KR930003988A - 다이(die)의 제조방법 및 이 제조방법에 의하여 얻어진 다이 - Google Patents

다이(die)의 제조방법 및 이 제조방법에 의하여 얻어진 다이 Download PDF

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Publication number
KR930003988A
KR930003988A KR1019920014045A KR920014045A KR930003988A KR 930003988 A KR930003988 A KR 930003988A KR 1019920014045 A KR1019920014045 A KR 1019920014045A KR 920014045 A KR920014045 A KR 920014045A KR 930003988 A KR930003988 A KR 930003988A
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KR
South Korea
Prior art keywords
resist film
corrosion
die
convex part
manufacturing
Prior art date
Application number
KR1019920014045A
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English (en)
Other versions
KR950012423B1 (ko
Inventor
요자부로 하나다
Original Assignee
쇼오지 고오메이
린데꾸 가부시끼가이샤
다까노 유우지
가부시끼가이샤 다까노 기까이 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼오지 고오메이, 린데꾸 가부시끼가이샤, 다까노 유우지, 가부시끼가이샤 다까노 기까이 세이사꾸쇼 filed Critical 쇼오지 고오메이
Publication of KR930003988A publication Critical patent/KR930003988A/ko
Application granted granted Critical
Publication of KR950012423B1 publication Critical patent/KR950012423B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
    • B23P15/40—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools
    • B23P15/406—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools rotary or plane die cutters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C23F1/04—Chemical milling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

내용 없음.

Description

다이(die)의 제조방법 및 이 제조방법에 의하여 얻어진 다이
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 부터 제5도는 본 발명의 다이를 제조하는 공정의 개략적인 흐름을 나타내는 도면이다.

Claims (3)

  1. 강판상에 형성되는 칼날부의 형상에 대응하여 레지스트막을 제막하는 공정, 이 레지스트막이 제막된 강판에 부식처리를 실시하여, 레지스트막이 제막된 개소에 소정의 높이의 볼록(凸)부를 형성하는 제1부식공정, 볼록부의 정부 양단의 레지스트막을 제거 처리하고, 이어서 볼록부의 정부의 양단의 레지스트막이 제거된 철판에 부식을 실시하는 처리로 이루어진 제2부식공정, 및 볼록부 정점에 잔류된 레지스트막을 제거하는 레지스트막 제거공정으로 이루어지고, 상기 제2 부식 공정을 적어도 1회 이상 실시하는 것을 특징으로 하는 다이의 제조방법.
  2. 강판상에 형성되는 칼날부의 형상에 대응하여 레지스트막을 제막하는 공정, 이 레지스트막이 제막된 강판에 부식 처리를 실시하여 레지스트막이 제막된 개소에 소정의 높이의 블록부를 형성하는 제1부식 공정, 볼록부의 정부 양단의 레지스트막을 제거 처리하고 이어서, 볼록부의 정부양단의 레지스트막이 제거된 강판에 부식을 실시하는 처리로 이루어진 제2 부식 공정, 볼록부 정점에 잔류된 레지스트막을 제거하는 레지스트막 제거공정, 및 모든 레지스트막이 제거된 강판에 부식처리를 실시하는 제3 부식 공정으로 이루어지고, 상기 제2 부식 공정을 적어도 1회 이상 실시하는 것을 특징으로 하는 제조방법.
  3. 제1항 또는 2항에 기재된 제조방법으로 얻어지는 것을 특징으로 하는 다이.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920014045A 1991-08-09 1992-08-05 다이(die)의 제조방법 KR950012423B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3200914A JP2677466B2 (ja) 1991-08-09 1991-08-09 抜き型の製造方法および抜き型
JP91-200914 1991-08-09
JP3-200914 1991-08-09

Publications (2)

Publication Number Publication Date
KR930003988A true KR930003988A (ko) 1993-03-22
KR950012423B1 KR950012423B1 (ko) 1995-10-17

Family

ID=16432377

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920014045A KR950012423B1 (ko) 1991-08-09 1992-08-05 다이(die)의 제조방법

Country Status (6)

Country Link
US (1) US5248383A (ko)
EP (1) EP0527616B1 (ko)
JP (1) JP2677466B2 (ko)
KR (1) KR950012423B1 (ko)
DE (1) DE69200653T2 (ko)
DK (1) DK0527616T3 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9303985D0 (en) * 1993-02-26 1993-04-14 Bartholomew Richard S Surgical cutting tool
JP3477254B2 (ja) * 1994-09-19 2003-12-10 株式会社タカノ機械製作所 抜き型の製造方法および抜き型
NL1021274C2 (nl) * 2002-08-14 2004-02-17 Cemtex B V Werkwijze voor het vervaardigen van een roteerbaar gereedschap voor het snijden of bedrukken van papier, karton en dergelijke.
MXPA06000587A (es) * 2003-07-17 2006-07-10 Ellison Educational Equip Inc Troquel delgado para utilizarlo en una prensa.
US20100140212A1 (en) * 2008-12-10 2010-06-10 King-Yeung Li Process for preparing grating tools
CN102517583A (zh) * 2012-01-17 2012-06-27 毕广杰 一种快速切割图案的刀模的制作方法
US9150998B2 (en) * 2013-08-29 2015-10-06 J. Michael Dywan Method and apparatus for producing detailed fabric applique
CN107379116B (zh) * 2017-08-30 2019-04-02 郑州华美彩印纸品有限公司 一种模切刀版的制作工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3045321A (en) * 1955-04-15 1962-07-24 Buckbee Mears Co Abrading devices and method of making them
US3758350A (en) * 1971-05-21 1973-09-11 Jerobee Ind Inc Method of making a die for stamping out circuit boards
US4053348A (en) * 1976-06-16 1977-10-11 Jerobee Industries, Inc. Die and method of making the same
US4264410A (en) * 1978-08-16 1981-04-28 Minnesota Micro Metal, Inc. Method of making an abrading material
JPS5690977A (en) * 1979-12-20 1981-07-23 Fujikura Ltd Manufacture of blanking die for pattern
DE3047886A1 (de) * 1979-12-20 1981-10-29 The Fujikura Cable Works, Ltd., Tokyo Verfahren zur herstellung eines stanzwerkzeugs und nach diesem verfahren hergestelltes stanzwerkzeug
US4437924A (en) * 1982-04-19 1984-03-20 Jerobee Industries, Inc. Method of making fine-line die
EP0476664B1 (en) * 1990-09-20 1995-07-05 Dainippon Screen Mfg. Co., Ltd. Method of forming small through-holes in thin metal plate

Also Published As

Publication number Publication date
JP2677466B2 (ja) 1997-11-17
EP0527616B1 (en) 1994-11-09
DK0527616T3 (da) 1994-12-05
DE69200653T2 (de) 1995-05-04
DE69200653D1 (de) 1994-12-15
US5248383A (en) 1993-09-28
JPH0544061A (ja) 1993-02-23
EP0527616A1 (en) 1993-02-17
KR950012423B1 (ko) 1995-10-17

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