KR900013006A - 반도체 봉지용 에폭시 수지 조성물 및 그 경화물 - Google Patents
반도체 봉지용 에폭시 수지 조성물 및 그 경화물 Download PDFInfo
- Publication number
- KR900013006A KR900013006A KR1019900001507A KR900001507A KR900013006A KR 900013006 A KR900013006 A KR 900013006A KR 1019900001507 A KR1019900001507 A KR 1019900001507A KR 900001507 A KR900001507 A KR 900001507A KR 900013006 A KR900013006 A KR 900013006A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- semiconductor encapsulation
- cured product
- average particle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (3)
- 에폭시 수지 경화제 및 무기질 충전제를 함유해서되는 에폭시 수지 조성물에 있어서, 무기질 충전제로서 평균 입경이 5-35㎛인 구상 실리카, 평균 입경이 0.1-2㎛인 구상 실리카 및 평균입경이 2-15㎛인 파쇄 실리카를 무기질 충전제의 전체 배합량에 대해 각각 20-80중량% 1-20중량% 및 20-80중량%의 양으로 병용하는 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
- 제1항에 있어서, 파쇄 실리카가 구상 실리카를 분쇄함으로써 얻어지는 것인 반도체 봉지용 에폭시 수지 조성물.
- 제1항 또는 제2항 기재의 에폭시 수지 조성물을 경화시킴으로써 얻어지는 경화물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-30813 | 1989-02-09 | ||
JP1030813A JPH02209949A (ja) | 1989-02-09 | 1989-02-09 | 半導体封止用エポキシ樹脂組成物及び硬化物 |
JP30813 | 1989-02-09 | ||
JP1050695A JPH0645740B2 (ja) | 1989-03-01 | 1989-03-01 | 半導体封止用エポキシ樹脂組成物 |
JP50695 | 1989-03-01 | ||
JP1-50695 | 1989-03-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900013006A true KR900013006A (ko) | 1990-09-03 |
KR950005309B1 KR950005309B1 (ko) | 1995-05-23 |
Family
ID=26369222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900001507A KR950005309B1 (ko) | 1989-02-09 | 1990-02-08 | 반도체 봉지용 에폭시 수지 조성물 및 그 경화물 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5137940A (ko) |
KR (1) | KR950005309B1 (ko) |
DE (1) | DE4003842C2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100679490B1 (ko) * | 2000-12-29 | 2007-02-07 | 주식회사 케이씨씨 | 반도체 패키징용 에폭시 수지 조성물 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950011902B1 (ko) * | 1990-04-04 | 1995-10-12 | 도오레 가부시끼가이샤 | 반도체 장치 캡슐 봉입 에폭시 수지 조성물 |
DE9013615U1 (de) * | 1990-09-28 | 1990-12-06 | AEG Niederspannungstechnik GmbH & Co KG, 24534 Neumünster | Elektrolumineszenz- oder Laserdiode |
JP2668289B2 (ja) * | 1991-01-25 | 1997-10-27 | ソマール 株式会社 | 粉体塗料用エポキシ樹脂組成物 |
US5362775A (en) * | 1991-03-27 | 1994-11-08 | Nippondenso Co., Ltd. | Epoxy resin composition and cured product thereof |
JP2816774B2 (ja) * | 1991-03-29 | 1998-10-27 | 日本石油株式会社 | フェノール樹脂、その樹脂の製造法および封止材用エポキシ樹脂組成物 |
DE4244961C2 (de) * | 1991-05-23 | 2001-09-06 | Hitachi Ltd | Wärmeaushärtende Harzzusammensetzung zum Gießen einer Hochspannungsspule |
JP2524011B2 (ja) * | 1991-05-23 | 1996-08-14 | 株式会社日立製作所 | 高圧コイル注型用熱硬化性樹脂組成物、該組成物で注型、硬化してなるモ―ルドコイル、パネル |
JP3359410B2 (ja) * | 1994-03-04 | 2002-12-24 | 三菱電機株式会社 | 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法 |
US5719225A (en) * | 1994-06-13 | 1998-02-17 | Sumitomo Chemical Company, Ltd. | Filler-containing resin composition suitable for injection molding and transfer molding |
US5708056A (en) * | 1995-12-04 | 1998-01-13 | Delco Electronics Corporation | Hot melt epoxy encapsulation material |
AU707263B2 (en) * | 1996-03-22 | 1999-07-08 | Vantico Ag | One-component epoxy resin tooling material |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
KR100643442B1 (ko) * | 1996-06-26 | 2006-11-10 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
JP3611066B2 (ja) * | 1996-08-29 | 2005-01-19 | 株式会社ルネサステクノロジ | 無機質充填剤及びエポキシ樹脂組成物の製造方法 |
JP3445707B2 (ja) * | 1996-09-18 | 2003-09-08 | 電気化学工業株式会社 | シリカ質フィラー及びその製法 |
US6214905B1 (en) | 1997-12-23 | 2001-04-10 | Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. | Epoxy mold compound and method |
DE19841204A1 (de) | 1998-09-09 | 2000-03-23 | Siemens Ag | Anordnung mit lichtemittierendem Leistungshalbleiterbauelement sowie Verfahren zur Herstellung derselben |
MY126953A (en) * | 1999-10-06 | 2006-11-30 | Nitto Denko Corp | Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same |
DE19964252A1 (de) | 1999-12-30 | 2002-06-06 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares Bauelement für eine LED-Weißlichtquelle |
US6770965B2 (en) * | 2000-12-28 | 2004-08-03 | Ngk Spark Plug Co., Ltd. | Wiring substrate using embedding resin |
US7814641B2 (en) | 2001-01-09 | 2010-10-19 | Black & Decker Inc. | Method of forming a power tool |
US7096566B2 (en) | 2001-01-09 | 2006-08-29 | Black & Decker Inc. | Method for making an encapsulated coil structure |
DE10131698A1 (de) * | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
CN1249118C (zh) * | 2001-09-28 | 2006-04-05 | 新日本石油化学株式会社 | 酚树脂、环氧树脂、其生产方法和环氧树脂组合物 |
TWI281924B (en) * | 2003-04-07 | 2007-06-01 | Hitachi Chemical Co Ltd | Epoxy resin molding material for sealing use and semiconductor device |
DE602005026215D1 (de) * | 2004-07-13 | 2011-03-17 | Areva T & D Sas | Verfahren zur herstellung eines isolators für hochspannungsanwendungen |
TWI366421B (en) * | 2008-08-22 | 2012-06-11 | Nanya Plastics Corp | High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards |
KR20100028384A (ko) * | 2008-09-04 | 2010-03-12 | 삼성전기주식회사 | 복합체 및 그의 제조방법 |
US8580879B2 (en) | 2009-01-06 | 2013-11-12 | Nan Ya Plastics Corporation | Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof |
WO2011095208A1 (en) * | 2010-02-03 | 2011-08-11 | Abb Research Ltd | Electrical insulation system |
KR101092015B1 (ko) * | 2011-05-03 | 2011-12-08 | 주식회사 네패스신소재 | 열경화형 광반사용 수지 조성물, 이의 제조 방법, 이로부터 제조된 광반도체 소자 탑재용 반사판, 및 이를 포함하는 광반도체 장치 |
JP6571585B2 (ja) * | 2015-06-08 | 2019-09-04 | 信越化学工業株式会社 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4617330A (en) * | 1984-03-30 | 1986-10-14 | Kabushiki Kaisha Toshiba | Epoxy resin composition for cast molding |
JPS6134052A (ja) * | 1984-07-25 | 1986-02-18 | Matsushita Electric Works Ltd | 封止用一液性エポキシ樹脂組成物 |
JPS61143466A (ja) * | 1984-12-18 | 1986-07-01 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPS61268750A (ja) * | 1985-05-22 | 1986-11-28 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JP2938080B2 (ja) * | 1988-07-22 | 1999-08-23 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物 |
-
1990
- 1990-02-08 DE DE4003842A patent/DE4003842C2/de not_active Expired - Fee Related
- 1990-02-08 KR KR1019900001507A patent/KR950005309B1/ko not_active IP Right Cessation
- 1990-02-08 US US07/476,700 patent/US5137940A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100679490B1 (ko) * | 2000-12-29 | 2007-02-07 | 주식회사 케이씨씨 | 반도체 패키징용 에폭시 수지 조성물 |
Also Published As
Publication number | Publication date |
---|---|
DE4003842A1 (de) | 1990-08-16 |
KR950005309B1 (ko) | 1995-05-23 |
US5137940A (en) | 1992-08-11 |
DE4003842C2 (de) | 1997-06-05 |
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A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20080508 Year of fee payment: 14 |
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