KR890004427A - 칩 실장장치 - Google Patents
칩 실장장치 Download PDFInfo
- Publication number
- KR890004427A KR890004427A KR1019880010689A KR880010689A KR890004427A KR 890004427 A KR890004427 A KR 890004427A KR 1019880010689 A KR1019880010689 A KR 1019880010689A KR 880010689 A KR880010689 A KR 880010689A KR 890004427 A KR890004427 A KR 890004427A
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- pushing
- expansion tape
- pin
- collet
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
- Y10T156/1983—Poking delaminating means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
내용 없음.
Description
제1도는 본 발명의 전체구성을 도시한 블록도.
제2도는 제1실시예의 작동을 도시한 단면도.
제3도는 박리센서의 작동을 도시한 단면도.
Claims (2)
- 팽창테이프에 접착된 칩을 진공흡작하는 콜리트와, 진공흡착된 상기 칩을 상기 팽창테이프의 하부면으로부터 상기 콜리트 방향으로 밀어올리는 핀과, 상기 팽창테이프를 상기 칩의 주변부로부터 하부로 끌어 내리는 하동수단과, 상기 밀어올리는 핀을 밀어올린 상태에서 상기 칩의 주변부로부터의 상기 팽창테이프의 박리 광학적으로 검지하는 박리센서를 갖추고, 상기 박리센서의 검지신호에 의하여 상기 밀어올리는 핀이 하강하도록 제어되고 있는 것을 특징으로 하는 칩 실장장치.
- 팽창테이프에 접착된 칩을 진공흡착하는 콜리트와, 진공흡착된 상기 칩을 상기 팽창테이프의 하부면으로부터 상기 콜리트 방향으로 밀어올리는 핀과, 상기 팽창테이프를 상기 칩의 주변부로부터 하부쪽으로 끌어내리는 하동수단과, 상기 밀어올리는 핀을 밀어올린 상태에서 상기 팽창테이프가 상기 밀어올리는 핀에 의하여 찢어진 것을 검지하는 박리센서를 갖추고, 상기 박리센서의 검지신호에 의하여 상기 밀어올리는 핀이 하강하도록 제어되고 있는 것을 특징으로 하는 칩 실장장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-217522 | 1987-08-31 | ||
JP62217522A JPH088292B2 (ja) | 1987-08-31 | 1987-08-31 | チップ実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890004427A true KR890004427A (ko) | 1989-04-22 |
KR910006969B1 KR910006969B1 (ko) | 1991-09-14 |
Family
ID=16705562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880010689A KR910006969B1 (ko) | 1987-08-31 | 1988-08-23 | 칩 실장장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4859269A (ko) |
EP (1) | EP0305964B1 (ko) |
JP (1) | JPH088292B2 (ko) |
KR (1) | KR910006969B1 (ko) |
AU (1) | AU601618B2 (ko) |
CA (1) | CA1297664C (ko) |
DE (1) | DE3852591T2 (ko) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY129942A (en) * | 1990-08-23 | 2007-05-31 | Siemens Ag | Method and apparatus for connecting a semiconductor chip to a carrier. |
US5217550A (en) * | 1990-09-28 | 1993-06-08 | Dai Nippon Printing Co., Ltd | Alignment transfer method |
JP2802871B2 (ja) * | 1993-03-18 | 1998-09-24 | ローム株式会社 | 半導体チップのピックアップ装置およびこれを用いる半導体チップのピックアップ方法 |
JPH0837395A (ja) * | 1994-07-21 | 1996-02-06 | Matsushita Electric Ind Co Ltd | 半導体チップ供給装置および供給方法 |
DE19515684C2 (de) * | 1995-04-28 | 2003-11-06 | Michael Geringer | Verfahren zur Vereinzelung von elektrischen Bauelementen |
JP3498877B2 (ja) | 1995-12-05 | 2004-02-23 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
US6139676A (en) * | 1997-08-14 | 2000-10-31 | Microchip Technology Incorporated | Apparatus and method for removing semiconductor chips from a diced semiconductor wafer |
DE19752582C2 (de) * | 1997-11-27 | 2000-06-21 | Inst Mikrotechnik Mainz Gmbh | Ablösevorrichtung für Mikrobauteile |
US6123800A (en) * | 1998-08-04 | 2000-09-26 | Lucent Technologies, Inc. | Method and apparatus for handling element on an adhesive film |
US6102267A (en) * | 1998-12-10 | 2000-08-15 | Lucent Technologies, Inc. | Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material |
US6204092B1 (en) * | 1999-04-13 | 2001-03-20 | Lucent Technologies, Inc. | Apparatus and method for transferring semiconductor die to a carrier |
JP2002050670A (ja) * | 2000-08-04 | 2002-02-15 | Toshiba Corp | ピックアップ装置及びピックアップ方法 |
US6889427B2 (en) * | 2002-02-15 | 2005-05-10 | Freescale Semiconductor, Inc. | Process for disengaging semiconductor die from an adhesive film |
DE10225097A1 (de) * | 2002-04-04 | 2003-10-23 | Georg Rudolf Sillner | Verfahren zum Verarbeiten von elektrischen Bauelementen, insbesondere von Halbleiterchips, sowie Vorrichtung zum Durchführen des Verfahrens |
JP2004111601A (ja) * | 2002-09-18 | 2004-04-08 | Tokyo Seimitsu Co Ltd | ダイボンダ |
DE10258800A1 (de) * | 2002-12-16 | 2004-07-08 | Siemens Ag | Verfahren und Vorrichtung zum Aufbringen einer Klebstoffschicht auf flächige Bauelemente, Bestückvorrichtung zum Bestücken von flächigen Bauelementen |
JP4624813B2 (ja) | 2005-01-21 | 2011-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体製造装置 |
US8137050B2 (en) * | 2005-09-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Pickup device and pickup method |
JP4693805B2 (ja) * | 2007-03-16 | 2011-06-01 | 株式会社東芝 | 半導体装置の製造装置及び製造方法 |
JP5176186B2 (ja) * | 2008-10-03 | 2013-04-03 | ルネサスエレクトロニクス株式会社 | 半導体チップのピックアップ方法および半導体装置の製造方法 |
US9111984B2 (en) | 2013-10-28 | 2015-08-18 | Freescale Semiconductor Inc. | Devices and methods of operation for separating semiconductor die from adhesive tape |
US9196520B1 (en) | 2014-08-01 | 2015-11-24 | Freescale Semiconductor, Inc. | Tape release systems and methods for semiconductor dies |
US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
US10340173B2 (en) * | 2016-10-11 | 2019-07-02 | Micron Technology, Inc. | System for handling semiconductor dies |
US10424553B2 (en) | 2016-10-31 | 2019-09-24 | Micron Technology, Inc. | Semiconductor devices with underfill control features, and associated systems and methods |
US10141215B2 (en) * | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
US10471545B2 (en) | 2016-11-23 | 2019-11-12 | Rohinni, LLC | Top-side laser for direct transfer of semiconductor devices |
US10062588B2 (en) | 2017-01-18 | 2018-08-28 | Rohinni, LLC | Flexible support substrate for transfer of semiconductor devices |
US10410905B1 (en) | 2018-05-12 | 2019-09-10 | Rohinni, LLC | Method and apparatus for direct transfer of multiple semiconductor devices |
JP7284328B2 (ja) * | 2018-09-19 | 2023-05-30 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
JP7038640B2 (ja) * | 2018-10-26 | 2022-03-18 | 信越化学工業株式会社 | ペリクルの剥離方法及びペリクルの剥離装置 |
US20220059406A1 (en) * | 2020-08-21 | 2022-02-24 | Advanced Semiconductor Engineering, Inc. | Method for manufacturing semiconductor package |
CN115547895B (zh) * | 2022-11-24 | 2023-03-10 | 深圳新控半导体技术有限公司 | 一种芯片粘贴工装 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4372802A (en) * | 1980-06-02 | 1983-02-08 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on printed circuit boards |
JPS5833893A (ja) * | 1981-08-24 | 1983-02-28 | ティーディーケイ株式会社 | チップ状電子部品装着機 |
US4502910A (en) * | 1983-10-17 | 1985-03-05 | Njm, Inc. | Literature applying mechanism |
US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
US4556362A (en) * | 1983-12-21 | 1985-12-03 | At&T Technologies, Inc. | Methods of and apparatus for handling semiconductor devices |
US4472218A (en) * | 1983-12-23 | 1984-09-18 | At&T Technologies, Inc. | Removing articles from an adhesive web |
JPS6337352A (ja) * | 1986-07-31 | 1988-02-18 | Somar Corp | 薄膜剥離装置 |
-
1987
- 1987-08-31 JP JP62217522A patent/JPH088292B2/ja not_active Expired - Lifetime
-
1988
- 1988-08-23 KR KR1019880010689A patent/KR910006969B1/ko not_active IP Right Cessation
- 1988-08-29 CA CA000575918A patent/CA1297664C/en not_active Expired - Fee Related
- 1988-08-29 US US07/237,755 patent/US4859269A/en not_active Expired - Fee Related
- 1988-08-29 AU AU21651/88A patent/AU601618B2/en not_active Ceased
- 1988-08-30 DE DE3852591T patent/DE3852591T2/de not_active Expired - Fee Related
- 1988-08-30 EP EP88114124A patent/EP0305964B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3852591T2 (de) | 1995-06-01 |
EP0305964A3 (en) | 1991-04-10 |
AU601618B2 (en) | 1990-09-13 |
JPS6459929A (en) | 1989-03-07 |
AU2165188A (en) | 1989-03-02 |
US4859269A (en) | 1989-08-22 |
DE3852591D1 (de) | 1995-02-09 |
CA1297664C (en) | 1992-03-24 |
KR910006969B1 (ko) | 1991-09-14 |
EP0305964B1 (en) | 1994-12-28 |
JPH088292B2 (ja) | 1996-01-29 |
EP0305964A2 (en) | 1989-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19950905 Year of fee payment: 5 |
|
LAPS | Lapse due to unpaid annual fee |