KR20160070243A - Heat-discharging sheet - Google Patents
Heat-discharging sheet Download PDFInfo
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- KR20160070243A KR20160070243A KR1020140175807A KR20140175807A KR20160070243A KR 20160070243 A KR20160070243 A KR 20160070243A KR 1020140175807 A KR1020140175807 A KR 1020140175807A KR 20140175807 A KR20140175807 A KR 20140175807A KR 20160070243 A KR20160070243 A KR 20160070243A
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- heat
- layer
- thermal conductivity
- shielding sheet
- thermally conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
The present invention relates to a heat radiation sheet applied to a display device, and provides a heat radiation sheet that efficiently dissipates heat generated in a display device.
As the amount of heat generated by PDP (Plasma Display Pannel), LCD (Liquid Crystal Dispalys), OLED (Organic Light Emitting Diode) and LED (Light Emitting Diode) used in the field of electronic display increases due to high voltage discharge structure, Which is an important factor in the stability and quality characteristics of the device.
For example, when the maximum allowable operating temperature of the PDP glass panel is 90 ° C or less and the temperature difference between the fluorescent region and the non-fluorescent region is 10 ° C or more, cracks are generated in the PDP glass panel, and the PDP using the plasma light source generates high voltage / . In addition, in the case of a PDP, if the heat radiation cooling is non-uniform over the entire surface, the image is locally refracted and distorted, which degrades the display quality characteristic.
Furthermore, the PDP in which a slim thin type structure is implemented has a weaker environment in the heat dissipation structure due to the narrow structure than the previous cathode screen display device, and a fan is used as a cooling device of the PDP. However, In addition, there is a problem such as noise, weight increase, and power consumption, and therefore, there is a need for a heat-radiating sheet capable of spreading heat quickly and uniformly in recent years.
One embodiment of the present invention provides a heat-radiating sheet in which a heat source in a display device, that is, heat transmitted from a heat-radiating object, spreads uniformly and is effectively emitted.
In one embodiment of the present invention, the heat dissipation adhesive layer includes an insulating layer, a metal thin film layer, a heat dissipation layer, and a heat dissipation adhesive layer. The heat dissipation adhesive layer includes an acrylic adhesive resin and a thermally conductive filler. The heat dissipation layer includes a thermally conductive carbon structure And a heat-radiating sheet.
The insulating layer may be attached to a heat dissipation target of the display device through a thermal interface material (TIM).
The heat-dissipating adhesive layer may be attached to a back cover of a display device.
The adhesive shear force between the heat-radiating adhesive layer and the back cover may be 5 kgf / m 2 to 15 kgf / m 2.
The insulating layer and the heat dissipation layer may have anisotropic thermal conductivity.
The insulating layer and the heat dissipation layer may have a horizontal thermal conductivity greater than a vertical thermal conductivity.
The horizontal thermal conductivity of the insulating layer and the heat dissipation layer may be between 60 W / mK and 320 W / mK, and the vertical thermal conductivity may be between 3 W / mK and 15 W / mK.
The metal thin film layer may have isotropic thermal conductivity.
The vertical thermal conductivity of the metal thin film layer may be 210 W / mK to 380 W / mK.
The thermally conductive adhesive layer may contain 30 to 50 parts by weight of the thermally conductive filler per 100 parts by weight of the acrylic adhesive resin.
The thermally conductive filler of the heat-radiating adhesive layer may be at least one selected from the group consisting of nickel, aluminum nitride, boron nitride, carbon nanotube (CNT), graphite, aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, Magnesium, silicon oxide, and combinations thereof.
The thermally conductive carbon structure of the heat dissipation layer may be a carbon nanotube (CNT), a graphite, a graphene, a diamond, a fullerene, a carbon black, ≪ / RTI >
The surface of the thermally conductive carbon structure of the heat dissipation layer may be doped with a metal.
Wherein the insulating layer comprises a binder resin including a polyester resin, a rubber resin, or a silicone resin; And one thermally conductive filler selected from the group consisting of aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, aluminum nitride, boron nitride, silicon nitride, aluminum hydroxide, magnesium hydroxide, silicon oxide, and combinations thereof.
The insulating layer may include 40 to 60 parts by weight of the thermally conductive filler per 100 parts by weight of the binder resin.
The metal thin film layer may include aluminum (Al) or copper (Cu).
The thickness of the heat-radiating sheet may be 0.05 mm to 0.3 mm.
The heat-radiating sheet effectively disperses and emits the transferred heat so that heat is not concentrated in a specific area of the display device. In addition, the lifetime of the display device can be prolonged.
1 is a cross-sectional view of a heat-radiating sheet according to an embodiment of the present invention.
2 is a view showing a heat conduction mechanism for each layer of a heat-radiating sheet according to an embodiment of the present invention.
3 is a schematic view of a display device to which the heat-radiating sheet is applied.
Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.
In one embodiment of the present invention, the heat dissipation adhesive layer includes an insulating layer, a metal thin film layer, a heat dissipation layer, and a heat dissipation adhesive layer. The heat dissipation adhesive layer includes an acrylic adhesive resin and a thermally conductive filler. The heat dissipation layer includes a thermally conductive carbon structure And a heat-radiating sheet.
In recent years, energy consumption of a power supply unit (PSU) has increased due to the large-sized display device and multimedia functions, and heat generation due to high-performance operation has been a problem. Particularly, heat generation of a heat source located in a specific area in the display device causes local heat durability degradation or shortens the product life.
As a method for solving this problem, an air tunnel is designed on the rear surface of the display device or a metal plate having excellent thermal conductivity is attached to the rear space. However, as the display devices have been slimmed, the rear space has almost disappeared, There was a limit in that the metal plate alone could not solve the heat concentration. In addition, there is a limitation that the heat of the high temperature which is intensively discharged from the PSU can not be rapidly dispersed and emitted by only the thin metal plate.
Accordingly, the heat-radiating sheet according to the present invention includes a structure in which specific layers are laminated and secures excellent thermal conductivity and thermal diffusivity between the interior of the respective layers and between them, The effect of heat-resistant durability can be simultaneously given.
1 schematically shows a cross-section of a heat-radiating sheet according to an embodiment of the present invention. 1, the heat-radiating
The
Specifically, the heat-dissipating adhesive layer may include an acrylic adhesive resin and a thermally conductive filler, thereby securing adhesiveness and excellent thermal conductivity at the same time. In addition, the heat dissipation layer includes a thermally conductive carbon structure and may have a property of excellent thermal conductivity in the horizontal direction.
3 is a schematic view of a display device to which the heat-radiating
At this time, the
Referring to FIG. 3, the heat-radiating sheet may be mounted so that the heat-radiating
The back cover is a cover positioned under the display device including a PDP (Plasma Display Pannel), an LCD (Liquid Crystal Dispalys), an OLED (Organic Light Emitting Diode), an LED (Light Emitting Diode) , Is present at the outermost portion of the display device, and may have a curved surface or a planar shape.
Since the heat-dissipating adhesive layer is attached to the back cover of the display device, the heat transmitted from the insulating layer through the respective layers can be uniformly dispersed in the heat-dissipating adhesive layer and effectively discharged to the outside.
The adhesive shear force of the heat-radiating adhesive layer and the back cover may be about 5 kgf / m 2 to about 15 kgf / m 2. If the adhesive shear force is less than about 5 kgf / m < 2 >, the adhesiveness of the heat radiation adhesive layer is deteriorated, and heat transfer may not be effectively discharged to the outside.
The adhesive shear force refers to a force acting on two parallel surfaces approaching to each other in the same size but acting in the opposite direction. In the state that the heat-radiating adhesive layer and the back cover are attached, the heat- Means the force necessary to separate and act on an external force that is the same but opposite in direction. Specifically, the adhesive shearing force is a value measured by using an Instron equipment, with the mounting surface of the heat radiation adhesive layer and the back cover being provided in a size of 25 mm x 25 mm (width x length).
In order to improve the thermal conductivity of the heat-radiating
In addition, the insulating layer and the heat dissipation layer may have a horizontal thermal conductivity greater than a vertical thermal conductivity. The 'horizontal' direction means a direction parallel to the upper surface of the layer of the heat radiation sheet, and the 'vertical' direction means a direction perpendicular to the horizontal direction . Since the insulating layer and the heat dissipation layer have a horizontal thermal conductivity higher than the vertical thermal conductivity, the heat-radiating sheet can secure uniform thermal conductivity as a whole and effectively prevent thermal durability deterioration due to a local heat- .
Specifically, the horizontal thermal conductivity of the insulating layer and the heat dissipation layer may be about 60 W / mK to about 320 W / mK, and the vertical thermal conductivity may be about 3 W / mK to about 15 W / mK. The horizontal thermal conductivity and the vertical thermal conductivity of the insulating layer and the heat dissipation layer satisfy the ranges, respectively, so that the heat generated from the heat source having the heat dissipation sheet locally can be uniformly dispersed in a short time.
Referring to FIG. 1, the heat-radiating
The metal
In this case, the vertical thermal conductivity of the metal thin film layer may be about 210 W / mK to about 380 W / mK. 1, the metal
FIG. 2 illustrates a heat conduction mechanism for each layer of the heat-radiating sheet according to an embodiment of the present invention. 2, the insulating
The insulating
As a result, the insulating layer and the heat dissipation layer have anisotropic thermal conductivity, and the metal thin layer has isotropic thermal conductivity, so that the uniformity and distribution of heat conduction in the slim space can be improved through the heat dissipation sheet , It is possible to simultaneously impart an excellent heat-resistant durability and a slimming effect to a display device including the same.
The insulating
Specifically, the insulating layer may include a polyester resin, a rubber resin, or a silicone resin as the binder resin, and may include a thermally conductive filler dispersed in the binder resin.
Specifically, the thermally conductive filler may include one selected from the group consisting of aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, aluminum nitride, boron nitride, silicon nitride, aluminum hydroxide, magnesium hydroxide, silicon oxide, have.
The insulating layer is a layer closest to the heat-dissipating object, and when the heat-dissipating material includes the heat-conductive filler, the heat-dissipating material may exhibit anisotropic thermal conductivity when heat is generated. For example, the insulating layer may use aluminum nitride or boron nitride as the thermally conductive filler. In this case, the anisotropic thermal conductivity is maximized, and the excellent thermal conductivity in the horizontal direction can be ensured.
The insulating layer may be formed by coating a paste in which the thermally conductive filler is dispersed in the binder resin by using a comma coater or a rotary screen coater and casting or roll lamination The thermally conductive filler can be made to lie in the horizontal direction. More specifically, the thermally conductive filler can be laid down by heating and pressing at a temperature higher than the glass transition temperature (Tg) of the binder resin. Since the insulating layer is manufactured by this method, the horizontal thermal conductivity by the thermally conductive filler can be remarkably improved.
The insulating layer may include about 40 parts by weight to about 60 parts by weight of the thermally conductive filler per 100 parts by weight of the binder. If the content of the thermally conductive filler is more than about 60 parts by weight, a crack may be generated in the insulating layer, resulting in a short circuit in a printed circuit board (PCB) When the amount is less than 40 parts by weight, the required thermal conductivity may not be secured.
In other words, by including the thermally conductive filler in the above-described range in the content of the insulating layer, it is possible to obtain an effect of improving the thermal conductivity at the same time without causing electricity, and cracks do not occur even on a curved surface with a radius of curvature of 120 cm The effect can be easily realized.
The thickness of the insulating layer may be about 40 탆 to about 80 탆. By maintaining the thickness of the insulating layer in the above range, it exhibits excellent insulating properties and can be excellent in crack preventing performance. In addition, by maintaining the thickness of the insulating layer within the above range, it is possible to secure an excellent short-circuiting effect when contacting the printed circuit board (PCB).
The heat-dissipating
The acrylic adhesive resin may include a polymer or copolymer of a (meth) acrylate monomer in order to ensure good adhesion with the back cover. Specifically, the (meth) acrylate-based monomer may be an acrylate or methacrylate having an alkyl group having 1 to 12 carbon atoms.
The acrylic pressure-sensitive adhesive resin may be at least one selected from the group consisting of ethyl acrylate, propyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, isooctyl acrylate, decyl acrylate, decyl methacrylate, dodecyl methacrylate, Or a combination thereof. In this case, the heat-radiating adhesive layer can ensure excellent flexibility and processability of the heat-radiating sheet.
The thermally conductive filler of the heat-radiating adhesive layer may be at least one selected from the group consisting of nickel, aluminum nitride, boron nitride, carbon nanotube (CNT), graphite, aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, , Magnesium hydroxide, silicon oxide, and combinations thereof. By using aluminum nitride or boron nitride having excellent thermal conductivity, the heat-resistant adhesive layer can secure both good adhesiveness and thermal conductivity .
The thermally conductive adhesive layer may include about 30 parts by weight to about 50 parts by weight of the thermally conductive filler per 100 parts by weight of the acrylic adhesive resin. When the content of the thermally conductive filler is less than about 30 parts by weight, the thermal conductivity is lowered. When the heat-radiating adhesive layer adheres to the back cover, heat is difficult to release. When the content is more than about 50 parts by weight, There is a problem that the air layer having a low thermal conductivity is increased and the heat radiation effect is lowered.
That is, since the thermally conductive filler is included in the above-mentioned range, it is possible to secure an appropriate interfacial adhesion with the back cover, and at the same time, the air layer having a low thermal conductivity is reduced to be attached to the back cover, Can be easily implemented.
Also, the thickness of the heat-dissipating adhesive layer may be about 5 탆 to 10 탆. By maintaining the thickness of the heat-dissipating adhesive layer in the above-described range, excellent adhesion can be maintained when attached to the back cover, and the heat release effect through the back cover can be improved at the same time.
As described above, the insulating layer and the heat-dissipating layer may have anisotropic thermal conductivity in transferring the heat transferred from the heat-dissipating object. 'Anisotropic' means that the physical properties of an object have different properties depending on the direction and means that the heat generated from the heat-dissipating object has different thermal conductivity depending on the direction when the heat is transmitted through the insulating layer and the heat-dissipating layer.
As described above, the insulating layer may be made of a thermally conductive filler such as aluminum nitride or boron nitride, and may have a high horizontal thermal conductivity compared to the vertical thermal conductivity due to the physical structure of the thermally conductive filler.
The heat dissipation layer may include a thermally conductive carbon structure, as described above. Specifically, the thermally conductive carbon structure may include a carbon nanotube (CNT), graphite, graphene, diamond diamond, fullerene, carbon black, and combinations thereof.
For example, the heat dissipation layer may include a carbon nanotube (CNT) or a graphene. In this case, it may be advantageous to secure anisotropic thermal conductivity.
In addition, the thermally conductive carbon structure of the heat dissipation layer may be doped with metal. By chemically doping the surface of the thermally conductive carbon structure with a metal, the contact resistance of the thermally conductive carbon structure having a higher thermal conductivity than that of the metal is lowered, thereby lowering the electrical conductivity and increasing the thermal conductivity. The thermal conductivity can be maximized.
For example, the heat dissipation layer may include carbon nanotubes or graphenes doped with metal on the surface. In this case, the heat dissipation layer may be advantageous in ensuring adequate thermal conductivity in terms of directionality.
Specifically, the heat dissipation layer may be formed by forming a paste in which the thermally conductive carbon structure is dispersed in a binder resin of the same kind as the insulation layer, coating the paste with a comma coater or a rotary screen coater, The thermally conductive carbon structure can be made to lie in the horizontal direction by performing casting or roll lamination, thereby effectively improving the horizontal heat conductivity of the heat dissipation layer.
The thickness of the heat dissipation layer may be about 25 탆 to about 100 탆. By limiting the thickness of the heat dissipation layer to the above range, it is advantageous to increase the thermal conductivity in the horizontal direction, and the effect of uniform thermal distribution can be easily ensured. When the thickness of the heat dissipation layer is less than about 25 mu m, the horizontal thermal conductivity is not increased. When the thickness of the heat dissipation layer is more than about 100 mu m, the vertical thermal conductivity may be too large and heat may not escape to the outside of the display device.
The metal thin film layer has isotropic thermal conductivity in transmitting heat transmitted from the heat dissipation target, and may specifically include aluminum (Al) or copper (Cu). Specifically, the thin metal layer may be a thin plate including pure aluminum (1000 series) or aluminum-manganese (Al-Mn) alloy (3000 series).
The thickness of the metal thin film layer may be about 50 탆 to about 200 탆. When the thickness of the metal thin film layer is less than about 50 탆, the heat is not sufficiently transmitted in the vertical direction, and the heat radiation effect is deteriorated. It may be difficult to secure the tensile strength to prevent tearing during the coating or lamination process. In addition, when the thickness of the metal thin film layer is more than about 200 mu m, the flexibility may be lowered.
The thickness of the heat-radiating sheet may be about 0.05 mm to about 0.3 mm. The heat-radiating sheet includes a laminate structure of an insulating layer, a metal thin film layer, a heat-radiating layer, and a heat-radiating adhesive layer. By keeping the thickness of the heat-radiating sheet including all the layers in the above range, It is possible to effectively spread the transmitted heat in a slim space. In addition, by maintaining the thickness of the heat radiation sheet within the above range, it is possible to improve the uniformity of heat distribution, thereby improving the heat durability of the display device and extending service life.
Further, the heat-radiating sheet can be applied to a display device having a slim and flexible structure and a flexible display device such as a mobile phone, and it is possible to efficiently distribute the local heat generated by the high integration to a wide area, Can not be concentrated. In addition, it can be bent and adhered to the rear surface of the product with flexibility and workability suitable for being applied to a product having bending, and in this case, the effect of heat conduction and distribution can be further improved.
Hereinafter, specific embodiments of the present invention will be described. However, the embodiments described below are only intended to illustrate or explain the present invention, and thus the present invention should not be limited thereto.
<
Example
And
Comparative Example
>
Example One
An insulating layer containing 60 parts by weight of aluminum nitride and having a thickness of 60 占 퐉 and an aluminum metal foil having a thickness of 150 占 퐉 on the insulating layer were laminated to 100 parts by weight of the polyester resin to form a metal thin film layer. Thereafter, a heat dissipation layer having a thickness of 58 占 퐉 was formed on the upper part of the metal thin film layer, and the upper part of the heat dissipation layer was coated with 50 parts by weight of boron nitride And a heat radiation adhesive layer having a thickness of 15 탆 was formed. The heat-radiating sheet may be mounted in the display device such that the insulating layer is attached to the heat-radiating object (PSU) through a heat transfer material (TIM) containing boron nitride (BN).
Comparative Example One
A pressure-sensitive adhesive layer having a thickness of 20 占 퐉 was formed on top of a graphite layer having a thickness of 480 占 퐉, a pressure-sensitive adhesive layer having a thickness of 12 占 퐉 was formed on the bottom of the graphite, Terephthalate (PET) film was laminated to produce a heat radiation sheet having a laminated structure of PET-pressure-sensitive adhesive layer-graphite-pressure-sensitive adhesive layer-PET. The heat-radiating sheet may be mounted in a display device such that a PET film formed on a pressure-sensitive adhesive layer having a thickness of 12 占 퐉 is adhered to a heat radiation object (PSU).
Comparative Example 2
A copper (Cu) sheet layer having a thickness of 150 占 퐉 was laminated on top of a 50 占 퐉 -thick polyethylene terephthalate (PE) film layer doped with 10% by weight of graphite, and a 12 占 퐉 thick adhesive A heat-radiating sheet having a layer was produced. Specifically, the polyethylene (PE) film layer was prepared using a twin screw extruder, and after lamination of the copper sheet with the heat of 120 ° C, the acrylic adhesive Was coated with a comma coater. The heat-radiating sheet may be mounted in the display so that the pressure-sensitive adhesive layer is attached to the back cover.
<Evaluation>
Experimental Example
:
Heat-radiating sheet
Thermal properties
1) Measurement of thermal conductivity
The vertical heat conductivity and the horizontal thermal conductivity of NETZSCH LFA447 (at 25 DEG C) were measured for the heat radiation sheets of the examples and the comparative examples, and the results are shown in Table 1 below.
2) Measurement of insulation resistance
In the heat-radiating sheet of the embodiments and the comparative example, the layer positioned on the power supply unit (PSU) side, which is a heat dissipation object when mounted in a display device, is referred to as a bottom and a layer positioned on the back cover side Top ". At this time, the top and bottom insulation resistances of the heat-radiating sheets of the examples and the comparative examples were measured through an insulation resistance meter (Fluke-1577), and the results are shown in Table 1 below. Specifically, an external voltage of 500 V was applied to the uppermost and lowermost portions of the heat-radiating sheet to measure how much leakage current occurred after one minute, and the insulation resistance was measured by the average resistance value obtained from the result.
- Back cover side
- PSU side
Referring to Table 1, it can be seen that both the horizontal thermal conductivity and the vertical thermal conductivity of the heat-radiating sheet of Example 1 were higher than those of the display device equipped with the heat-radiating sheet of Comparative Example 1. [ The heat radiation sheet of the first embodiment includes a laminated structure of an insulation layer, a metal thin film layer, a heat radiation layer and a heat radiation adhesive layer. In transmitting heat generated in the display device, the heat radiation sheet having isotropic thermal conductivity and anisotropic thermal conductivity Layers are alternately stacked to improve the overall horizontal thermal conductivity and vertical thermal conductivity of the heat-radiating sheet.
Referring to Table 1, in the case of Example 1, the lowest insulation resistance, that is, the insulation resistance on the side where the insulation layer was present, was high, and the insulation resistance at the top, that is, It can be seen that the resistance is low. On the other hand, in the case of Comparative Example 1, the insulation resistance at the lowermost portion and the uppermost portion was high.
In general, when a heat-radiating sheet is mounted on a display device, a portion close to a printed circuit board (PCB) located in a power supply unit (PSU) has a high electrical conductivity, a short-circuit phenomenon or the like may occur. Therefore, this portion must secure insulation. On the other hand, a portion close to the back cover of the display device does not cause any particular problem when the electrical conductivity is high, and can be a proof of the characteristic of high thermal conductivity.
The lowermost portion of the heat radiation sheet of Example 1 and Comparative Example 1 is a portion close to a printed circuit board (PCB) located in the power supply unit (PSU), and as shown in Table 1, all of them are excellent in insulation.
That is, the heat-radiating sheet of the first embodiment has the insulation property of the lowest level near the printed circuit board (PCB) located in the power supply unit (PSU) As shown in Fig. On the other hand, in the heat-radiating sheet of Comparative Example 1, the lowermost portion in the vicinity of the printed circuit board (PCB) is high in insulating property due to the PET film, but has poor heat conductivity and therefore has little ability to emit heat in a short time. 1 < / RTI >
In addition, the heat radiation sheet of Example 1 exhibited a lower insulation resistance than the PET film on the uppermost side of Comparative Example 1, the uppermost heat radiation adhesive layer in the vicinity of the back cover exhibited excellent thermal conductivity, , And it can be seen that the heat radiating effect to the outside is excellent when the results of the above-described measurement of the thermal conductivity are further referred to.
In the heat-radiating sheet of Comparative Example 2, the lowermost polyethylene (PE) film in the vicinity of the printed circuit board (PCB) located in the power supply unit (PSU) was not high in resistance as compared with the lowermost insulating layer in Example 1, It can be seen that the effect of preventing the short phenomenon is lower than that of Example 1. [
In addition, the heat radiation sheet of Comparative Example 2 showed lower horizontal thermal conductivity and vertical thermal conductivity than the heat radiation sheet of Example 1, and it was found that the heat radiation effect was poor even though the thickness was thinner.
100: Heat-radiating sheet
10: Insulation layer
20: metal thin film layer
30: heat sink layer
40: Heat-resisting adhesive layer
Claims (17)
Wherein the heat-radiating adhesive layer comprises an acrylic adhesive resin and a thermally conductive filler,
Wherein the heat dissipation layer comprises a thermally conductive carbon structure
Heat-shielding sheet.
The insulating layer is attached to a heat dissipation target of the display device through a thermal interface material (TIM)
Heat-shielding sheet.
The heat-dissipating adhesive layer is attached to a back cover of a display device
Heat-shielding sheet.
The adhesive shear force between the heat-radiating adhesive layer and the back cover is preferably 5 kgf / m 2 to 15 kgf /
Heat-shielding sheet.
Wherein the insulating layer and the heat dissipation layer have anisotropic thermal conductivity
Heat-shielding sheet.
Wherein the insulating layer and the heat dissipation layer have a horizontal thermal conductivity greater than a vertical thermal conductivity
Heat-shielding sheet.
The horizontal thermal conductivity of the insulating layer and the heat dissipation layer is 60 W / mK to 320 W / mK, and the vertical thermal conductivity is 3 W / mK to 15 W / mK
Heat-shielding sheet.
Wherein the metal thin film layer has an isotropic thermal conductivity
Heat-shielding sheet.
Wherein the metal thin film layer has a vertical thermal conductivity of 210 W / mK to 380 W / mK
Heat-shielding sheet.
Wherein the thermally conductive adhesive layer contains 30 to 50 parts by weight of the thermally conductive filler per 100 parts by weight of the acrylic adhesive resin
Heat-shielding sheet.
The thermally conductive filler of the heat-radiating adhesive layer may be at least one selected from the group consisting of nickel, aluminum nitride, boron nitride, carbon nanotube (CNT), graphite, aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, Magnesium, silicon oxide, and combinations thereof.
Heat-shielding sheet.
The thermally conductive carbon structure of the heat dissipation layer may be a carbon nanotube (CNT), a graphite, a graphene, a diamond, a fullerene, a carbon black, ≪ RTI ID = 0.0 >
Heat-shielding sheet.
The thermally conductive carbon structural body of the heat dissipation layer has a surface-doped
Heat-shielding sheet.
Wherein the insulating layer comprises a binder resin including a polyester resin, a rubber resin, or a silicone resin; And a thermally conductive filler comprising one selected from the group consisting of aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, aluminum nitride, boron nitride, silicon nitride, aluminum hydroxide, magnesium hydroxide, silicon oxide and combinations thereof
Heat-shielding sheet.
Wherein the insulating layer contains 40 to 60 parts by weight of the thermally conductive filler per 100 parts by weight of the binder resin
Heat-shielding sheet.
Wherein the metal thin film layer comprises aluminum (Al) or copper (Cu)
Heat-shielding sheet.
The thickness of the heat-radiating sheet is preferably 0.05 mm to 0.3 mm
Heat-shielding sheet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140175807A KR20160070243A (en) | 2014-12-09 | 2014-12-09 | Heat-discharging sheet |
| PCT/KR2015/013452 WO2016093617A1 (en) | 2014-12-09 | 2015-12-09 | Heat radiation sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140175807A KR20160070243A (en) | 2014-12-09 | 2014-12-09 | Heat-discharging sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20160070243A true KR20160070243A (en) | 2016-06-20 |
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ID=56107725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140175807A KR20160070243A (en) | 2014-12-09 | 2014-12-09 | Heat-discharging sheet |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20160070243A (en) |
| WO (1) | WO2016093617A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20180002047A (en) * | 2016-06-28 | 2018-01-05 | 주식회사 티지오테크 | Back sheet, producing method of back sheet and foldable display including the same |
| KR20190009203A (en) * | 2017-07-18 | 2019-01-28 | 엘지전자 주식회사 | Display device |
| KR20190081879A (en) * | 2017-12-29 | 2019-07-09 | 엘지디스플레이 주식회사 | Display apparatus |
| KR20200009063A (en) * | 2018-03-27 | 2020-01-29 | 보에 테크놀로지 그룹 컴퍼니 리미티드 | Heat dissipation device for display panel, manufacturing method thereof, and display device |
| KR20200055189A (en) * | 2018-11-12 | 2020-05-21 | 주식회사 대현에스티 | The manufacturing method for heat radiation adhesive and heat radiation tape with excellent in-plane thermal conductivity comprising the same |
| KR20220090912A (en) * | 2020-12-23 | 2022-06-30 | 상하이 재셩 뉴 매터리얼 테크놀러지 씨오., 엘티디. | Heat radiating sheet and tape comprising adhesive · bonding layer |
| US11700716B2 (en) | 2021-03-30 | 2023-07-11 | Samsung Display Co., Ltd. | Display device |
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| JP5140302B2 (en) * | 2007-03-29 | 2013-02-06 | ポリマテック株式会社 | Thermally conductive sheet |
| KR101223858B1 (en) * | 2011-02-16 | 2013-01-17 | 이무균 | Thermel conductive and emitting sheet |
| KR20140093457A (en) * | 2013-01-18 | 2014-07-28 | 엘지전자 주식회사 | Heat discharging sheet |
| KR101458832B1 (en) * | 2013-02-19 | 2014-11-10 | (주)창성 | A composite film of copper layers with insulation layers and conductive adhesion layers and method of fabricating the same. |
| KR20140128158A (en) * | 2013-04-26 | 2014-11-05 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Heat dissipation sheet |
-
2014
- 2014-12-09 KR KR1020140175807A patent/KR20160070243A/en not_active Application Discontinuation
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2015
- 2015-12-09 WO PCT/KR2015/013452 patent/WO2016093617A1/en active Application Filing
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| KR20180002047A (en) * | 2016-06-28 | 2018-01-05 | 주식회사 티지오테크 | Back sheet, producing method of back sheet and foldable display including the same |
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| KR20190081879A (en) * | 2017-12-29 | 2019-07-09 | 엘지디스플레이 주식회사 | Display apparatus |
| KR20200009063A (en) * | 2018-03-27 | 2020-01-29 | 보에 테크놀로지 그룹 컴퍼니 리미티드 | Heat dissipation device for display panel, manufacturing method thereof, and display device |
| US11224149B2 (en) | 2018-03-27 | 2022-01-11 | Boe Technology Group Co., Ltd. | Heat dissipating device for display panel, manufacturing method thereof and display device |
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| US11923264B2 (en) | 2019-09-20 | 2024-03-05 | Samsung Electronics Co., Ltd. | Semiconductor apparatus for discharging heat |
| KR20220090912A (en) * | 2020-12-23 | 2022-06-30 | 상하이 재셩 뉴 매터리얼 테크놀러지 씨오., 엘티디. | Heat radiating sheet and tape comprising adhesive · bonding layer |
| US11700716B2 (en) | 2021-03-30 | 2023-07-11 | Samsung Display Co., Ltd. | Display device |
| KR102591403B1 (en) * | 2022-09-19 | 2023-10-20 | (주)비스타글로벌 | composite heat-radiation hybrid sheet |
| KR102577478B1 (en) * | 2022-10-28 | 2023-09-13 | 이홍섭 | coposite heat-radiation hybrid TIM sheet |
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