KR890003018A - 칩실장 장치 - Google Patents
칩실장 장치 Download PDFInfo
- Publication number
- KR890003018A KR890003018A KR1019880008217A KR880008217A KR890003018A KR 890003018 A KR890003018 A KR 890003018A KR 1019880008217 A KR1019880008217 A KR 1019880008217A KR 880008217 A KR880008217 A KR 880008217A KR 890003018 A KR890003018 A KR 890003018A
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- pushing
- stage
- mount device
- chip mount
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 실시예에 관한 칩실장 장치의 일부 파단 측면도. 제 2 도는 위치결정시의 패턴을 도시한 도면.
Claims (1)
- 밀어올리는 스테이지에 지지되고 칩고정 테이프상의 칩을 밀어올리는 핀과, 밀어올려진 칩을 진공흡착에 의하여 픽업하는 콜리트와, 상기 칩고정테이프 상의 칩의 중심부를 상기 밀어올리는 핀의 선단부와 일치시키기 위하여 상기 밀어올리는 스테이지에 대한 칩의 위치를 패턴인식에 의해서 검지하는 모니터수단과, 상기 밀어올리는 스테이지로부터 출사되어서 상기 모니터수단에 입사하도록 광을 발생함으로써 당해 밀어올리는 스테이지에 대한 칩의 외형을 상기 모니터수단에 비추는 광원을 갖춘 것을 특징으로 하는 칩실장 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62171616A JPS6415000A (en) | 1987-07-09 | 1987-07-09 | Chip packaging device |
| JP62-171616 | 1987-07-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR890003018A true KR890003018A (ko) | 1989-04-12 |
| KR910006372B1 KR910006372B1 (ko) | 1991-08-21 |
Family
ID=15926473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019880008217A KR910006372B1 (ko) | 1987-07-09 | 1988-07-02 | 칩실장장치 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS6415000A (ko) |
| KR (1) | KR910006372B1 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2800396B2 (ja) * | 1990-10-09 | 1998-09-21 | 松下電器産業株式会社 | チップの観察装置 |
| JP2010045296A (ja) * | 2008-08-18 | 2010-02-25 | Ueno Seiki Kk | 突上げ装置の突上げステージ |
| JP2012508460A (ja) * | 2008-11-12 | 2012-04-05 | エセック アーゲー | フォイルからの半導体チップの剥離及び取外し方法 |
| JP5596929B2 (ja) * | 2009-02-12 | 2014-09-24 | 富士機械製造株式会社 | 突き上げピンの位置決め方法およびその方法を用いた電子部品供給装置 |
-
1987
- 1987-07-09 JP JP62171616A patent/JPS6415000A/ja active Pending
-
1988
- 1988-07-02 KR KR1019880008217A patent/KR910006372B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR910006372B1 (ko) | 1991-08-21 |
| JPS6415000A (en) | 1989-01-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| G160 | Decision to publish patent application | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 19950818 Year of fee payment: 5 |
|
| LAPS | Lapse due to unpaid annual fee |