KR890013760A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR890013760A KR890013760A KR1019890002269A KR890002269A KR890013760A KR 890013760 A KR890013760 A KR 890013760A KR 1019890002269 A KR1019890002269 A KR 1019890002269A KR 890002269 A KR890002269 A KR 890002269A KR 890013760 A KR890013760 A KR 890013760A
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- circuit board
- printed circuit
- lead pins
- semiconductor device
- substrate
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명 의 제 1 실시예에 따른 반도체 장치를 도시한 요부 단면도.
제2도는 본 발명의 제 2 실시예에 따른 반도체 장치를 도시 한 요부 단면도.
제 3 도는 본 발명의 제3실시예에 따른 반도체 장치를 도시한 요부 단면도.
제4도는 본 발명의 제4실시예에 따른 반도체 장치를 도시한 요부 단면도.
Claims (14)
- 기판이, 기판상에 장착된 반도체 펠릿, 및 기판으로부터 최소한 인쇄회로 기판의 상부 표면까지 수직으로 연장되는 다수의 리드핀을 포함하는, 구멍 부분울 포함하는 인쇄 회로 기판상에 땜납으로 표면-장착하기에 적합한 반도체 장치에 있어서, 구멍내로 삽입되기 위해 몇개의 리드핀이 나머지 리드핀보다 긴 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 각각의 구멍이 인쇄 회로 기판의 상부 표면으로부터 인쇄회로 기판의 배면까지 통과하는 관통 구멍인 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 더 긴 리드핀이 구멍내로 연장되고, 더 긴 리드핀의 단부가 인쇄 회로 기판의 배면으로부터 약간 돌출하는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 각각의 더 긴 리드핀이 기판내에 삽입되어 고정될 굵은 부분 및 구멍내에 삽입되어 고정될 가는 부분을 갖고 있는 것을 특징으로 하는 반도체 장치.
- 제4항에 있어서, 더 긴 리드핀의 굵은 부분의 직경이 나머지 리드핀보다 큰 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 더 긴 리드핀들이 나머지 핀들과 상이한 물질로 제조되는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 더 긴 리드핀들이 나머지 리드핀들 보다 굵은 것을 특징으로 하는 반도체 장치.
- 제1항 내지 제 7항중 어느 한 항에 있어서, 4모서리에 4개의 더 긴 리드핀이 있는 것을 특징으로 하는 반도체 장치.
- 제1항 내지 제 7 항중 어느 한 항에 있어서, 기판의 대각선상에 2개의 더 긴 리드핀이 있는 것을 특징으로 하는 반도체 장치 .
- 인쇄 회로기판 ; 및 이 인쇄 회로 기판상에 땜 납으로 표면 장착되고, 이 기판상에 장착된 반도체 펠릿. 및 기판으로부터 인쇄회로 기판의 상부 표면까지 연장되는 다수의 리드핀을 각각 갖고 있는 1개 이상의 핀-그리드 어레이를 포함하는 반도체장치에 있어서, 다수의 안내 부재들이 대응리드핀을 수용하기 위해 인쇄 회로기판의 상부상의 랜드에 제공되어 접착되는 것을 특징으로 하는 반도체 장치 .
- 제10항에 있어서, 인쇄 회로 기판의 4모서리에 4개의 안내 부재가 있는 것을 특징으로 하는 반도체 장치.
- 인쇄 회로 기판상에 다수의 리드핀을 갖고 있는 핀-그리드 어레이 반도체 장치를 땜납으로 표면 -장착하기 위한 방법에 있어서, 나머지 리드핀들 보다 더 긴 몇개의 리드핀들을 준비하는 스텝, 더 긴 리드핀을 각각 수용하기 위한 구멍을 갖고 있는 인쇄 회로 기판을 제공하는 스텝, 땜납 페이스트를 인쇄 회로기판의 상부상에 형성된 랜드의 상부에 제공하는 스텝 더 긴 리드핀이 구멍내에 삽입되도록 인쇄 회로기판의 상부상에 반도체 장치를 배치함으로써, 인쇄 회로 기판상에 반도체 장치 를 임시로 고정하는 스텝, 및 땜납을 용융시키기 위해 리플로우 노내에서 인쇄 회로 기판과 어레이 장치의 조립체를 가열하는 스텝을 포함하는 것을 특징으로 하는 방법 .
- 인쇄회로 기판상에 다수의 리드핀들을 갖고 있는 핀 -그리드 어레이 반도체 장치를 땜납으로 표면- 장착하기 위한 방법에 있어서, 대응 리드핀을 수용하기 위해 인쇄 회로 기판의 상부상의 랜드에 접착된 다수의 안내 부재를 제공하는 스텝, 안내 부재의 상부 및 랜드의 표면에 땜납 페이스트를 제공하는 스텝, 리드핀이 대응 안내 부재내에 삽입되도록 인쇄 회로 기판상에 반도체 장치 를 배치함으로써, 인쇄 회로 기판상에 어레이 장치를 임시로 고정하는 스텝, 및 땜납을 용융시키기 위해 리플로우 노내에서 인쇄 회로 기판과 반도체 장치의 조립체를 가열하는 스텝을 포함하는 것을 특징으로 하는 방법.
- 인쇄 회로 기판 ; 및 인쇄 회로 기판상에 땜납으로 표면 -장착되고, 기판이, 이 기판상에 장착된 반도체 펠릿, 및 기판으로부터 최소한 인쇄 회로 기판의 상부 표면까지 연장되는 다수의 리드핀을 각각 갖고 있는 1개 이상의 핀 -그리드 어레이를 포함하는 전기 회로 기판에 있어서, 몇개 의 리드핀들이 나머지 리드핀들보다 길고, 인쇄 회로 기판이 더 긴 리드핀들을 각각 수용하기 위한 구멍을 갖추고 있는 것을 특징으로 하는 전기 회로기판.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63042058A JPH01217993A (ja) | 1988-02-26 | 1988-02-26 | 半導体装置 |
JP88-42058 | 1988-02-26 | ||
JP63-42058 | 1988-02-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890013760A true KR890013760A (ko) | 1989-09-25 |
KR0132714B1 KR0132714B1 (ko) | 1998-04-16 |
Family
ID=12625501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890002269A KR0132714B1 (ko) | 1988-02-26 | 1989-02-25 | 반도체 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5107329A (ko) |
JP (1) | JPH01217993A (ko) |
KR (1) | KR0132714B1 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992005583A1 (en) * | 1990-09-19 | 1992-04-02 | Fujitsu Limited | Semiconductor device having many lead pins |
US5241133A (en) * | 1990-12-21 | 1993-08-31 | Motorola, Inc. | Leadless pad array chip carrier |
JP2979930B2 (ja) * | 1993-10-28 | 1999-11-22 | 富士電機株式会社 | 電力用半導体装置のパッケージ |
US5490040A (en) * | 1993-12-22 | 1996-02-06 | International Business Machines Corporation | Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array |
US6861290B1 (en) * | 1995-12-19 | 2005-03-01 | Micron Technology, Inc. | Flip-chip adaptor package for bare die |
US5719440A (en) | 1995-12-19 | 1998-02-17 | Micron Technology, Inc. | Flip chip adaptor package for bare die |
JP3462979B2 (ja) * | 1997-12-01 | 2003-11-05 | 株式会社東芝 | 半導体装置 |
USRE43112E1 (en) | 1998-05-04 | 2012-01-17 | Round Rock Research, Llc | Stackable ball grid array package |
US6106316A (en) * | 1999-02-10 | 2000-08-22 | International Business Machines Corporation | Multistage connector for carriers with combined pin-array and pad-array |
US7087988B2 (en) * | 2002-07-30 | 2006-08-08 | Kabushiki Kaisha Toshiba | Semiconductor packaging apparatus |
DE10356885B4 (de) * | 2003-12-03 | 2005-11-03 | Schott Ag | Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement |
ATE400987T1 (de) * | 2004-09-08 | 2008-07-15 | Murata Manufacturing Co | Zusammengesetztes keramisches substrat |
KR100675007B1 (ko) * | 2006-01-27 | 2007-01-29 | 삼성전자주식회사 | 소켓을 사용하지 않는 평판형 반도체 모듈 |
JP5281346B2 (ja) * | 2008-09-18 | 2013-09-04 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
GB201120981D0 (en) * | 2011-12-07 | 2012-01-18 | Atlantic Inertial Systems Ltd | Electronic device |
US10319659B2 (en) * | 2017-10-13 | 2019-06-11 | Semiconductor Components Industries, Llc | Semiconductor package and related methods |
CN110933859A (zh) * | 2019-11-26 | 2020-03-27 | 嘉兴军胜电子科技有限公司 | 一种通过bga转接电路板纠正bga设计的方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5419360A (en) * | 1977-07-14 | 1979-02-14 | Oki Electric Ind Co Ltd | Ic case with resistors |
JPS59117139A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Ltd | 半導体装置 |
JPS59151443A (ja) * | 1983-02-17 | 1984-08-29 | Fujitsu Ltd | 半導体装置 |
JPS6034047A (ja) * | 1983-08-05 | 1985-02-21 | Nec Corp | 集積回路容器 |
JPS6224652A (ja) * | 1985-07-24 | 1987-02-02 | Hitachi Vlsi Eng Corp | 半導体装置 |
JPS62243347A (ja) * | 1986-04-16 | 1987-10-23 | Hitachi Ltd | 面付可能な電子部品 |
JPS6347961A (ja) * | 1986-08-18 | 1988-02-29 | Mitsubishi Electric Corp | 半導体パツケ−ジ |
JPS6466545A (en) * | 1987-09-08 | 1989-03-13 | Matsushita Electronics Corp | Sample for observing cross-section of semiconductor element |
-
1988
- 1988-02-26 JP JP63042058A patent/JPH01217993A/ja active Pending
-
1989
- 1989-02-25 KR KR1019890002269A patent/KR0132714B1/ko not_active IP Right Cessation
- 1989-02-27 US US07/315,608 patent/US5107329A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH01217993A (ja) | 1989-08-31 |
KR0132714B1 (ko) | 1998-04-16 |
US5107329A (en) | 1992-04-21 |
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