KR920020690A - Semiconductor lead frame - Google Patents
Semiconductor lead frame Download PDFInfo
- Publication number
- KR920020690A KR920020690A KR1019910006291A KR910006291A KR920020690A KR 920020690 A KR920020690 A KR 920020690A KR 1019910006291 A KR1019910006291 A KR 1019910006291A KR 910006291 A KR910006291 A KR 910006291A KR 920020690 A KR920020690 A KR 920020690A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- lead
- chip
- adhesive tape
- semiconductor lead
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제4도는 이 발명에 따른 반도체 리이드 프레임 구조도.4 is a structure diagram of a semiconductor lead frame according to the present invention.
제5도는 제4도의 A부 상세도.5 is a detailed view of portion A of FIG.
제6도는 이 발명의 와이어 본딩 공정의 클램핑 상태도.6 is a clamping state diagram of the wire bonding process of the present invention.
제7도는 이 발명의 봉지수지 주입 공정 상태도이다.7 is a state diagram of the encapsulating resin injection process of the present invention.
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910006291A KR940002389B1 (en) | 1991-04-19 | 1991-04-19 | Semiconductor leadframe |
JP4060294A JPH05102388A (en) | 1991-04-19 | 1992-03-17 | Semiconductor lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910006291A KR940002389B1 (en) | 1991-04-19 | 1991-04-19 | Semiconductor leadframe |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920020690A true KR920020690A (en) | 1992-11-21 |
KR940002389B1 KR940002389B1 (en) | 1994-03-24 |
Family
ID=19313461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910006291A KR940002389B1 (en) | 1991-04-19 | 1991-04-19 | Semiconductor leadframe |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH05102388A (en) |
KR (1) | KR940002389B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998043288A1 (en) * | 1997-03-24 | 1998-10-01 | Seiko Epson Corporation | Semiconductor device and method for manufacturing the same |
-
1991
- 1991-04-19 KR KR1019910006291A patent/KR940002389B1/en not_active IP Right Cessation
-
1992
- 1992-03-17 JP JP4060294A patent/JPH05102388A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR940002389B1 (en) | 1994-03-24 |
JPH05102388A (en) | 1993-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20080303 Year of fee payment: 15 |
|
LAPS | Lapse due to unpaid annual fee |