반도체 펠릿을 탑재하는 수지 봉입형 반도체 장치에 있어서, 상기 3개의 인접한 반도체 펠릿간의 아일랜드에 1개의 노치된 윈도우를 형성하는 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940029323A 1993-11-11 1994-11-09 반도체 장치 KR0181333B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93-305871 1993-11-11
JP5305871A JP2701712B2 (ja) 1993-11-11 1993-11-11 半導体装置

Publications (2)

Publication Number Publication Date
KR950015679A true KR950015679A (ko) 1995-06-17
KR0181333B1 KR0181333B1 (ko) 1999-04-15

Family

ID=17950354

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940029323A KR0181333B1 (ko) 1993-11-11 1994-11-09 반도체 장치

Country Status (3)

Country Link
US (1) US5598038A (ko)
JP (1) JP2701712B2 (ko)
KR (1) KR0181333B1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3907743B2 (ja) * 1995-05-11 2007-04-18 ローム株式会社 半導体装置
US5998856A (en) * 1996-11-28 1999-12-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
WO1998024122A1 (fr) * 1996-11-28 1998-06-04 Mitsubishi Denki Kabushiki Kaisha Dispositif a semi-conducteur
JP2005516417A (ja) * 2002-01-31 2005-06-02 ミクロナス ゲーエムベーハー プログラム可能な電子処理装置用のマウント
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device
JP4534613B2 (ja) * 2004-06-09 2010-09-01 株式会社デンソー 電子装置
DE102005038755B4 (de) * 2005-08-17 2016-03-10 Robert Bosch Gmbh Mikromechanisches Bauelement
US7683480B2 (en) * 2006-03-29 2010-03-23 Freescale Semiconductor, Inc. Methods and apparatus for a reduced inductance wirebond array
JP5876299B2 (ja) * 2012-01-18 2016-03-02 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
JPS5954252A (ja) * 1982-09-21 1984-03-29 Nec Corp フイルムキヤリアテ−プ
JPS6356950A (ja) * 1986-08-28 1988-03-11 Fuji Electric Co Ltd 複合化集積回路装置
JPH0275655A (ja) * 1988-09-12 1990-03-15 Mitsubishi Gas Chem Co Inc 樹脂組成物
US5084753A (en) * 1989-01-23 1992-01-28 Analog Devices, Inc. Packaging for multiple chips on a single leadframe
JPH02207561A (ja) * 1989-02-07 1990-08-17 Sharp Corp リードフレーム
JPH02275655A (ja) * 1989-04-17 1990-11-09 Nec Corp 混成集積回路
US5291060A (en) * 1989-10-16 1994-03-01 Shinko Electric Industries Co., Ltd. Lead frame and semiconductor device using same
JPH03218059A (ja) * 1990-01-23 1991-09-25 Matsushita Electron Corp 半導体装置
US5245216A (en) * 1990-09-11 1993-09-14 Kabushiki Kaisha Toshiba Plastic-molded type semiconductor device
JPH04144142A (ja) * 1990-10-04 1992-05-18 Toshiba Corp 半導体装置
JP3104748U (ja) * 2004-04-09 2004-10-14 陽一郎 宮井 回転扉の内部回転扉の外側部分が折れ曲がることにより外枠との間で挟まれる危険を軽減させた回転扉。

Also Published As

Publication number Publication date
JP2701712B2 (ja) 1998-01-21
KR0181333B1 (ko) 1999-04-15
JPH07135277A (ja) 1995-05-23
US5598038A (en) 1997-01-28

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