Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
  • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
  • B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
  • B23P15/40—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools
  • B23P15/406—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools rotary or plane die cutters
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
  • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
  • B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/02—Local etching
  • C23F1/04—Chemical milling
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
  • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
• ing And Chemical Polishing (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=16432377

Family Applications (1)

Country Status (6)

Families Citing this family (8)

Family Cites Families (8)

• 1991
  • 1991-08-09 JP JP3200914A patent/JP2677466B2/ja not_active Expired - Fee Related
• 1992
  • 1992-08-05 KR KR1019920014045A patent/KR950012423B1/ko not_active IP Right Cessation
  • 1992-08-07 DE DE69200653T patent/DE69200653T2/de not_active Expired - Lifetime
  • 1992-08-07 US US07/927,076 patent/US5248383A/en not_active Expired - Fee Related
  • 1992-08-07 EP EP92307257A patent/EP0527616B1/en not_active Expired - Lifetime
  • 1992-08-07 DK DK92307257.3T patent/DK0527616T3/da active

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