JPS55118952A - Epoxy resin composition for sealing semiconductor - Google Patents

Epoxy resin composition for sealing semiconductor

Info

Publication number
JPS55118952A
JPS55118952A JP2653079A JP2653079A JPS55118952A JP S55118952 A JPS55118952 A JP S55118952A JP 2653079 A JP2653079 A JP 2653079A JP 2653079 A JP2653079 A JP 2653079A JP S55118952 A JPS55118952 A JP S55118952A
Authority
JP
Japan
Prior art keywords
composition
epoxy resin
inorganic filler
resin composition
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2653079A
Other languages
Japanese (ja)
Other versions
JPS5819136B2 (en
Inventor
Hideto Suzuki
Shunichi Hayashi
Takahiro Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP54026530A priority Critical patent/JPS5819136B2/en
Priority to US06/127,719 priority patent/US4271061A/en
Publication of JPS55118952A publication Critical patent/JPS55118952A/en
Publication of JPS5819136B2 publication Critical patent/JPS5819136B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: The title movel composition having improved moldability and compatibility with semiconductor elements, capable of lowering strain under stress, comprising a specific amount of silica and calcium silicate powders as an inorganic filler.
CONSTITUTION: (A) An epoxy resin composition, e.g. cresol novolak epoxy resin, is incorporated with (B) a curing agent, e.g. for phenol novolak, and (C) an inorganic filler consisting of (a) silica powder having an average particle diameter of preferably 5W10μ, and a maximum one of 100μ, in the amorphous form, and (b) calcium silicate powder, e.g. wollastonite, needle-like crystals having a particle size of 1μW2mm, in an amount of 20W75wt% based on the total weight of (a) and (b) to give the objective composition. Carbon black may be further added as an inorganic filler. The total amount of the filler is 50W85wt% based on the composition. An internal release agent or curing accelerator can be added.
COPYRIGHT: (C)1980,JPO&Japio
JP54026530A 1979-03-06 1979-03-06 Epoxy resin composition for semiconductor encapsulation Expired JPS5819136B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP54026530A JPS5819136B2 (en) 1979-03-06 1979-03-06 Epoxy resin composition for semiconductor encapsulation
US06/127,719 US4271061A (en) 1979-03-06 1980-03-06 Epoxy resin compositions for sealing semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54026530A JPS5819136B2 (en) 1979-03-06 1979-03-06 Epoxy resin composition for semiconductor encapsulation

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP57129495A Division JPS5837939A (en) 1982-07-24 1982-07-24 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55118952A true JPS55118952A (en) 1980-09-12
JPS5819136B2 JPS5819136B2 (en) 1983-04-16

Family

ID=12196029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54026530A Expired JPS5819136B2 (en) 1979-03-06 1979-03-06 Epoxy resin composition for semiconductor encapsulation

Country Status (1)

Country Link
JP (1) JPS5819136B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS58138740A (en) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk Resin composition
JPS58123996U (en) * 1982-02-17 1983-08-23 旭化成株式会社 Heat insulation board for curved surface attachment
JPS60112816A (en) * 1983-11-24 1985-06-19 Toshiba Chem Corp Resin composition for sealing
JPS60112852A (en) * 1983-11-24 1985-06-19 Toshiba Chem Corp Sealing resin composition
JPS60112851A (en) * 1983-11-24 1985-06-19 Toshiba Chem Corp Sealing resin composition
JPS60155224A (en) * 1984-01-24 1985-08-15 Toshiba Chem Corp Sealing resin composition
JPS60161423A (en) * 1984-02-01 1985-08-23 Toshiba Chem Corp Resin composition for sealing
JPH01278522A (en) * 1988-04-28 1989-11-08 Somar Corp Epoxy resin composition suitable for impregnation
US6001902A (en) * 1996-03-27 1999-12-14 Ciba Specialty Chemicals Corp. Wollastonite-containing curable epoxy resin mixture
JP2002539307A (en) * 1999-03-17 2002-11-19 バンティコ アクチエンゲゼルシャフト Epoxy resin composition having high storage stability
WO2010112272A1 (en) * 2009-04-02 2010-10-07 Huntsman Advanced Materials (Switzerland) Gmbh Direct overmolding

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928645A (en) * 1972-07-14 1974-03-14
JPS5133566A (en) * 1974-09-17 1976-03-22 Hitachi Ltd JUSHIFUSHIGATAHANDOTAISOCHI
JPS5431500A (en) * 1977-08-13 1979-03-08 Allied Chem Packing composition based on anhydride curable epoxy resin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928645A (en) * 1972-07-14 1974-03-14
JPS5133566A (en) * 1974-09-17 1976-03-22 Hitachi Ltd JUSHIFUSHIGATAHANDOTAISOCHI
JPS5431500A (en) * 1977-08-13 1979-03-08 Allied Chem Packing composition based on anhydride curable epoxy resin

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS58138740A (en) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk Resin composition
JPS6157347B2 (en) * 1982-02-15 1986-12-06 Denki Kagaku Kogyo Kk
JPS58123996U (en) * 1982-02-17 1983-08-23 旭化成株式会社 Heat insulation board for curved surface attachment
JPS60112852A (en) * 1983-11-24 1985-06-19 Toshiba Chem Corp Sealing resin composition
JPS60112851A (en) * 1983-11-24 1985-06-19 Toshiba Chem Corp Sealing resin composition
JPS60112816A (en) * 1983-11-24 1985-06-19 Toshiba Chem Corp Resin composition for sealing
JPS60155224A (en) * 1984-01-24 1985-08-15 Toshiba Chem Corp Sealing resin composition
JPS60161423A (en) * 1984-02-01 1985-08-23 Toshiba Chem Corp Resin composition for sealing
JPH01278522A (en) * 1988-04-28 1989-11-08 Somar Corp Epoxy resin composition suitable for impregnation
US6001902A (en) * 1996-03-27 1999-12-14 Ciba Specialty Chemicals Corp. Wollastonite-containing curable epoxy resin mixture
JP2002539307A (en) * 1999-03-17 2002-11-19 バンティコ アクチエンゲゼルシャフト Epoxy resin composition having high storage stability
JP4651198B2 (en) * 1999-03-17 2011-03-16 デュレスコ ゲーエムベーハー Epoxy resin composition having high storage stability
WO2010112272A1 (en) * 2009-04-02 2010-10-07 Huntsman Advanced Materials (Switzerland) Gmbh Direct overmolding
US20120022184A1 (en) * 2009-04-02 2012-01-26 Huntsman International Llc Direct Overmolding
JP2012522854A (en) * 2009-04-02 2012-09-27 ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー Direct overmolding
US8999433B2 (en) * 2009-04-02 2015-04-07 Huntsman International Llc Direct overmolding
AU2010230455B2 (en) * 2009-04-02 2015-05-07 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Direct overmolding

Also Published As

Publication number Publication date
JPS5819136B2 (en) 1983-04-16

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