DK231287D0 - System til aftagelig montering af halvledere paa ledersubstrater - Google Patents

System til aftagelig montering af halvledere paa ledersubstrater

Info

Publication number
DK231287D0
DK231287D0 DK231287A DK231287A DK231287D0 DK 231287 D0 DK231287 D0 DK 231287D0 DK 231287 A DK231287 A DK 231287A DK 231287 A DK231287 A DK 231287A DK 231287 D0 DK231287 D0 DK 231287D0
Authority
DK
Denmark
Prior art keywords
conductor
substrate
semiconductor
resilient
semiconductor die
Prior art date
Application number
DK231287A
Other languages
English (en)
Other versions
DK231287A (da
Inventor
James C K Lee
Gene M Amdahl
Richard Beck
Chune Lee
Edward Hu
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Publication of DK231287D0 publication Critical patent/DK231287D0/da
Publication of DK231287A publication Critical patent/DK231287A/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Projection-Type Copiers In General (AREA)
  • Vehicle Step Arrangements And Article Storage (AREA)
  • Electroluminescent Light Sources (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Prostheses (AREA)
  • Wire Bonding (AREA)
  • Drying Of Semiconductors (AREA)
DK231287A 1986-05-07 1987-05-06 System til aftagelig montering af halvledere paa ledersubstrater DK231287A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86072586A 1986-05-07 1986-05-07

Publications (2)

Publication Number Publication Date
DK231287D0 true DK231287D0 (da) 1987-05-06
DK231287A DK231287A (da) 1987-11-08

Family

ID=25333883

Family Applications (1)

Application Number Title Priority Date Filing Date
DK231287A DK231287A (da) 1986-05-07 1987-05-06 System til aftagelig montering af halvledere paa ledersubstrater

Country Status (7)

Country Link
EP (1) EP0245179B1 (da)
JP (1) JPS6332958A (da)
AT (1) ATE84168T1 (da)
AU (1) AU598253B2 (da)
DE (1) DE3783266T2 (da)
DK (1) DK231287A (da)
FI (1) FI872004A (da)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854506A3 (en) * 1987-03-04 1999-03-31 Canon Kabushiki Kaisha Electrically connecting member and electric circuit member
US4899208A (en) * 1987-12-17 1990-02-06 International Business Machines Corporation Power distribution for full wafer package
ATE137064T1 (de) * 1988-02-05 1996-05-15 Raychem Ltd Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels
JP2758053B2 (ja) * 1988-02-05 1998-05-25 レイケム・リミテッド 単一軸状電気伝導部品の使用
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
EP0344702B1 (en) * 1988-05-30 1996-03-13 Canon Kabushiki Kaisha Electric circuit apparatus
US5283468A (en) * 1988-05-30 1994-02-01 Canon Kabushiki Kaisha Electric circuit apparatus
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US4954878A (en) * 1989-06-29 1990-09-04 Digital Equipment Corp. Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
US5140405A (en) * 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
JP2747113B2 (ja) * 1990-11-28 1998-05-06 北川工業株式会社 導電線内蔵筐体
DE29620595U1 (de) * 1996-11-26 1998-01-02 Siemens AG, 80333 München Sockel für eine integrierte Schaltung
DE19832970A1 (de) * 1998-07-22 1999-11-04 Siemens Ag Integrierte elektronische Schaltung und Verfahren zum Versehen einer integrierten elektronischen Schaltung mit Anschlüssen
DE10147054A1 (de) * 2001-09-25 2003-04-24 Siemens Ag Mehrebenenleiterplatte mit erhöhter freier Verdrahtungsfläche
DE10355921B4 (de) * 2003-11-29 2005-12-22 Festo Ag & Co. Elektrische Schaltungsanordnung mit einem elektronischen Chip in einer Aufnahmevorrichtung des Schaltungsträgers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1183280A (en) * 1981-02-09 1985-02-26 Francis N. Sinnadurai Integrated circuit chip carrier
JPS57166051A (en) * 1981-04-06 1982-10-13 Mitsubishi Electric Corp Semiconductor device
DE3378241D1 (en) * 1983-07-11 1988-11-17 Silicon Connection Inc Electronic circuit chip connection assembly and method
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
JPS60263447A (ja) * 1984-06-11 1985-12-26 Nec Corp 電子回路パツケ−ジ

Also Published As

Publication number Publication date
AU7216587A (en) 1987-11-19
FI872004A (fi) 1987-11-08
AU598253B2 (en) 1990-06-21
DE3783266D1 (de) 1993-02-11
JPS6332958A (ja) 1988-02-12
ATE84168T1 (de) 1993-01-15
DK231287A (da) 1987-11-08
EP0245179A3 (en) 1988-10-05
EP0245179B1 (en) 1992-12-30
DE3783266T2 (de) 1993-07-22
EP0245179A2 (en) 1987-11-11
FI872004A0 (fi) 1987-05-06

Similar Documents

Publication Publication Date Title
DK231287A (da) System til aftagelig montering af halvledere paa ledersubstrater
CA1115820A (en) Electrical connector for use in mounting an electronic device on a substrate
EP0711107B1 (en) Control circuit arrangement
US4339628A (en) RF Shielding support for stacked electrical circuit boards
MY113889A (en) Dual substrate package assembly for being electrically coupled to a conducting member
TW353220B (en) Silicon nitride circuit board and semiconductor module
US4167031A (en) Heat dissipating assembly for semiconductor devices
EP0214719A3 (en) Mounting an integrated circuit chip to an etched circuit board
US5576934A (en) Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board
TW200509420A (en) Heatsinking electronic devices
EP0218438A3 (en) Apparatus for mounting a semiconductor chip and making electrical connections thereto
JPH06310632A (ja) 電子半導体素子の組立体
WO1987005183A1 (en) Mounting arrangement for solid state devices
KR970067799A (ko) 반도체장치
GB2137807B (en) A semiconductor component and method of manufacture
ATE230554T1 (de) Elektrisches bauteil und elektrischer schaltungsmodul mit verbundenen erdungsflächen
US4573103A (en) Cooling device for electronic components connected to a printed circuit board by a holder
JPS6261338A (ja) 集積回路取付装置
ATE363820T1 (de) Elektrischer leiter mit als flanschen und geätzte rillen geformter oberflächenstruktur
GB2021878A (en) Electrical connectors
JP2504486B2 (ja) 混成集積回路構造
IT8520503A0 (it) Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale.
JPH0650397U (ja) 電気部品実装装置
KR910005443A (ko) 직접 장착 반도체 팩케이지
HUP9701377A2 (hu) Tok, továbbá eljárás integrált áramköri lapka áramköri lapra vagy hasonlóra szerelésére

Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment