KR920010800A - PPGA Package Wire Bonding Method - Google Patents
PPGA Package Wire Bonding Method Download PDFInfo
- Publication number
- KR920010800A KR920010800A KR1019900019650A KR900019650A KR920010800A KR 920010800 A KR920010800 A KR 920010800A KR 1019900019650 A KR1019900019650 A KR 1019900019650A KR 900019650 A KR900019650 A KR 900019650A KR 920010800 A KR920010800 A KR 920010800A
- Authority
- KR
- South Korea
- Prior art keywords
- bonding
- bonding method
- wire bonding
- package wire
- ppga package
- Prior art date
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- Wire Bonding (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 본 발명에 따라 와이어 본딩을 실시한 후 칩표면과 리드표면을 부분적으로 도시한 상세측면도.2 is a detailed side view partially showing a chip surface and a lead surface after wire bonding according to the present invention.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900019650A KR920010800A (en) | 1990-11-30 | 1990-11-30 | PPGA Package Wire Bonding Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900019650A KR920010800A (en) | 1990-11-30 | 1990-11-30 | PPGA Package Wire Bonding Method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR920010800A true KR920010800A (en) | 1992-06-27 |
Family
ID=67537644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900019650A KR920010800A (en) | 1990-11-30 | 1990-11-30 | PPGA Package Wire Bonding Method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR920010800A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100388295B1 (en) * | 2000-10-26 | 2003-06-19 | 앰코 테크놀로지 코리아 주식회사 | Wire bonding structure and its method |
-
1990
- 1990-11-30 KR KR1019900019650A patent/KR920010800A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100388295B1 (en) * | 2000-10-26 | 2003-06-19 | 앰코 테크놀로지 코리아 주식회사 | Wire bonding structure and its method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application | ||
J2X1 | Appeal (before the patent court) |
Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL |