KR920010862A - 반도체 장치 및 이것에 사용되는 리드프레임 - Google Patents
반도체 장치 및 이것에 사용되는 리드프레임 Download PDFInfo
- Publication number
- KR920010862A KR920010862A KR1019910018795A KR910018795A KR920010862A KR 920010862 A KR920010862 A KR 920010862A KR 1019910018795 A KR1019910018795 A KR 1019910018795A KR 910018795 A KR910018795 A KR 910018795A KR 920010862 A KR920010862 A KR 920010862A
- Authority
- KR
- South Korea
- Prior art keywords
- inner lead
- heat sink
- semiconductor chip
- lead
- semiconductor devices
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 리드프레임의 일예를 나타낸 평면도, 제2도는 그 단면도, 제3도는 반도체 장치의 일예를 나타낸 단면도.
Claims (2)
- 히트싱크가 주연부위에 인너리드에 겹쳐져 인너리드에 전기적으로 절연되어 접합되는 동시에 히트싱크의 인너리드에 둘러싸이는 부위에 돌출부가 형성된 리드프레임의 상기 돌출부위에 반도체 칩이 그 정크숀패턴이 존재하는 칩면을 돌출부를 향하여 절연성 접착제에 의해서 접합되고 반도체 칩과 인너리드가 TAB리드에 의해서 전기적으로 접속되고 반도체 칩이 봉지수지중에 봉지되어 있는 것을 특징으로 하는 반도체 장치.
- 히트싱크가 주연부위에서 인너리드에 겹쳐져 인너리드에 전기적으로 절연되어 접합되는 동시에 히트싱크의 인너리드에 둘러싸이는 부위에 반도체 칩 접합용 돌출부가 형성되어 있는 것을 특징으로 하는 리드프레임.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950026696U KR960000942Y1 (ko) | 1990-11-30 | 1995-09-28 | 반도체장치의 리드프레임 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP90-340501 | 1990-11-30 | ||
| JP2340501A JP2962575B2 (ja) | 1990-11-30 | 1990-11-30 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950026696U Division KR960000942Y1 (ko) | 1990-11-30 | 1995-09-28 | 반도체장치의 리드프레임 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR920010862A true KR920010862A (ko) | 1992-06-27 |
Family
ID=18337573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910018795A KR920010862A (ko) | 1990-11-30 | 1991-10-25 | 반도체 장치 및 이것에 사용되는 리드프레임 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2962575B2 (ko) |
| KR (1) | KR920010862A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100743335B1 (ko) * | 1999-06-30 | 2007-07-26 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 장치 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5402778B2 (ja) * | 2010-03-30 | 2014-01-29 | 株式会社デンソー | 半導体モジュールを備えた半導体装置 |
-
1990
- 1990-11-30 JP JP2340501A patent/JP2962575B2/ja not_active Expired - Lifetime
-
1991
- 1991-10-25 KR KR1019910018795A patent/KR920010862A/ko not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100743335B1 (ko) * | 1999-06-30 | 2007-07-26 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 장치 |
| KR100864781B1 (ko) * | 1999-06-30 | 2008-10-22 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 장치 |
| KR100878939B1 (ko) * | 1999-06-30 | 2009-01-19 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 장치 |
| KR100885606B1 (ko) * | 1999-06-30 | 2009-02-24 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2962575B2 (ja) | 1999-10-12 |
| JPH04207062A (ja) | 1992-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application | ||
| WICV | Withdrawal of application forming a basis of a converted application |