DK231287D0 - System til aftagelig montering af halvledere paa ledersubstrater - Google Patents
System til aftagelig montering af halvledere paa ledersubstraterInfo
- Publication number
- DK231287D0 DK231287D0 DK231287A DK231287A DK231287D0 DK 231287 D0 DK231287 D0 DK 231287D0 DK 231287 A DK231287 A DK 231287A DK 231287 A DK231287 A DK 231287A DK 231287 D0 DK231287 D0 DK 231287D0
- Authority
- DK
- Denmark
- Prior art keywords
- conductor
- substrate
- semiconductor
- resilient
- semiconductor die
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Projection-Type Copiers In General (AREA)
- Vehicle Step Arrangements And Article Storage (AREA)
- Electroluminescent Light Sources (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Prostheses (AREA)
- Wire Bonding (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86072586A | 1986-05-07 | 1986-05-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DK231287D0 true DK231287D0 (da) | 1987-05-06 |
DK231287A DK231287A (da) | 1987-11-08 |
Family
ID=25333883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK231287A DK231287A (da) | 1986-05-07 | 1987-05-06 | System til aftagelig montering af halvledere paa ledersubstrater |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0245179B1 (da) |
JP (1) | JPS6332958A (da) |
AT (1) | ATE84168T1 (da) |
AU (1) | AU598253B2 (da) |
DE (1) | DE3783266T2 (da) |
DK (1) | DK231287A (da) |
FI (1) | FI872004A (da) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0854506A3 (en) * | 1987-03-04 | 1999-03-31 | Canon Kabushiki Kaisha | Electrically connecting member and electric circuit member |
US4899208A (en) * | 1987-12-17 | 1990-02-06 | International Business Machines Corporation | Power distribution for full wafer package |
ATE137064T1 (de) * | 1988-02-05 | 1996-05-15 | Raychem Ltd | Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels |
JP2758053B2 (ja) * | 1988-02-05 | 1998-05-25 | レイケム・リミテッド | 単一軸状電気伝導部品の使用 |
US5631447A (en) * | 1988-02-05 | 1997-05-20 | Raychem Limited | Uses of uniaxially electrically conductive articles |
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
EP0344702B1 (en) * | 1988-05-30 | 1996-03-13 | Canon Kabushiki Kaisha | Electric circuit apparatus |
US5283468A (en) * | 1988-05-30 | 1994-02-01 | Canon Kabushiki Kaisha | Electric circuit apparatus |
US4933808A (en) * | 1989-05-11 | 1990-06-12 | Westinghouse Electric Corp. | Solderless printed wiring board module and multi-module assembly |
US4954878A (en) * | 1989-06-29 | 1990-09-04 | Digital Equipment Corp. | Method of packaging and powering integrated circuit chips and the chip assembly formed thereby |
US5047830A (en) * | 1990-05-22 | 1991-09-10 | Amp Incorporated | Field emitter array integrated circuit chip interconnection |
US5140405A (en) * | 1990-08-30 | 1992-08-18 | Micron Technology, Inc. | Semiconductor assembly utilizing elastomeric single axis conductive interconnect |
US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
JP2747113B2 (ja) * | 1990-11-28 | 1998-05-06 | 北川工業株式会社 | 導電線内蔵筐体 |
DE29620595U1 (de) * | 1996-11-26 | 1998-01-02 | Siemens AG, 80333 München | Sockel für eine integrierte Schaltung |
DE19832970A1 (de) * | 1998-07-22 | 1999-11-04 | Siemens Ag | Integrierte elektronische Schaltung und Verfahren zum Versehen einer integrierten elektronischen Schaltung mit Anschlüssen |
DE10147054A1 (de) * | 2001-09-25 | 2003-04-24 | Siemens Ag | Mehrebenenleiterplatte mit erhöhter freier Verdrahtungsfläche |
DE10355921B4 (de) * | 2003-11-29 | 2005-12-22 | Festo Ag & Co. | Elektrische Schaltungsanordnung mit einem elektronischen Chip in einer Aufnahmevorrichtung des Schaltungsträgers |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1183280A (en) * | 1981-02-09 | 1985-02-26 | Francis N. Sinnadurai | Integrated circuit chip carrier |
JPS57166051A (en) * | 1981-04-06 | 1982-10-13 | Mitsubishi Electric Corp | Semiconductor device |
DE3378241D1 (en) * | 1983-07-11 | 1988-11-17 | Silicon Connection Inc | Electronic circuit chip connection assembly and method |
US4597617A (en) * | 1984-03-19 | 1986-07-01 | Tektronix, Inc. | Pressure interconnect package for integrated circuits |
US4667219A (en) * | 1984-04-27 | 1987-05-19 | Trilogy Computer Development Partners, Ltd. | Semiconductor chip interface |
GB8412674D0 (en) * | 1984-05-18 | 1984-06-27 | British Telecomm | Integrated circuit chip carrier |
JPS60263447A (ja) * | 1984-06-11 | 1985-12-26 | Nec Corp | 電子回路パツケ−ジ |
-
1987
- 1987-04-28 AU AU72165/87A patent/AU598253B2/en not_active Ceased
- 1987-05-06 DK DK231287A patent/DK231287A/da not_active Application Discontinuation
- 1987-05-06 AT AT87401034T patent/ATE84168T1/de not_active IP Right Cessation
- 1987-05-06 FI FI872004A patent/FI872004A/fi not_active IP Right Cessation
- 1987-05-06 EP EP87401034A patent/EP0245179B1/en not_active Expired - Lifetime
- 1987-05-06 DE DE8787401034T patent/DE3783266T2/de not_active Expired - Fee Related
- 1987-05-07 JP JP62111639A patent/JPS6332958A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
AU7216587A (en) | 1987-11-19 |
FI872004A (fi) | 1987-11-08 |
AU598253B2 (en) | 1990-06-21 |
DE3783266D1 (de) | 1993-02-11 |
JPS6332958A (ja) | 1988-02-12 |
ATE84168T1 (de) | 1993-01-15 |
DK231287A (da) | 1987-11-08 |
EP0245179A3 (en) | 1988-10-05 |
EP0245179B1 (en) | 1992-12-30 |
DE3783266T2 (de) | 1993-07-22 |
EP0245179A2 (en) | 1987-11-11 |
FI872004A0 (fi) | 1987-05-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHS | Application shelved for other reasons than non-payment |