KR920008465A - 와이어 본딩 외관 검사 장치 - Google Patents
와이어 본딩 외관 검사 장치 Download PDFInfo
- Publication number
- KR920008465A KR920008465A KR1019910017588A KR910017588A KR920008465A KR 920008465 A KR920008465 A KR 920008465A KR 1019910017588 A KR1019910017588 A KR 1019910017588A KR 910017588 A KR910017588 A KR 910017588A KR 920008465 A KR920008465 A KR 920008465A
- Authority
- KR
- South Korea
- Prior art keywords
- wire bonding
- semiconductor chip
- appearance inspection
- lighting means
- inspection device
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 따른 와이어 본딩 외관 검사 장치의 구성을 도시한 블럭도.
제2도는 제1도의 장치에 있어서 조명 수단의 배치를 도시한 사시도.
제3도는 제1도의 장치에 있어서 링 조명 수단의 배치를 도시한 종 단면도.
Claims (2)
- 반도체 칩(11)과 리드(14)와의 사이에 와이어 본딩이 행해진 후에, 상기 반도체 칩 및 그 주변의 외관을 검사하는 와이어 본딩 외관 검사 장치에 있어서, 상기 반도체 칩 및 그 주변을 조명하고 각각 빛을 조사하는 방향이 상이한 복수의 조명수단(2, 3 및 4) 및 상기 복수의 조명 수단의 동작을 제어하는 제어수단(1)을 포함하고, 상기 제어수단이 검사 개소에 따라 상기 복수의 조명 수단을 선택해서 그 동작을 제어하는 것을 특징으로 하는 와이어 본딩 외관 검사 장치.
- 제1항에 있어서, 상기 복수의 조명 수단이 상기 반도체 칩을 상부 방향에서 조명하는 수단(2), 상기 반도체 칩을 하부 방향에서 조명하는 수단(3) 및 상기 반도체 칩을 횡방향에서조명하는 수단(4)를 포함하는 것을 특징으로 하는 와이어 본딩 외관 검사 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP90-271387 | 1990-10-09 | ||
JP2271387A JP2845601B2 (ja) | 1990-10-09 | 1990-10-09 | ワイヤボンディング外観検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920008465A true KR920008465A (ko) | 1992-05-28 |
KR950013781B1 KR950013781B1 (ko) | 1995-11-16 |
Family
ID=17499364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910017588A KR950013781B1 (ko) | 1990-10-09 | 1991-10-08 | 와이어 본딩 외관 검사 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5225891A (ko) |
JP (1) | JP2845601B2 (ko) |
KR (1) | KR950013781B1 (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2795044B2 (ja) * | 1992-03-26 | 1998-09-10 | 住友電装株式会社 | 圧着端子画像処理検査における照明方法及び画像処理方法 |
JP3105098B2 (ja) * | 1992-12-28 | 2000-10-30 | 株式会社東芝 | ボンディングワイヤのボンディング位置の検査装置 |
US5640199A (en) * | 1993-10-06 | 1997-06-17 | Cognex Corporation | Automated optical inspection apparatus |
US5532739A (en) * | 1993-10-06 | 1996-07-02 | Cognex Corporation | Automated optical inspection apparatus |
US5548326A (en) * | 1993-10-06 | 1996-08-20 | Cognex Corporation | Efficient image registration |
US5550763A (en) * | 1994-05-02 | 1996-08-27 | Michael; David J. | Using cone shaped search models to locate ball bonds on wire bonded devices |
US5581632A (en) * | 1994-05-02 | 1996-12-03 | Cognex Corporation | Method and apparatus for ball bond inspection system |
US5642158A (en) * | 1994-05-02 | 1997-06-24 | Cognex Corporation | Method and apparatus to detect capillary indentations |
US6061467A (en) * | 1994-05-02 | 2000-05-09 | Cognex Corporation | Automated optical inspection apparatus using nearest neighbor interpolation |
US6035066A (en) * | 1995-06-02 | 2000-03-07 | Cognex Corporation | Boundary tracking method and apparatus to find leads |
US5883663A (en) * | 1996-12-02 | 1999-03-16 | Siwko; Robert P. | Multiple image camera for measuring the alignment of objects in different planes |
US7071433B2 (en) * | 2003-11-14 | 2006-07-04 | Ark-Les Corporation | Illuminated membrane switch |
SG2013084975A (en) * | 2013-11-11 | 2015-06-29 | Saedge Vision Solutions Pte Ltd | An apparatus and method for inspecting asemiconductor package |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56155802A (en) * | 1980-05-06 | 1981-12-02 | Fujitsu Ltd | Recognition device |
JPS608705A (ja) * | 1983-06-29 | 1985-01-17 | Hitachi Ltd | パタ−ン検出装置 |
JPS63307309A (ja) * | 1987-06-09 | 1988-12-15 | Fujitsu Ltd | 線状物体検査装置 |
JPS6440606A (en) * | 1987-08-07 | 1989-02-10 | Art Neichiyaa Kansai Kk | Wig |
JPH0276004A (ja) * | 1988-09-13 | 1990-03-15 | Fanuc Ltd | 荒加工用ncデータ作成方法 |
US5030008A (en) * | 1988-10-11 | 1991-07-09 | Kla Instruments, Corporation | Method and apparatus for the automated analysis of three-dimensional objects |
DE4003983C1 (en) * | 1990-02-09 | 1991-08-29 | Abos Automation, Bildverarbeitung, Optische Systeme Gmbh, 8057 Eching, De | Automated monitoring of space=shape data for mfg. semiconductors - compares image signals for defined illumination angle range with master signals, to determine defects |
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1990
- 1990-10-09 JP JP2271387A patent/JP2845601B2/ja not_active Expired - Fee Related
-
1991
- 1991-10-08 KR KR1019910017588A patent/KR950013781B1/ko not_active IP Right Cessation
- 1991-10-09 US US07/771,970 patent/US5225891A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR950013781B1 (ko) | 1995-11-16 |
JP2845601B2 (ja) | 1999-01-13 |
JPH04146643A (ja) | 1992-05-20 |
US5225891A (en) | 1993-07-06 |
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