KR910005466A - 전극 단자 상호 접속방법 - Google Patents
전극 단자 상호 접속방법 Download PDFInfo
- Publication number
- KR910005466A KR910005466A KR1019900012676A KR900012676A KR910005466A KR 910005466 A KR910005466 A KR 910005466A KR 1019900012676 A KR1019900012676 A KR 1019900012676A KR 900012676 A KR900012676 A KR 900012676A KR 910005466 A KR910005466 A KR 910005466A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- electrode
- electrode terminal
- semiconductor device
- conductive particles
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 29
- 239000002245 particle Substances 0.000 claims abstract description 29
- 239000000853 adhesive Substances 0.000 claims abstract 9
- 230000001070 adhesive effect Effects 0.000 claims abstract 9
- 239000011347 resin Substances 0.000 claims abstract 7
- 229920005989 resin Polymers 0.000 claims abstract 7
- 239000000758 substrate Substances 0.000 claims abstract 6
- 239000004065 semiconductor Substances 0.000 claims 18
- 230000005686 electrostatic field Effects 0.000 claims 2
- 239000006185 dispersion Substances 0.000 claims 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
- Liquid Crystal (AREA)
- Photovoltaic Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 전도성입자를 분산하는 방법을 설명하는 개략도.
Claims (23)
- 접속될 한쌍의 회로기판에 형성된 전극단자를 상호 접속하는 방법에 있어서;기판의 전극단자에 전도성 입자를 선택적으로 부착시키기 위해 회로기판중 최소한 1개에 대전된 전도성 입자를 분산시키고, 전기적으로 전극단자를 상호 접속하기 위해 회로기판쌍의 전극단자간에 전도성 입자를 삽입하는 것을 특징으로 하는 전극단자 상호 접속방법.
- 제1항에 있어서, 분산전에 전도성 입자를 부착하는데 불필요한 한쌍의 회로 기판을 절연마스크로 덮는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제2항에 있어서, 절연 마스크가 접착제에 의해 회로기판에 이용되는 것을 특징으로 하는 전극단자 상호 접속 방법.
- 제1항에 있어서, 전극단자의 접속부와 다른 전극 단자의 일부가 절연막으로 코팅되는 것을 특징으로 하는 전극 단자 접속방법.
- 제1항에 있어서, 상기 전도성 입자가 전도성 판을 수지입자를 구비하는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제1항에 있어서, 회로기판중 최소한 1개가 반도체 장치를 구비하는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제6항 있어서, 반도체장치의 다이에지(die egde)와 대면하는 반도체장치와 접속되는 회로기판의 일부를 절연막으로 덮는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제6항에 있어서, 반도체장치의 전극단자가 접속을 위치적으로 일렬로 배열되고, 반도체 장치의 일부가 제1접착제로 다른 회로 기판에 접착되며, 다른 회로 기판과 반도체 장치의 비접착부가 고정을 위해 제2접착제로 접착되는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제1전기 회로기판에 형성된 전극과 제2전기 회로기판에 형성된 전극을 전기적으로 접속시켜서 상호 고정시킨 전극 단자 상호 접속방법에 있어서, 그곳에 형성된 전극 단자에 전도성 입자를 선택적으로 부착시키기 위해 제1 및 제2회로 기판중 최소한 1개에 전도성 입자를 분산시켜서, 제1회로 기판에 형성된 전극단자와 제2회로기판에 형성된 전극단자와 접착시키는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제9항에 있어서, 전도성 입자가 대전되어서 전극단자에 전도성 입자를 선택적으로 부착시키기 위해 전극단자에 집중되는 정전계로 분산되는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제9항에 있어서, 전도성 입자가 분산되는 제1 및 제2회로 기판중 최소한 1개가 접속되는 전극 단자와 다른 전극 단자의 일부르 덮는 절연 필름을 구비하는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 9항에 있어서, 상기 전도성 입자가 전도성 판을 덮은 수지 입자를 구비하는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제9항에 있어서, 반도체 장치를 구비하는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제11항에 있어서, 반도체 장치의 다이에지와 대면하는 반도체 장치와 접속되는 회로기판의 일부를 절연막으로 덮는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제13항에 있어서, 반도체 장치의 전극단자가 접속을 위해 위치적으로 일렬로 배열되고, 반도체 장치의 일부가 제1접착제로 다른 회로기판에 접착되며, 다른 회로기판과 반도체 장치의 비 접착부가 고정을 위해 제2접착제로 접착되는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제1전기 회로기판에 형성된 전극과 제2전기 회로기판에 형성된 전극을 전기적으로 접속시켜서 상호 고정시키는 전극 단자 상호 접속 방법에 있어서, 대전계가 형성되는 대전영역을 지나서 전도성 입자가 흐르므로 전도성 입자를 대전시키고, 그곳에 형성된 전극 단자에 전도성 입자를 선택적으로 부착시키기 위해 제1 및 제2회로기판 최소한 한개에 전도성 입자를 분산시킴으로서 제1회로기판에 형성된 전극단자와 제2회로기판에 형성된 전극 단자를 접촉시키는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제16항에 있어서, 상기 대전 영역이 박서 대전기(boxer chager)로 형성되는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제16항에 있어서, 대전된 전도성 입자와 전극 단자에 전도성 입자를 선택적으로 부착시키기 위해 전극 단자에 집중되는 정전계에서 분산되는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제16항에 있어서, 회로기판상의 전극 단자의 접속부와 다른 일부를 절연부재로 덮으므로서, 대전된 전도성 입자가 분산되어 회로기판상의 전극단자에 부착되는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제16항에 있어서, 상기 전도성 입자가 전도성 판을 덮은 수지 입자를 구비하는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 제16항에 있어서, 제1회로기판에 형성된 전극 단자와 제1회로기판에 형성된 전극 단자가 절연 접착제로 서로 고착되는 것을 특징으로 하는 전극 단자 상호 접속방법.
- 반도체 장치의 전극패드와 회로기판의 전극 단자사이에 위치적으로 일렬로 배열한 후 회로기판에 반도체 장치를 접속하는 방법에 있어서, 회로기판의 전극 단자와 반도체 장치의 전극패드 중 최소한 한개에 전도성 수지 및 전도성 입자를 혼합한 페이스트(paste)를 이용하여, 전도성 수지를 경화시키는 반면에 회로기판의 전극 단자에 대하여 반도체 장치의 전극 패드를 누르는 것을 특징으로 하는 반도체 장치 접속방법.
- 제22항에 있어서, 상기 전도성 입자가 전도성 판을 덮은 수지 입자를 구비하는 것을 특징으로 하는 전극 단자 상호 접속방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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JP1210584A JPH06103702B2 (ja) | 1989-08-17 | 1989-08-17 | 電極端子の相互接続方法及び電気接続構造体の製造方法 |
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JP1216140A JPH0382048A (ja) | 1989-08-24 | 1989-08-24 | 半導体素子の接続方法 |
JP1-324983 | 1989-12-15 | ||
JP1324983A JPH03185894A (ja) | 1989-12-15 | 1989-12-15 | 電極端子の相互接続方法 |
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JP2-195332 | 1990-07-23 |
Publications (2)
Publication Number | Publication Date |
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KR910005466A true KR910005466A (ko) | 1991-03-30 |
KR940008554B1 KR940008554B1 (ko) | 1994-09-24 |
Family
ID=27475753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900012676A KR940008554B1 (ko) | 1989-08-17 | 1990-08-17 | 전극단자 상호 접속방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5352318A (ko) |
EP (1) | EP0413335B1 (ko) |
KR (1) | KR940008554B1 (ko) |
AT (1) | ATE138225T1 (ko) |
DE (1) | DE69026992T2 (ko) |
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JPH1084014A (ja) * | 1996-07-19 | 1998-03-31 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
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-
1990
- 1990-08-16 AT AT90115707T patent/ATE138225T1/de not_active IP Right Cessation
- 1990-08-16 EP EP19900115707 patent/EP0413335B1/en not_active Expired - Lifetime
- 1990-08-16 DE DE69026992T patent/DE69026992T2/de not_active Expired - Fee Related
- 1990-08-17 KR KR1019900012676A patent/KR940008554B1/ko not_active IP Right Cessation
-
1993
- 1993-02-02 US US08/012,805 patent/US5352318A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0413335A3 (en) | 1991-10-30 |
ATE138225T1 (de) | 1996-06-15 |
DE69026992D1 (de) | 1996-06-20 |
EP0413335B1 (en) | 1996-05-15 |
KR940008554B1 (ko) | 1994-09-24 |
DE69026992T2 (de) | 1996-10-24 |
US5352318A (en) | 1994-10-04 |
EP0413335A2 (en) | 1991-02-20 |
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