KR890000586A - 에폭시 수지 조성물 - Google Patents

에폭시 수지 조성물 Download PDF

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Publication number
KR890000586A
KR890000586A KR1019880006609A KR880006609A KR890000586A KR 890000586 A KR890000586 A KR 890000586A KR 1019880006609 A KR1019880006609 A KR 1019880006609A KR 880006609 A KR880006609 A KR 880006609A KR 890000586 A KR890000586 A KR 890000586A
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
oligomer
monomer
molecule
Prior art date
Application number
KR1019880006609A
Other languages
English (en)
Other versions
KR930003510B1 (ko
Inventor
구니오 이또
도시오 시오하라
Original Assignee
원본미기재
신에쓰 가가꾸 고오교 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 원본미기재, 신에쓰 가가꾸 고오교 가부시끼 가이샤 filed Critical 원본미기재
Publication of KR890000586A publication Critical patent/KR890000586A/ko
Application granted granted Critical
Publication of KR930003510B1 publication Critical patent/KR930003510B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/922—Polyepoxide polymer having been reacted to yield terminal ethylenic unsaturation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 에폭시 수지, 경화제 및 방향족계 폴리머와 1분자 중에 1개 이상의 불소 원자를 함유하는 모노머, 올리고머 또는 폴리머를 반응시킴으로써 얻어진 변성 폴리머를 함유하는 것을 특징으로 하는 에폭시 수지 조성물.
  2. 제1항에 있어서, 1분자 중에 1개 이상의 불소 원자를 함유하는 모노머, 올리고머 또는 폴리머로서 양말단 반응성 올리고머(단, 식중 n은 3이상의 수임)를 사용한 에폭시 수지 조성물.
  3. 제1항에 있어서, 1분자 중에 1개 이상의 불소 원자를 함유하는 모노머, 올리고머 또는 폴리머로서 양말단 반응성 올리고머(단, 식중, Rf는 퍼플로로알킬렌 또는 퍼플로로알킬렌에테르이고, R은 알킬기, 페닐기, 비닐기, 트리플로로프로필기 등의 각종 탄화수소기이고, n은 1이상의 수임)을 사용한 에폭시 수지 조성물.
  4. 제1항내지 제3항중 어느 하나의 항에 있어서, 변성 폴리머의 배합량이 에폭시 수지와 경화제의 합계량 100중량부에 대해서 1-100중량부 범위인 에폭시 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880006609A 1987-06-03 1988-06-02 에폭시 수지 조성물 KR930003510B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP139447 1987-06-03
JP62139447A JPH0618985B2 (ja) 1987-06-03 1987-06-03 エポキシ樹脂組成物
JP62-139447 1987-06-03

Publications (2)

Publication Number Publication Date
KR890000586A true KR890000586A (ko) 1989-03-15
KR930003510B1 KR930003510B1 (ko) 1993-05-01

Family

ID=15245417

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880006609A KR930003510B1 (ko) 1987-06-03 1988-06-02 에폭시 수지 조성물

Country Status (5)

Country Link
US (1) US4876298A (ko)
EP (1) EP0293843B1 (ko)
JP (1) JPH0618985B2 (ko)
KR (1) KR930003510B1 (ko)
DE (1) DE3886587T2 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781098B2 (ja) * 1986-12-05 1995-08-30 ソマール株式会社 熱硬化性エポキシ樹脂粉体塗料
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
US5260376A (en) * 1989-03-03 1993-11-09 Kansai Paint Company, Limited Resin composition, curable composition and coating composition
JP2787326B2 (ja) * 1989-03-03 1998-08-13 関西ペイント株式会社 硬化性組成物
JPH03157448A (ja) * 1989-11-15 1991-07-05 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
JP3478669B2 (ja) * 1995-06-13 2003-12-15 キヤノン株式会社 溶剤易溶性のフッ素含有エポキシ樹脂組成物およびそれを用いた表面処理方法
JP3489369B2 (ja) * 1997-01-31 2004-01-19 松下電器産業株式会社 ゴキブリ忌避剤含有電子部品材料を用いた電子部品
FR2867183B1 (fr) * 2004-03-04 2007-09-14 Cit Alcatel Revetement de fibre de faible indice de refraction
WO2008146681A1 (ja) * 2007-05-23 2008-12-04 Dic Corporation 含フッ素ノボラック型樹脂、フッ素系界面活性剤、フッ素系界面活性剤組成物および樹脂組成物
WO2011140402A2 (en) 2010-05-05 2011-11-10 Tyco Electronics Services Gmbh Potting for electronic components
JP6583669B2 (ja) * 2015-08-03 2019-10-02 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL280258A (ko) * 1961-09-07
JPS6056171B2 (ja) * 1980-03-17 1985-12-09 信越化学工業株式会社 エポキシ樹脂組成物
JPS56163120A (en) * 1980-05-21 1981-12-15 Hitachi Ltd Epoxy resin composition
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS59149921A (ja) * 1983-02-16 1984-08-28 Nippon Telegr & Teleph Corp <Ntt> フイ−ドスル−用樹脂封止材
US4720515A (en) * 1985-05-17 1988-01-19 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS61287967A (ja) * 1985-06-14 1986-12-18 Asahi Glass Co Ltd 樹脂付着防止剤
JPS6241218A (ja) * 1985-08-19 1987-02-23 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
JPS62101625A (ja) * 1985-10-29 1987-05-12 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
JPS62106922A (ja) * 1985-11-06 1987-05-18 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH072888B2 (ja) * 1986-05-27 1995-01-18 旭硝子株式会社 エポキシ樹脂組成物
JPS6357632A (ja) * 1986-08-29 1988-03-12 Hitachi Ltd エポキシ樹脂組成物、半導体装置用封止剤及び積層板用材料
IT1199770B (it) * 1986-12-16 1988-12-30 Ausimont Spa Resine epossidiche ottenute mediante coreticolazione di prepolimeri epossidici fluorurati e prepolimeri epossidici non fluorurati
JPS63183917A (ja) * 1987-01-26 1988-07-29 Denki Kagaku Kogyo Kk エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS63304021A (ja) 1988-12-12
DE3886587D1 (de) 1994-02-10
DE3886587T2 (de) 1994-07-21
EP0293843A2 (en) 1988-12-07
US4876298A (en) 1989-10-24
JPH0618985B2 (ja) 1994-03-16
KR930003510B1 (ko) 1993-05-01
EP0293843B1 (en) 1993-12-29
EP0293843A3 (en) 1989-09-20

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