KR880001058A - 헤테로 접합형 바이폴러트랜지스터의 제조방법 - Google Patents

헤테로 접합형 바이폴러트랜지스터의 제조방법 Download PDF

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Publication number
KR880001058A
KR880001058A KR870002718A KR870002718A KR880001058A KR 880001058 A KR880001058 A KR 880001058A KR 870002718 A KR870002718 A KR 870002718A KR 870002718 A KR870002718 A KR 870002718A KR 880001058 A KR880001058 A KR 880001058A
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KR
South Korea
Prior art keywords
manufacturing
bipolar transistor
heterojunction bipolar
region
base region
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Application number
KR870002718A
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English (en)
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KR950011018B1 (ko
Inventor
히로지 가와이
Original Assignee
오가 노리오
소니 가부시키가이샤
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Application filed by 오가 노리오, 소니 가부시키가이샤 filed Critical 오가 노리오
Publication of KR880001058A publication Critical patent/KR880001058A/ko
Application granted granted Critical
Publication of KR950011018B1 publication Critical patent/KR950011018B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/6631Bipolar junction transistors [BJT] with an active layer made of a group 13/15 material
    • H01L29/66318Heterojunction transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41708Emitter or collector electrodes for bipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • H01L29/737Hetero-junction transistors
    • H01L29/7371Vertical transistors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/011Bipolar transistors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)

Abstract

내용 없음

Description

헤테로 접합형 바이폴러트랜지스터의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도A 내지 H는 실시예의 공정도. 제2도는 다른 실시예의 단면도.

Claims (1)

  1. 화합물반도체기판위에 콜랙터영역, 베이스영역, 이미터영역을 차례로 형성하여 이루어진 헤테로 접합형 바이폴러트랜지스터의 제조방법에 있어서, 상기 베이스영역의 전극취출영역에 형성한 오목부내에서, 또한 상기 베이스영역 위에 접하여 상기 이미터영역을 에피택셜성장으로 형성하는 것을 특징으로 하는 헤테로접합형 바이폴러트랜지스터의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870002718A 1986-06-26 1987-03-25 헤테로접합형 바이폴라트랜지스터의 제조방법 KR950011018B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61150497A JPH0797589B2 (ja) 1986-06-26 1986-06-26 ヘテロ接合型バイポ−ラトランジスタの製造方法
JP86-150497 1986-06-26
JP150497 1986-06-26

Publications (2)

Publication Number Publication Date
KR880001058A true KR880001058A (ko) 1988-03-31
KR950011018B1 KR950011018B1 (ko) 1995-09-27

Family

ID=15498155

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870002718A KR950011018B1 (ko) 1986-06-26 1987-03-25 헤테로접합형 바이폴라트랜지스터의 제조방법

Country Status (3)

Country Link
US (1) US4751195A (ko)
JP (1) JPH0797589B2 (ko)
KR (1) KR950011018B1 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604828B1 (fr) * 1986-10-06 1988-12-23 Centre Nat Rech Scient Procede de fabrication d'une diode p+nn+ et d'un transistor bipolaire comportant cette diode, utilisant l'effet de neutralisation des atomes donneurs par l'hydrogene atomique
US5063427A (en) * 1987-10-13 1991-11-05 Northrop Corporation Planar bipolar transistors including heterojunction transistors
US4839303A (en) * 1987-10-13 1989-06-13 Northrop Corporation Planar bipolar transistors including heterojunction transistors and method
JP2526626B2 (ja) * 1988-03-14 1996-08-21 日本電気株式会社 ヘテロ接合バイポ―ラ・トランジスタおよびその製造方法
JPH01238161A (ja) * 1988-03-18 1989-09-22 Fujitsu Ltd 半導体装置及びその製造方法
EP0387010A3 (en) * 1989-03-08 1990-10-10 Matsushita Electric Industrial Co., Ltd. Hetero-junction bipolar transistor
US5028549A (en) * 1989-04-10 1991-07-02 Rockwell International Etched back edge isolation process for heterojunction bipolar transistors
JPH02280340A (ja) * 1989-04-21 1990-11-16 Hitachi Ltd 半導体集積回路装置の製造方法
US5227317A (en) * 1989-04-21 1993-07-13 Hitachi, Ltd. Method of manufacturing semiconductor integrated circuit bipolar transistor device
JP2793837B2 (ja) * 1989-05-10 1998-09-03 株式会社日立製作所 半導体装置の製造方法およびヘテロ接合バイポーラトランジスタ
US5340755A (en) * 1989-09-08 1994-08-23 Siemens Aktiegensellschaft Method of making planar heterobipolar transistor having trenched isolation of the collector terminal
US4914049A (en) * 1989-10-16 1990-04-03 Motorola, Inc. Method of fabricating a heterojunction bipolar transistor
US5053346A (en) * 1990-01-12 1991-10-01 Texas Instruments Incorporated Method for making a high speed gallium arsenide transistor
US5027182A (en) * 1990-10-11 1991-06-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration High-gain AlGaAs/GaAs double heterojunction Darlington phototransistors for optical neural networks
US5171697A (en) * 1991-06-28 1992-12-15 Texas Instruments Incorporated Method of forming multiple layer collector structure for bipolar transistors
EP0562272A3 (en) * 1992-03-23 1994-05-25 Texas Instruments Inc Microwave heterojunction bipolar transistors with emitters designed for high power applications and method for fabricating same
US5365089A (en) * 1992-12-23 1994-11-15 International Business Machines Corporation Double heterojunction bipolar transistor and the method of manufacture therefor
US5436181A (en) * 1994-04-18 1995-07-25 Texas Instruments Incorporated Method of self aligning an emitter contact in a heterojunction bipolar transistor
US5939738A (en) * 1995-10-25 1999-08-17 Texas Instruments Incorporated Low base-resistance bipolar transistor
JP2868083B2 (ja) * 1996-12-02 1999-03-10 日本電気株式会社 半導体デバイスの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6174367A (ja) * 1984-09-20 1986-04-16 Matsushita Electric Ind Co Ltd ヘテロ接合バイポ−ラトランジスタ
JPS61112373A (ja) * 1984-11-07 1986-05-30 Matsushita Electric Ind Co Ltd ヘテロ接合バイポ−ラトランジスタ

Also Published As

Publication number Publication date
KR950011018B1 (ko) 1995-09-27
JPH0797589B2 (ja) 1995-10-18
JPS636877A (ja) 1988-01-12
US4751195A (en) 1988-06-14

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