KR880011269A - 에폭시 수지조성물 - Google Patents

에폭시 수지조성물 Download PDF

Info

Publication number
KR880011269A
KR880011269A KR1019880002704A KR880002704A KR880011269A KR 880011269 A KR880011269 A KR 880011269A KR 1019880002704 A KR1019880002704 A KR 1019880002704A KR 880002704 A KR880002704 A KR 880002704A KR 880011269 A KR880011269 A KR 880011269A
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
group
atom
integer
Prior art date
Application number
KR1019880002704A
Other languages
English (en)
Other versions
KR920009738B1 (ko
Inventor
도시오 시오하라
가즈또시 도미요시
Original Assignee
고사까 유따로
신에쓰 가가꾸고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고사까 유따로, 신에쓰 가가꾸고오교 가부시끼가이샤 filed Critical 고사까 유따로
Publication of KR880011269A publication Critical patent/KR880011269A/ko
Application granted granted Critical
Publication of KR920009738B1 publication Critical patent/KR920009738B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용없음

Description

에폭시 수지조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 휨양을 측정하기 위해 사용한 반도체 장치의 개략사시도,
제2도는 휨이 발생한 반도체 장치의 단면도.

Claims (2)

  1. 경화성 에폭시수지와 경화제를 함유하고, 또한 하기 일반식(1)
    (식중, R1은 수소원자, -CH2CH-CH2또는 알케닐기를 함유하는 1가 유기긱를 나타내고, R2는 탄소수 1-10의 서로 동일하거나 또는 상이한 1가 탄화수소기를 나타내고, X는 할로겐원자를 나타내며, 1은 1 또는 2의 정수이고, m 및 n은 각가 0-2의 정수를 나타내고, 1+m+n≤5임)으로 표시되는 트리페놀알칸형 수지 또는 그의 중합체와 하기 일반식(2)
    (식중, R3은 수소원자, 할로겐원자, 히드록시기, 알콕시기 또느 치환 1가 탄화수소기를 나타내고, R4는 서로 동일하거나 또는 상이한 1가 유기기를 나타내며, 0.001≤a≤2, 1≤b≤3, 1.001≤a+b≤3임)으로 표시되는 오르가노폴리실록산과의 반응에 의해 얻어진 블록 공중합체를 함유해서 되는 것을 특징으로 하는 에폭시수지 조성물.
  2. 제1항에 있어서, 블록 공중합체의 함유량이 경화성 에폭시 수지와 경화제의 합계량 100중량 부당 1-100중량부인 에폭시 수지조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880002704A 1987-03-16 1988-03-15 에폭시 수지 조성물 KR920009738B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62061631A JPH0617458B2 (ja) 1987-03-16 1987-03-16 エポキシ樹脂組成物
JP62-61631 1987-03-16

Publications (2)

Publication Number Publication Date
KR880011269A true KR880011269A (ko) 1988-10-27
KR920009738B1 KR920009738B1 (ko) 1992-10-22

Family

ID=13176731

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880002704A KR920009738B1 (ko) 1987-03-16 1988-03-15 에폭시 수지 조성물

Country Status (6)

Country Link
US (1) US4859722A (ko)
EP (1) EP0282977B1 (ko)
JP (1) JPH0617458B2 (ko)
KR (1) KR920009738B1 (ko)
CN (1) CN1014796B (ko)
DE (1) DE3889950T2 (ko)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0662735B2 (ja) * 1989-02-07 1994-08-17 住友ベークライト株式会社 エポキシ樹脂組成物
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
JPH0362844A (ja) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
US5034445A (en) * 1989-05-26 1991-07-23 Genesee Polymers Corporation Stabilized polysiloxane fluids and a process for making same
US5034446A (en) * 1989-05-26 1991-07-23 Genesee Polymers Corporation Stabilized polysiloxane fluids and a process for making the same
US5102960A (en) * 1989-09-11 1992-04-07 Bayer Aktiengesellschaft Silicon-epoxy resin composition
JP2576701B2 (ja) * 1990-01-25 1997-01-29 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
US5284938A (en) * 1990-02-27 1994-02-08 Shell Oil Company Polysiloxane modified thermoset compositions
US5037898A (en) * 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
JP2966463B2 (ja) * 1990-03-27 1999-10-25 信越化学工業株式会社 硬化性樹脂組成物
JPH0747622B2 (ja) * 1990-11-30 1995-05-24 信越化学工業株式会社 エポキシ樹脂組成物及びその硬化物
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
US5529847A (en) * 1992-06-10 1996-06-25 Eastman Kodak Company Cured epoxy polysiloxane coated articles useful in toner fusing members
US5952439A (en) * 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JP3147677B2 (ja) * 1994-09-30 2001-03-19 株式会社村田製作所 液状エポキシ樹脂組成物
JPH08157561A (ja) * 1994-12-01 1996-06-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
US5609889A (en) * 1995-05-26 1997-03-11 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
US5652463A (en) * 1995-05-26 1997-07-29 Hestia Technologies, Inc. Transfer modlded electronic package having a passage means
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
DE19523897C2 (de) * 1995-06-30 2002-10-24 Bosch Gmbh Robert Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile
US5689137A (en) * 1995-10-16 1997-11-18 Hestia Technologies, Inc. Method for transfer molding standard electronic packages and apparatus formed thereby
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US6038136A (en) * 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US6324069B1 (en) 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
US6128195A (en) * 1997-11-18 2000-10-03 Hestia Technologies, Inc. Transfer molded PCMCIA standard cards
DE69922577T2 (de) * 1998-05-07 2005-12-01 Shin-Etsu Chemical Co., Ltd. Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
US6107370A (en) * 1999-01-04 2000-08-22 Aegis Coating Technologies Single pack siliconized epoxy coating
US6444489B1 (en) 2000-12-15 2002-09-03 Charles W. C. Lin Semiconductor chip assembly with bumped molded substrate
US6486549B1 (en) 2001-11-10 2002-11-26 Bridge Semiconductor Corporation Semiconductor module with encapsulant base
US6706405B2 (en) 2002-02-11 2004-03-16 Analytical Services & Materials, Inc. Composite coating for imparting particel erosion resistance
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
DE102005060860A1 (de) * 2005-12-20 2007-06-28 Robert Bosch Gmbh Elektronikkomponente mit Vergussmasse
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2009043914A (ja) * 2007-08-08 2009-02-26 Ishida Yukio 配線板の製造法および配線板
CN101696263B (zh) * 2009-10-29 2012-12-05 复旦大学 一种环氧树脂固化剂及其制备方法和应用
JP6026095B2 (ja) * 2011-10-31 2016-11-16 太陽インキ製造株式会社 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板
WO2014042491A1 (ko) * 2012-09-17 2014-03-20 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3407169A (en) * 1965-02-25 1968-10-22 Navy Usa Heat resistant adhesive
US4394496A (en) * 1971-08-19 1983-07-19 The Dow Chemical Company Epoxidation products of 1,1,1-tri-(hydroxyphenyl) alkanes
US4022753A (en) * 1974-03-25 1977-05-10 Ciba-Geigy Corporation Reaction products of polysiloxanes and polyphenols
JPS6056171B2 (ja) * 1980-03-17 1985-12-09 信越化学工業株式会社 エポキシ樹脂組成物
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS58198526A (ja) * 1982-05-17 1983-11-18 Mitsubishi Gas Chem Co Inc 耐熱性エポキシ樹脂組成物
JPS59129251A (ja) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd エポキシ樹脂成形材料
US4720515A (en) * 1985-05-17 1988-01-19 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS61285270A (ja) * 1985-06-12 1986-12-16 Shin Etsu Chem Co Ltd 表面被覆剤

Also Published As

Publication number Publication date
JPS63227621A (ja) 1988-09-21
JPH0617458B2 (ja) 1994-03-09
DE3889950T2 (de) 1995-01-12
KR920009738B1 (ko) 1992-10-22
CN1014796B (zh) 1991-11-20
EP0282977A2 (en) 1988-09-21
EP0282977A3 (en) 1989-07-26
CN88101396A (zh) 1988-10-05
US4859722A (en) 1989-08-22
EP0282977B1 (en) 1994-06-08
DE3889950D1 (de) 1994-07-14

Similar Documents

Publication Publication Date Title
KR880011269A (ko) 에폭시 수지조성물
KR920021648A (ko) 에폭시 수지 조성물 및 반도체 장치
KR870004099A (ko) 실리콘 조성물
KR910003024A (ko) 경화성 실리콘 고무 조성물 및 그 경화물
KR870000481A (ko) 섬유 처리제
KR920007795A (ko) 실리콘 고무적층체 및 그의 제조방법
KR870011321A (ko) 합성섬유용 처리제
KR920018142A (ko) 에폭시 수지 조성물 및 반도체 장치
KR900007967A (ko) 실리콘 고무 조성물
KR860007330A (ko) 열경화성 수지 조성물
KR880002949A (ko) 이형 필름용 실리콘 조성물
KR880000517A (ko) 실온 경화성 오르가노실록산 조성물
KR910020116A (ko) 실리콘고무 조성물 및 그의 경화물
KR910000896A (ko) 성형가능한 혼련된 수지 조성물
KR880006322A (ko) 실리콘 고무 조성물
KR890016659A (ko) 반도체를 봉해서 막기위한 에폭시 수지조성물
KR870010124A (ko) 이형 필름용 실리콘 조성물
KR910020146A (ko) 접착성 조성물 및 그의 경화물
KR910014459A (ko) 에폭시 수지 조성물 및 반도체 장치
KR890000586A (ko) 에폭시 수지 조성물
KR930002434A (ko) 내열성이 향상된 반도체소자 밀봉용 수지 조성물
KR920012302A (ko) 일 액형 열 경화성 오르가노폴리실록산 조성물
KR920008157A (ko) 표면-처리제 및 표면-처리된 epdm 제품
KR900006448A (ko) 반도체 칩의 내부 피막용 수지 조성물
KR890017315A (ko) 경화성 폴리오르가노 실록산 조성물

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20061011

Year of fee payment: 15

LAPS Lapse due to unpaid annual fee