KR920010800A - PPGA Package Wire Bonding Method - Google Patents

PPGA Package Wire Bonding Method Download PDF

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Publication number
KR920010800A
KR920010800A KR1019900019650A KR900019650A KR920010800A KR 920010800 A KR920010800 A KR 920010800A KR 1019900019650 A KR1019900019650 A KR 1019900019650A KR 900019650 A KR900019650 A KR 900019650A KR 920010800 A KR920010800 A KR 920010800A
Authority
KR
South Korea
Prior art keywords
bonding
bonding method
wire bonding
package wire
ppga package
Prior art date
Application number
KR1019900019650A
Other languages
Korean (ko)
Inventor
정관호
Original Assignee
정몽헌
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정몽헌, 현대전자산업 주식회사 filed Critical 정몽헌
Priority to KR1019900019650A priority Critical patent/KR920010800A/en
Publication of KR920010800A publication Critical patent/KR920010800A/en

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Abstract

내용 없음No content

Description

PPGA패캐이지 와이어 본딩방법PPGA Package Wire Bonding Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 따라 와이어 본딩을 실시한 후 칩표면과 리드표면을 부분적으로 도시한 상세측면도.2 is a detailed side view partially showing a chip surface and a lead surface after wire bonding according to the present invention.

Claims (1)

PCB재질의 베이스(14)상에 안착된 침과 다수의 리드를 캐필러리를 이용하여 와이어 본딩하는 PPGA패캐이지 와이어 본딩 방법에 있어서, 칩(1)의 일정표면에 볼본딩(3A)을 실시한 후 대응하는 리드(2) 표면에 1차 스티치본딩(3B)을 실시하는 단계와, 상기 리드(2) 표면에 본딩 완료된 1차 스티치 본딩부(3B)상에 2차 볼본딩(13A)및2차 스티치본딩(13B)하는 단계와, 상기 칩(1)의 또다른 볼본딩하는 단계를 순차적으로 반복하는 것을 특징으로 하는 PPGA 패캐이지 와이어 본딩방법.In the PPGA package wire bonding method of wire-bonding a needle and a plurality of leads deposited on a base 14 of a PCB material using a capillary, ball bonding 3A is applied to a predetermined surface of the chip 1. And then performing a first stitch bonding 3B on the surface of the corresponding lead 2, a second ball bonding 13A on the first stitch bonding portion 3B bonded to the surface of the lead 2, and 2 PPGA package wire bonding method, characterized in that the step of the first stitch bonding (13B) and the step of another ball bonding of the chip (1) in sequence. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900019650A 1990-11-30 1990-11-30 PPGA Package Wire Bonding Method KR920010800A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900019650A KR920010800A (en) 1990-11-30 1990-11-30 PPGA Package Wire Bonding Method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900019650A KR920010800A (en) 1990-11-30 1990-11-30 PPGA Package Wire Bonding Method

Publications (1)

Publication Number Publication Date
KR920010800A true KR920010800A (en) 1992-06-27

Family

ID=67537644

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900019650A KR920010800A (en) 1990-11-30 1990-11-30 PPGA Package Wire Bonding Method

Country Status (1)

Country Link
KR (1) KR920010800A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100388295B1 (en) * 2000-10-26 2003-06-19 앰코 테크놀로지 코리아 주식회사 Wire bonding structure and its method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100388295B1 (en) * 2000-10-26 2003-06-19 앰코 테크놀로지 코리아 주식회사 Wire bonding structure and its method

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